Global Circuit Board Heat Sink Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Circuit Board Heat Sink Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

A circuit board heat sink is a cooling device attached to the circuit boards of electronic equipment and computers. They are used to stabilize circuit operation by dissipating heat generated by electronic and electrical components mounted on printed circuit boards. Semiconductor components in various circuits tend to generate large amounts of heat when large drive power is required.

With the evolution of semiconductor processes, large-scale integrated circuits have been realized in extremely small sizes. In devices that realize such complex and advanced functions and performance, the amount of heat generated is also often large. To reduce the amount of heat generated, various efforts are being made on the semiconductor device side to reduce power consumption. However, in most cases, heat sinks are required to maintain stable operation when used in various environments.

According to our (Global Info Research) latest study, the global Circuit Board Heat Sink market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %during review period.

This report is a detailed and comprehensive analysis for global Circuit Board Heat Sink market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Circuit Board Heat Sink market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2019-2030

Global Circuit Board Heat Sink market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2019-2030

Global Circuit Board Heat Sink market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2019-2030

Global Circuit Board Heat Sink market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Circuit Board Heat Sink

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Circuit Board Heat Sink market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Nishimura Advanced Ceramics, Millennium Circuits Limited, Epec, A.L.M.T. Corp., Nippon Electric Glass, Resonac Holdings Corporation, RayMing Technology, Himalay Engineering, PW Circuits Ltd, Zaward Corporation, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Circuit Board Heat Sink market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Natural Air Cooling
Forced Air Cooling

Market segment by Application
Industrial Equipment
Consumer Electronics
Others

Major players covered
Nishimura Advanced Ceramics
Millennium Circuits Limited
Epec
A.L.M.T. Corp.
Nippon Electric Glass
Resonac Holdings Corporation
RayMing Technology
Himalay Engineering
PW Circuits Ltd
Zaward Corporation
db Electronic
TAKAGI MFG.CO.,LTD.

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Circuit Board Heat Sink product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Circuit Board Heat Sink, with price, sales quantity, revenue, and global market share of Circuit Board Heat Sink from 2019 to 2024.

Chapter 3, the Circuit Board Heat Sink competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Circuit Board Heat Sink breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Circuit Board Heat Sink market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Circuit Board Heat Sink.

Chapter 14 and 15, to describe Circuit Board Heat Sink sales channel, distributors, customers, research findings and conclusion.