Global DRIE Deep Silicon Etching Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global DRIE Deep Silicon Etching Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

DRIE deep silicon etching equipment, full name Deep Reactive Ion Etching (deep reactive ion etching) equipment, is a key equipment used in the microelectronic dry etching process for manufacturing microelectronic chips. DRIE equipment is based on high aspect ratio silicon etching technology of fluorine-based gases. Similar to the principle of reactive ion etching (RIE), it uses the anisotropy of silicon to etch through chemical and physical effects. Specifically, the process separates the generation of plasma and the generation of self-bias through two RF sources, effectively avoiding the contradiction between RF power and plasma density in RIE etching.

According to our (Global Info Research) latest study, the global DRIE Deep Silicon Etching Equipment market size was valued at US$ 152 million in 2023 and is forecast to a readjusted size of USD 280 million by 2030 with a CAGR of 9.1% during review period.

The rapid development of the domestic integrated circuit industry has led to a continued increase in demand for deep silicon etching equipment. This is mainly due to the widespread application of microelectronic dry etching processes (including DRIE) in integrated circuit manufacturing. In addition, with the expansion of the market scale, the competition in the DRIE deep silicon etching equipment market has become increasingly fierce. The DRIE deep silicon etching equipment market is currently in a steady growth stage, and the future market potential is huge. With the continuous advancement of technology and the accelerated promotion of localization, the market will present a more intense competition.

This report is a detailed and comprehensive analysis for global DRIE Deep Silicon Etching Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global DRIE Deep Silicon Etching Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030

Global DRIE Deep Silicon Etching Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030

Global DRIE Deep Silicon Etching Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030

Global DRIE Deep Silicon Etching Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for DRIE Deep Silicon Etching Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global DRIE Deep Silicon Etching Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Oxford Instruments, SPTS Technologies, Applied Materials, Lam Research, AMAT, PlasmaTherm, Tegal Corporation, Samco Inc., Technics Plasma GmbH, SPTS Plasma, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

DRIE Deep Silicon Etching Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Single-chip
Multi-chip

Market segment by Application
MEMS
IC Manufacturing
Optical and Optoelectronic Devices
Biomedical Field
Other

Major players covered
Oxford Instruments
SPTS Technologies
Applied Materials
Lam Research
AMAT
PlasmaTherm
Tegal Corporation
Samco Inc.
Technics Plasma GmbH
SPTS Plasma
ULVAC
Alchimer
Corial
KLA-Tencor
Nova Measuring Instruments
Plasmetrex
Hitachi High-Tech Corporation
SEMIFAB
Sentech Instruments
PVA TePla AG

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe DRIE Deep Silicon Etching Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of DRIE Deep Silicon Etching Equipment, with price, sales quantity, revenue, and global market share of DRIE Deep Silicon Etching Equipment from 2019 to 2024.

Chapter 3, the DRIE Deep Silicon Etching Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the DRIE Deep Silicon Etching Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and DRIE Deep Silicon Etching Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of DRIE Deep Silicon Etching Equipment.

Chapter 14 and 15, to describe DRIE Deep Silicon Etching Equipment sales channel, distributors, customers, research findings and conclusion.