Global Die Attach Materials Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Die Attach Materials Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

According to our (Global Info Research) latest study, The global market for Die Attach Materials was estimated to be worth US$ 489 million in 2023 and is forecast to a readjusted size of US$ 786 million by 2030 with a CAGR of 6.3% during the forecast period 2024-2030.

Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.

The Global Info Research report includes an overview of the development of the Die Attach Materials industry chain, the market status of SMT Assembly (Die Attach Paste, Die Attach Wire), Semiconductor Packaging (Die Attach Paste, Die Attach Wire), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Die Attach Materials.

Regionally, the report analyzes the Die Attach Materials markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Die Attach Materials market, with robust domestic demand, supportive policies, and a strong manufacturing base.

Key Features:

The report presents comprehensive understanding of the Die Attach Materials market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Die Attach Materials industry.

The report involves analyzing the market at a macro level:

Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (MT), revenue generated, and market share of different by Type (e.g., Die Attach Paste, Die Attach Wire).

Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Die Attach Materials market.

Regional Analysis: The report involves examining the Die Attach Materials market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.

Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Die Attach Materials market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.

The report also involves a more granular approach to Die Attach Materials:

Company Analysis: Report covers individual Die Attach Materials manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.

Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Die Attach Materials This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (SMT Assembly, Semiconductor Packaging).

Technology Analysis: Report covers specific technologies relevant to Die Attach Materials. It assesses the current state, advancements, and potential future developments in Die Attach Materials areas.

Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Die Attach Materials market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.

Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.

Market Segmentation

Die Attach Materials market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type
Die Attach Paste
Die Attach Wire
Others

Market segment by Application
SMT Assembly
Semiconductor Packaging
Automotive
Medical
Others

Major players covered
MacDermid Alpha
SMIC
Henkel
Shenmao Technology
Heraeu
Shenzhen Weite New Material
Sumitomo Bakelite
Indium
AIM
Tamura
Kyocera
TONGFANG TECH
NAMICS
Showa Denko
Nordson EFD
Asahi Solder
Dow
Inkron
Palomar Technologies

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Die Attach Materials product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Die Attach Materials, with price, sales, revenue and global market share of Die Attach Materials from 2019 to 2024.

Chapter 3, the Die Attach Materials competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Die Attach Materials breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Die Attach Materials market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Die Attach Materials.

Chapter 14 and 15, to describe Die Attach Materials sales channel, distributors, customers, research findings and conclusion.