Global Cooling Plate for Semiconductor Equipment Supply, Demand and Key Producers, 2023-2029

Global Cooling Plate for Semiconductor Equipment Supply, Demand and Key Producers, 2023-2029

The global Cooling Plate for Semiconductor Equipment market size is expected to reach $ 27 million by 2029, rising at a market growth of 5.1% CAGR during the forecast period (2023-2029).

Semiconductor manufacturing equipment is a medium tool for achieving semiconductor manufacturing processes, playing an important role in all aspects. According to SEMI, worldwide sales of semiconductor manufacturing equipment increased 5% from $102.6 billion in 2021 to an all-time record of $107.6 billion in 2022.

In recent years, the localization process of China's semiconductor industry has further accelerated, and the performance of semiconductor equipment is more flexible than the overall industry. The localization of semiconductor equipment is ushering in a golden wave, and domestic semiconductor equipment is facing more opportunities for verification and trial use, technical cooperation, and import substitution. For the third consecutive year, China remained the largest semiconductor equipment market in 2022 despite a 5% slowdown in the pace of investments in the region year over year, accounting for $28.3 billion in billings.

The record high for semiconductor manufacturing equipment sales in 2022 stems from the industry’s drive to add the fab capacity required to support long-term growth and innovations in key end markets including high-performance computing and automotive. Additionally, the results reflect investments and determination across regions to avoid future semiconductor supply chain constraints like those that surfaced during the pandemic.

This report studies the global Cooling Plate for Semiconductor Equipment production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Cooling Plate for Semiconductor Equipment, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Cooling Plate for Semiconductor Equipment that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Cooling Plate for Semiconductor Equipment total production and demand, 2018-2029, (K Units)

Global Cooling Plate for Semiconductor Equipment total production value, 2018-2029, (USD Million)

Global Cooling Plate for Semiconductor Equipment production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (K Units)

Global Cooling Plate for Semiconductor Equipment consumption by region & country, CAGR, 2018-2029 & (K Units)

U.S. VS China: Cooling Plate for Semiconductor Equipment domestic production, consumption, key domestic manufacturers and share

Global Cooling Plate for Semiconductor Equipment production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (K Units)

Global Cooling Plate for Semiconductor Equipment production by Type, production, value, CAGR, 2018-2029, (USD Million) & (K Units)

Global Cooling Plate for Semiconductor Equipment production by Application production, value, CAGR, 2018-2029, (USD Million) & (K Units).

This reports profiles key players in the global Cooling Plate for Semiconductor Equipment market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Fiti Group (Foxsemicon), Calitech, VERSA CONN CORP (VCC), Duratek Technology Co., Ltd., Ferrotec (SiFusion), Marumae Co., Ltd, Calitech, Morgan Advanced Materials and Tokai Carbon, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Cooling Plate for Semiconductor Equipment market.

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Cooling Plate for Semiconductor Equipment Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Cooling Plate for Semiconductor Equipment Market, Segmentation by Type
300mm Cooling Plate
200mm Cooling Plate

Global Cooling Plate for Semiconductor Equipment Market, Segmentation by Application
PECVD
PVD

Companies Profiled:
Fiti Group (Foxsemicon)
Calitech
VERSA CONN CORP (VCC)
Duratek Technology Co., Ltd.
Ferrotec (SiFusion)
Marumae Co., Ltd
Calitech
Morgan Advanced Materials
Tokai Carbon
KFMI
Shenyang Fortune Precision Equipment Co., Ltd
Shaanxi Sirui Advanced Materials

Key Questions Answered

1. How big is the global Cooling Plate for Semiconductor Equipment market?

2. What is the demand of the global Cooling Plate for Semiconductor Equipment market?

3. What is the year over year growth of the global Cooling Plate for Semiconductor Equipment market?

4. What is the production and production value of the global Cooling Plate for Semiconductor Equipment market?

5. Who are the key producers in the global Cooling Plate for Semiconductor Equipment market?

6. What are the growth factors driving the market demand?