Global Copper CMP Slurry Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
According to our (Global Info Research) latest study, the global Copper CMP Slurry market size was valued at US$ 523 million in 2024 and is forecast to a readjusted size of USD 773 million by 2031 with a CAGR of 5.7% during review period.
Copper CMP (chemical mechanical polishing/planarization) slurry can be defined as a highly engineered chemical formulation used to smoothen and flatten the surface of wafer by removing unwanted materials on it. Diverse types of slurries are used for this purpose and Copper CMP slurry is one of them. This type of slurry is primarily developed for copper polishing and planarization.
This Report focuses on the Copper CMP Slurries, including the Copper CMP Slurries and Copper Barrier CMP Slurries.
The global market for semiconductor was estimated at US$ 526.8 billion in the year 2023, is projected to US$ 780.7 billion by 2030. IC Manufacturing is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM). According to our research, the global semiconductor manufacturing (wafer fabrication) market is projected to grow from US$ 251.7 billion in 2023 to US$ 506.5 billion by 2030, at a Compound Annual Growth Rate (CAGR) of 40.49% during the forecast period. This will drive rapid growth of global Cu CMP slurry.
This report is a detailed and comprehensive analysis for global Copper CMP Slurry market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Copper CMP Slurry market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global Copper CMP Slurry market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global Copper CMP Slurry market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2020-2031
Global Copper CMP Slurry market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Copper CMP Slurry
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Copper CMP Slurry market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Fujifilm, Resonac, FUJIMI INCORPORATED, DuPont, Merck (Versum Materials), Anjimirco Shanghai, Soulbrain, Saint-Gobain, Vibrantz (Ferro), TOPPAN INFOMEDIA CO., LTD, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Copper CMP Slurry market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Copper Bulk CMP Slurries
Copper Barrier CMP Slurries
Market segment by Application
Logic Chips
Memory Chips
Advanced Packaging
Major players covered
Fujifilm
Resonac
FUJIMI INCORPORATED
DuPont
Merck (Versum Materials)
Anjimirco Shanghai
Soulbrain
Saint-Gobain
Vibrantz (Ferro)
TOPPAN INFOMEDIA CO., LTD
Samsung SDI
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Copper CMP Slurry product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Copper CMP Slurry, with price, sales quantity, revenue, and global market share of Copper CMP Slurry from 2020 to 2025.
Chapter 3, the Copper CMP Slurry competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Copper CMP Slurry breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Copper CMP Slurry market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Copper CMP Slurry.
Chapter 14 and 15, to describe Copper CMP Slurry sales channel, distributors, customers, research findings and conclusion.