Global Electronic Potting & Encapsulating Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Electronic Potting & Encapsulating market size was valued at US$ 2043 million in 2024 and is forecast to a readjusted size of USD 3730 million by 2031 with a CAGR of 9.1% during review period.

Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.

Henkel, Dow Corning and Hitachi Chemical are the top 3 players of Electronic Potting & Encapsulating, with about 50% market shares.

This report is a detailed and comprehensive analysis for global Electronic Potting & Encapsulating market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Electronic Potting & Encapsulating market size and forecasts, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031

Global Electronic Potting & Encapsulating market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031

Global Electronic Potting & Encapsulating market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031

Global Electronic Potting & Encapsulating market shares of main players, shipments in revenue ($ Million), sales quantity (K MT), and ASP (USD/MT), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Electronic Potting & Encapsulating

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Electronic Potting & Encapsulating market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Dow Corning, Hitachi Chemical, LORD Corporation, Huntsman Corporation, ITW Engineered Polymers, 3M, H.B. Fuller, John C. Dolph, Master Bond, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Electronic Potting & Encapsulating market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Silicones
Epoxy
Polyurethane
Others

Market segment by Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others

Major players covered
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Electronic Potting & Encapsulating product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Electronic Potting & Encapsulating, with price, sales quantity, revenue, and global market share of Electronic Potting & Encapsulating from 2020 to 2025.

Chapter 3, the Electronic Potting & Encapsulating competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Electronic Potting & Encapsulating breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Electronic Potting & Encapsulating market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Electronic Potting & Encapsulating.

Chapter 14 and 15, to describe Electronic Potting & Encapsulating sales channel, distributors, customers, research findings and conclusion.