Global Copper Foil for PCB Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

Global Copper Foil for PCB Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Copper Foil for PCB market size was valued at US$ 6476 million in 2024 and is forecast to a readjusted size of USD 9202 million by 2031 with a CAGR of 4.9% during review period.

Copper foil refers to a thin copper sheet used in the production of printed circuit boards (PCBs), and its thickness is usually between 1μm and 200μm. As an important component of PCBs, copper foil not only undertakes the function of current conduction, but also provides support for the layout and structure of circuits. The quality and thickness of copper foil directly affect the performance of PCBs, the stability of signal transmission, and the heat dissipation capacity. Therefore, choosing the right copper foil material is crucial to ensure the reliability and performance of electronic devices.

Copper foil for PCB market has several key players, like Kingboard Holdings Limited, Nan Ya Plastics Corporation, Chang Chun Group and Mitsui Mining & Smelting, they take a market share 58.8% in Value in 2018. Global giant manufactures mainly distributed in Asia-PacificAt present, the demand of the Copper Foil for PCB market mainly benefits from the rapid development of electronic products and electrical equipment. With the rise of technologies such as 5G, Internet of Things (IoT), and Artificial Intelligence (AI), the application scope of PCB continues to expand, especially in the fields of smartphones, computers, automotive electronics, and medical equipment. According to reports from market research institutions, the global market size of copper foil is growing steadily and is expected to maintain a good growth momentum in the next few years.

The production process of Copper Foil for PCB is mainly divided into two types: electrolysis and calendering. Electrolytic copper foil is widely used in high-density interconnect (HDI) boards and flexible PCBs (FPC) due to its excellent flexibility and uniform thickness distribution. Calendered copper foil is usually used for mass-produced ordinary PCBs due to its low cost. Despite the increasingly fierce market competition, many emerging companies are gradually occupying market share with innovative technologies and high-quality services.

In the future, the development trend of copper foil in the PCB field will be mainly reflected in the following aspects:

Technological innovation: With the continuous advancement of PCB design and manufacturing technology, the future copper foil will develop in the direction of thinner, higher conductivity and higher thermal conductivity. This will promote the performance improvement of high-frequency and high-speed electronic products.

Green and environmental protection: Globally, environmental regulations are becoming increasingly stringent, and copper foil manufacturers need to adopt more environmentally friendly production processes to reduce pollutant emissions and resource consumption during the production process. This trend will promote companies' exploration of renewable materials and clean production technologies.

Market segmentation: In the future, as market demand diversifies, the application of copper foil will expand to more segmented fields. For example, the growing demand for high-performance copper foil in electric vehicles (EVs) and renewable energy sources such as solar and wind power has brought new opportunities to the copper foil industry.

Global competition: Although there are certain regional barriers in the copper foil market, the trend of globalization is becoming more and more obvious, and companies need to actively explore overseas markets to cope with pressure from international competitors. At the same time, supply chain optimization will be the key to ensuring that companies occupy a place in the global market.

This report is a detailed and comprehensive analysis for global Copper Foil for PCB market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Copper Foil for PCB market size and forecasts, in consumption value ($ Million), sales quantity (KMT), and average selling prices (K USD/MT), 2020-2031

Global Copper Foil for PCB market size and forecasts by region and country, in consumption value ($ Million), sales quantity (KMT), and average selling prices (K USD/MT), 2020-2031

Global Copper Foil for PCB market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (KMT), and average selling prices (K USD/MT), 2020-2031

Global Copper Foil for PCB market shares of main players, shipments in revenue ($ Million), sales quantity (KMT), and ASP (K USD/MT), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Copper Foil for PCB

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Copper Foil for PCB market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Kingboard, CCP, Mitsui Mining & Smelting, Anhui Tongguan Copper Foil, Nan Ya Plastics Corporation, Jiangxi JCC Copper Foil, Co-Tech, Shandong Jinbao Electronic, Jiujiang Defu, Solus Advanced Materials, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Copper Foil for PCB market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Electrolytic Copper Foil
Rolled Copper Foil

Market segment by Application
Server and Data Storage
Computer and Mobile Phones
Infrastructure
Automotive
Industrial
Others

Major players covered
Kingboard
CCP
Mitsui Mining & Smelting
Anhui Tongguan Copper Foil
Nan Ya Plastics Corporation
Jiangxi JCC Copper Foil
Co-Tech
Shandong Jinbao Electronic
Jiujiang Defu
Solus Advanced Materials
Yihao New Materials
Hubei Zhongyi Technology
Londian Wason Energy Tech
LCY Technology
Mingfeng Electronics
Furukawa Electric
Chaohua Technology
Fukuda
Jiayuan Technology
Wieland Rolled Products
SK Nexilis
JX Advanced Metals Corporation

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Copper Foil for PCB product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Copper Foil for PCB, with price, sales quantity, revenue, and global market share of Copper Foil for PCB from 2020 to 2025.

Chapter 3, the Copper Foil for PCB competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Copper Foil for PCB breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Copper Foil for PCB market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Copper Foil for PCB.

Chapter 14 and 15, to describe Copper Foil for PCB sales channel, distributors, customers, research findings and conclusion.