Global Epoxy Molding Compound for Power Device Supply, Demand and Key Producers, 2023-2029

Global Epoxy Molding Compound for Power Device Supply, Demand and Key Producers, 2023-2029

The global Epoxy Molding Compound for Power Device market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

Here are some key features and advantages of epoxy molding compound for power devices:

Electrical Insulation: EMC has excellent electrical insulation properties, which help prevent electrical shorts and ensure proper functioning of the power devices.

Thermal Conductivity: Epoxy molding compounds can be formulated with additives to enhance their thermal conductivity. This helps dissipate heat generated by the power devices, ensuring their efficient operation and preventing overheating.

Mechanical Strength: EMC provides mechanical support to the delicate components inside the power devices, protecting them from physical stresses and mechanical shocks.

Chemical Resistance: Epoxy molding compounds exhibit good resistance to various chemicals and solvents, providing protection against corrosive substances that could potentially damage the power devices.

Moisture and Environmental Protection: EMC offers a high level of moisture and environmental protection, shielding the internal components of the power devices from moisture, dust, and other contaminants.

Adhesion and Bonding: Epoxy molding compounds have good adhesion properties, allowing them to bond well with different substrates and provide a secure encapsulation for the power devices.

Processability: EMC can be easily molded and processed into different shapes and sizes, making it suitable for mass production in the semiconductor industry.



Epoxy Molding Compound (EMC) for power devices is a type of material used to encapsulate and protect power electronic devices. It is commonly used in the semiconductor industry for packaging high-power devices such as power transistors, diodes, and integrated circuits. The epoxy molding compound provides electrical insulation, mechanical support, and environmental protection to the power devices.

This report studies the global Epoxy Molding Compound for Power Device production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Epoxy Molding Compound for Power Device, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Epoxy Molding Compound for Power Device that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Epoxy Molding Compound for Power Device total production and demand, 2018-2029, (Tons)

Global Epoxy Molding Compound for Power Device total production value, 2018-2029, (USD Million)

Global Epoxy Molding Compound for Power Device production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (Tons)

Global Epoxy Molding Compound for Power Device consumption by region & country, CAGR, 2018-2029 & (Tons)

U.S. VS China: Epoxy Molding Compound for Power Device domestic production, consumption, key domestic manufacturers and share

Global Epoxy Molding Compound for Power Device production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (Tons)

Global Epoxy Molding Compound for Power Device production by Type, production, value, CAGR, 2018-2029, (USD Million) & (Tons)

Global Epoxy Molding Compound for Power Device production by Application production, value, CAGR, 2018-2029, (USD Million) & (Tons).

This reports profiles key players in the global Epoxy Molding Compound for Power Device market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Sumitomo Bakelite, Showa Denko, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Eternal Materials and Jiangsu zhongpeng new material, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Epoxy Molding Compound for Power Device market.

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Tons) and average price (US$/Ton) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Epoxy Molding Compound for Power Device Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Epoxy Molding Compound for Power Device Market, Segmentation by Type
SC
SOT
TO
Other

Global Epoxy Molding Compound for Power Device Market, Segmentation by Application
Automotive
Consumer Electronics
Industrial
Other

Companies Profiled:
Sumitomo Bakelite
Showa Denko
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Nagase ChemteX Corporation
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material

Key Questions Answered

1. How big is the global Epoxy Molding Compound for Power Device market?

2. What is the demand of the global Epoxy Molding Compound for Power Device market?

3. What is the year over year growth of the global Epoxy Molding Compound for Power Device market?

4. What is the production and production value of the global Epoxy Molding Compound for Power Device market?

5. Who are the key producers in the global Epoxy Molding Compound for Power Device market?

6. What are the growth factors driving the market demand?