Global Electronic Package Metal Heat Sink Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Electronic Package Metal Heat Sink Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

According to our (Global Info Research) latest study, the global Electronic Package Metal Heat Sink market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.

The development of metal packaging materials has gone through 4 generations. The first generation is a low expansion coefficient alloy represented by Invar and Kovar alloys, and the thermal conductivity of the alloy is only 11-17W/(m•K). The second generation is a composite material represented by copper-tungsten (Cu-W) and Cu-molybdenum (Mo) materials, reaching about 200W / (m • K) and a thermal expansion coefficient of about 7.0×10-6/K. Good overall performance is the main material of choice for power chip packaging. The third generation is a lightweight, low-expansion composite material represented by aluminum (Al)/Sip and Al/SiCp. The thermal conductivity of Al/Sip material is only about 120~150W / (m•K), although the thermal conductivity is low , But the overall performance of workability, air tightness, weldability, etc. is good, and it is widely used in the production of RF power device packaging shells, and the thermal conductivity of Al/SiCp materials can reach 220 W / (m • K), and at the same time The density is controlled at about 3.0 g/cm3. Although the processing is difficult, the good thermal conductivity also makes it widely used as a shell material or chip heat sink material. The fourth generation is a high thermal conductivity, low expansion composite material represented by Dia/Cu, diamond/aluminum (Dia/Al), etc., which are designed to have a thermal expansion coefficient of 6×10-6~7×10-6/K, With a thermal conductivity of 550~650W / (m • K), it can be used on the 2nd and 3rd generation semiconductor chip devices and used for heat sink packaging of high-power devices to help the devices solve heat dissipation problems and achieve stable operation.

The Global Info Research report includes an overview of the development of the Electronic Package Metal Heat Sink industry chain, the market status of Semiconductor Laser (Cu/Diamond, Al/SiCp), Microwave Power Device (Cu/Diamond, Al/SiCp), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Electronic Package Metal Heat Sink.

Regionally, the report analyzes the Electronic Package Metal Heat Sink markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Electronic Package Metal Heat Sink market, with robust domestic demand, supportive policies, and a strong manufacturing base.

Key Features:

The report presents comprehensive understanding of the Electronic Package Metal Heat Sink market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Electronic Package Metal Heat Sink industry.

The report involves analyzing the market at a macro level:

Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K MT), revenue generated, and market share of different by Type (e.g., Cu/Diamond, Al/SiCp).

Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Electronic Package Metal Heat Sink market.

Regional Analysis: The report involves examining the Electronic Package Metal Heat Sink market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.

Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Electronic Package Metal Heat Sink market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.

The report also involves a more granular approach to Electronic Package Metal Heat Sink:

Company Analysis: Report covers individual Electronic Package Metal Heat Sink manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.

Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Electronic Package Metal Heat Sink This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Semiconductor Laser, Microwave Power Device).

Technology Analysis: Report covers specific technologies relevant to Electronic Package Metal Heat Sink. It assesses the current state, advancements, and potential future developments in Electronic Package Metal Heat Sink areas.

Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Electronic Package Metal Heat Sink market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.

Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.

Market Segmentation

Electronic Package Metal Heat Sink market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type
Cu/Diamond
Al/SiCp
Al/Sip (Al30Si70)
Cu-Mo (Cu30Mo70)
Cu-W (Cu20W80)
Others

Market segment by Application
Semiconductor Laser
Microwave Power Device
Semiconductor Lighting Device

Major players covered
Rogers Germany
Tecnisco
Heat Sinks Tungsten Molybdenum Science and Technology
Chengdu Eigen Material Technology
Luoyang Wochi
Citizen Electronics
HOSO Metal
AMETEK Metals Wallingford
Hermetic Solutions
Element Six
Xinlong Metal Electrical

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Electronic Package Metal Heat Sink product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Electronic Package Metal Heat Sink, with price, sales, revenue and global market share of Electronic Package Metal Heat Sink from 2019 to 2024.

Chapter 3, the Electronic Package Metal Heat Sink competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Electronic Package Metal Heat Sink breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Electronic Package Metal Heat Sink market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Electronic Package Metal Heat Sink.

Chapter 14 and 15, to describe Electronic Package Metal Heat Sink sales channel, distributors, customers, research findings and conclusion.