Global Die Attach Paste Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Die Attach Paste Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Die-attach are the term reserved for processes where the face of a die is attached to a substrate by a single joint.Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content.

According to our (Global Info Research) latest study, the global Die Attach Paste market size was valued at US$ 752 million in 2023 and is forecast to a readjusted size of USD 980 million by 2030 with a CAGR of 3.9% during review period.

Overall economic performance will continue to be the best indicator of future demand for Die Attach Paste. Asia Pacific alone is projected to account for a large percentage of new Die Attach Paste demand anticipated through 2026; the region’s growing middle class, improving living standards, and fast-developing infrastructure is driving significant industry growth. The competition among vendors will increase during the forecast period.

This report is a detailed and comprehensive analysis for global Die Attach Paste market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Die Attach Paste market size and forecasts, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/Ton), 2019-2030

Global Die Attach Paste market size and forecasts by region and country, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/Ton), 2019-2030

Global Die Attach Paste market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/Ton), 2019-2030

Global Die Attach Paste market shares of main players, shipments in revenue ($ Million), sales quantity (MT), and ASP (US$/Ton), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Die Attach Paste

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Die Attach Paste market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include SMIC, Alpha Assembly Solutions, Shenmao Technology, Henkel, Shenzhen Weite New Material, Indium, Tongfang Tech, Heraeu, Sumitomo Bakelite, AIM, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Die Attach Paste market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
No-Clean Pastes
Rosin Based Pastes
Water Soluble Pastes
Others

Market segment by Application
SMT Assembly
Semiconductor Packaging
Automotive
Medical
Others

Major players covered
SMIC
Alpha Assembly Solutions
Shenmao Technology
Henkel
Shenzhen Weite New Material
Indium
Tongfang Tech
Heraeu
Sumitomo Bakelite
AIM
Tamura
Asahi Solder
Kyocera
Shanghai Jinji
NAMICS
Hitachi Chemical
Nordson EFD
Dow
Inkron
Palomar Technologies

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Die Attach Paste product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Die Attach Paste, with price, sales quantity, revenue, and global market share of Die Attach Paste from 2019 to 2024.

Chapter 3, the Die Attach Paste competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Die Attach Paste breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Die Attach Paste market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Die Attach Paste.

Chapter 14 and 15, to describe Die Attach Paste sales channel, distributors, customers, research findings and conclusion.