Global Electronics Adhesive Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Electronics Adhesive Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

According to our (Global Info Research) latest study, the global Electronics Adhesive market size was valued at USD 7346 million in 2023 and is forecast to a readjusted size of USD 12080 million by 2030 with a CAGR of 7.4% during review period.

Electronics Adhesive refers to the adhesive for electronic application.

Electronics innovation touches nearly every facet of our lives. such as hybrid vehicles, mobile electronic devices, medical applications, digital cameras, computers, defense telecommunications, and augmented reality headsets, touch nearly every part of our lives. Electronics adhesives are a crucial part of assembling these components, with a range of different adhesive technologies available to address specific application needs.

Adhesives provide a strong bond while protecting components against the damaging effects of excessive vibration, heat, moisture, corrosion, mechanical shock, and extreme environmental conditions. They also offer thermal and electrically conductive properties, as well as UV curing abilities.

As a result, electronics adhesives have successfully replaced many traditional soldering systems. Typical applications where these adhesives can be used in electronics assembly include masking before conformal coating, heat sinks, electric motor applications, potting fiber optic cable connections, and encapsulation.

In the global electronics adhesives market, the main companies are Shinetsu, Henkel, Dow Inc and Mitsubishi Chemical. The top 5 companies hold a share of more than 28%. The main regions are Asia Pacific and Europe, with a market share of more than 77%.

The Global Info Research report includes an overview of the development of the Electronics Adhesive industry chain, the market status of Surface Mounting (Electrically Conductive Adhesives, Thermally Conductive Adhesives), Conformal Coatings (Electrically Conductive Adhesives, Thermally Conductive Adhesives), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Electronics Adhesive.

Regionally, the report analyzes the Electronics Adhesive markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Electronics Adhesive market, with robust domestic demand, supportive policies, and a strong manufacturing base.

Key Features:

The report presents comprehensive understanding of the Electronics Adhesive market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Electronics Adhesive industry.

The report involves analyzing the market at a macro level:

Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K MT), revenue generated, and market share of different by Type (e.g., Electrically Conductive Adhesives, Thermally Conductive Adhesives).

Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Electronics Adhesive market.

Regional Analysis: The report involves examining the Electronics Adhesive market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.

Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Electronics Adhesive market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.

The report also involves a more granular approach to Electronics Adhesive:

Company Analysis: Report covers individual Electronics Adhesive manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.

Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Electronics Adhesive This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Surface Mounting, Conformal Coatings).

Technology Analysis: Report covers specific technologies relevant to Electronics Adhesive. It assesses the current state, advancements, and potential future developments in Electronics Adhesive areas.

Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Electronics Adhesive market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.

Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.

Market Segmentation

Electronics Adhesive market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type
Electrically Conductive Adhesives
Thermally Conductive Adhesives
UV Curing Adhesives
Other

Market segment by Application
Surface Mounting
Conformal Coatings
Potting and Encapsulation
Other

Major players covered
3M
Cyberbond
DowDuPont
Super Glue
H.B. Fuller
Henkel
Hexion
Huntsman
ITW Performance Polymers
Jowat
LORD Corp
Mactac
Mapei
DELO Industrial Adhesives
Avery Dennison
Benson Polymers
BUHNEN (Germany)
Master Bond
Drytac
Dymax
Pidilite Industries
Royal Adhesives and Sealants
Sika AG

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Electronics Adhesive product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Electronics Adhesive, with price, sales, revenue and global market share of Electronics Adhesive from 2019 to 2024.

Chapter 3, the Electronics Adhesive competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Electronics Adhesive breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Electronics Adhesive market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Electronics Adhesive.

Chapter 14 and 15, to describe Electronics Adhesive sales channel, distributors, customers, research findings and conclusion.