Global Dry Etching Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

Global Dry Etching Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Dry Etching Equipment market size was valued at US$ 12070 million in 2024 and is forecast to a readjusted size of USD 18510 million by 2031 with a CAGR of 6.2% during review period.

Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.

Currently, global production of Dry Etching Equipment is concentrated. The top three manufacturers held 92.16% of the market, in terms of Dry Etching Equipment sales value in 2019. As for the region, APAC is the largest consumption region, holding 76.07% sales revenue market share in 2019, followed by North America, with 13% market share.

With the continuous reduction of integrated circuit process, especially the production of 7nm-28nm advanced process, the demand for dry etching equipment continues to increase. Since DUV lithography machines are limited by the wavelength of light, wafer fabs need to adopt multiple mask processes and use etching processes to achieve smaller sizes. The etching process required for 7nm integrated circuit production is 140 times, which is 2.5 times the 40 times required for 28nm production.

Etching equipment accounts for the highest proportion in the global semiconductor equipment market.

Global competition:

The global etching equipment market presents a highly concentrated competition pattern, with international giants such as Lam Research, Applied Materials, and Tokyo Electron occupying a dominant position. These companies have advanced technology and rich customer resources and have strong competitiveness in the global market.

Chinese competition:

In the Chinese market, local companies such as AMEC and North Huachuang have strong competitiveness in the field of etching machines and have become leading companies in the domestic etching machine industry. These companies continue to increase R&D investment, improve product performance and technical level, and actively seize market share.

Technological progress:

With the continuous advancement of semiconductor technology, the line width of integrated circuits continues to decrease, and the requirements for etching equipment are getting higher and higher.

The development of 3D integrated circuits has promoted the development of etching technology. For example, the competition for the number of stacking layers of 3D NAND has put forward higher requirements for high aspect ratio etching and multi-stack stacking technology.

Market demand:

The rapid development of artificial intelligence, 5G, Internet of Things and other fields has driven the increase in demand for semiconductor chips, which in turn has promoted the growth of the etching equipment market.

Mainland China has become the world's largest semiconductor equipment market for four consecutive years, and the number of new wafer fab projects ranks first in the world, providing a broad development space for the dry etching equipment market.

Policy support:

The Chinese government has continuously issued relevant policies to support the development of the semiconductor industry, including increasing R&D investment and improving the localization rate, which will further promote the growth of the dry etching equipment market.

In summary, the dry etching equipment market has broad development prospects and huge market potential. With technological progress, increased market demand and continuous strengthening of policy support, the dry etching equipment market will continue to grow.

This report is a detailed and comprehensive analysis for global Dry Etching Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Dry Etching Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031

Global Dry Etching Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031

Global Dry Etching Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2020-2031

Global Dry Etching Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Dry Etching Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Dry Etching Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Lam Research, TEL, Applied Materials, Hitachi High-Technologies, Oxford Instruments, ULVAC, SPTS Technologies, GigaLane, Plasma-Therm, SAMCO, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Dry Etching Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Inductively Coupled Plasma (ICP)
Capacitive Coupled Plasma (CCP)
Reactive Ion Etching (RIE)
Deep Reactive Ion Etching (DRIE)
Others

Market segment by Application
Logic and Memory
MEMS
Power Device
Others

Major players covered
Lam Research
TEL
Applied Materials
Hitachi High-Technologies
Oxford Instruments
ULVAC
SPTS Technologies
GigaLane
Plasma-Therm
SAMCO
AMEC
NAURA

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Dry Etching Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Dry Etching Equipment, with price, sales quantity, revenue, and global market share of Dry Etching Equipment from 2020 to 2025.

Chapter 3, the Dry Etching Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Dry Etching Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Dry Etching Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Dry Etching Equipment.

Chapter 14 and 15, to describe Dry Etching Equipment sales channel, distributors, customers, research findings and conclusion.