Global Epoxy Molding Compound for Power Device Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

Global Epoxy Molding Compound for Power Device Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

According to our (Global Info Research) latest study, the global Epoxy Molding Compound for Power Device market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Here are some key features and advantages of epoxy molding compound for power devices:

Electrical Insulation: EMC has excellent electrical insulation properties, which help prevent electrical shorts and ensure proper functioning of the power devices.

Thermal Conductivity: Epoxy molding compounds can be formulated with additives to enhance their thermal conductivity. This helps dissipate heat generated by the power devices, ensuring their efficient operation and preventing overheating.

Mechanical Strength: EMC provides mechanical support to the delicate components inside the power devices, protecting them from physical stresses and mechanical shocks.

Chemical Resistance: Epoxy molding compounds exhibit good resistance to various chemicals and solvents, providing protection against corrosive substances that could potentially damage the power devices.

Moisture and Environmental Protection: EMC offers a high level of moisture and environmental protection, shielding the internal components of the power devices from moisture, dust, and other contaminants.

Adhesion and Bonding: Epoxy molding compounds have good adhesion properties, allowing them to bond well with different substrates and provide a secure encapsulation for the power devices.

Processability: EMC can be easily molded and processed into different shapes and sizes, making it suitable for mass production in the semiconductor industry.



Epoxy Molding Compound (EMC) for power devices is a type of material used to encapsulate and protect power electronic devices. It is commonly used in the semiconductor industry for packaging high-power devices such as power transistors, diodes, and integrated circuits. The epoxy molding compound provides electrical insulation, mechanical support, and environmental protection to the power devices.

This report is a detailed and comprehensive analysis for global Epoxy Molding Compound for Power Device market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.

Key Features:

Global Epoxy Molding Compound for Power Device market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029

Global Epoxy Molding Compound for Power Device market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029

Global Epoxy Molding Compound for Power Device market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029

Global Epoxy Molding Compound for Power Device market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2018-2023.

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Epoxy Molding Compound for Power Device

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace.

This report profiles key players in the global Epoxy Molding Compound for Power Device market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Sumitomo Bakelite, Showa Denko, Chang Chun Group, Hysol Huawei Electronics and Panasonic, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Market Segmentation

Epoxy Molding Compound for Power Device market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
SC
SOT
TO
Other

Market segment by Application
Automotive
Consumer Electronics
Industrial
Other

Major players covered
Sumitomo Bakelite
Showa Denko
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Nagase ChemteX Corporation
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Epoxy Molding Compound for Power Device product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Epoxy Molding Compound for Power Device, with price, sales, revenue and global market share of Epoxy Molding Compound for Power Device from 2018 to 2023.

Chapter 3, the Epoxy Molding Compound for Power Device competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Epoxy Molding Compound for Power Device breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Epoxy Molding Compound for Power Device market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.

Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.

Chapter 13, the key raw materials and key suppliers, and industry chain of Epoxy Molding Compound for Power Device.

Chapter 14 and 15, to describe Epoxy Molding Compound for Power Device sales channel, distributors, customers, research findings and conclusion.