Global Chip Packaging Market 2024 by Company, Regions, Type and Application, Forecast to 2030

Global Chip Packaging Market 2024 by Company, Regions, Type and Application, Forecast to 2030

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on

The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.

According to our (Global Info Research) latest study, the global Chip Packaging market size was valued at US$ 34310 million in 2023 and is forecast to a readjusted size of USD 52540 million by 2030 with a CAGR of 6.3% during review period.

By type breakdown, all markets for chip packages can be divided into the following categories:

The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.

The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.

From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.

The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.

This report is a detailed and comprehensive analysis for global Chip Packaging market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Chip Packaging market size and forecasts, in consumption value ($ Million), 2019-2030

Global Chip Packaging market size and forecasts by region and country, in consumption value ($ Million), 2019-2030

Global Chip Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), 2019-2030

Global Chip Packaging market shares of main players, in revenue ($ Million), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Chip Packaging

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Chip Packaging market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE Group, Amkor Technology, JCET, Siliconware Precision Industries, Powertech Technology, TongFu Microelectronics, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

Chip Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segmentation

Chip Packaging market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Traditional Packaging
Advanced Packaging

Market segment by Application
Automotive and Traffic
Consumer Electronics
Communication
Other

Market segment by players, this report covers
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Chip Packaging product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Chip Packaging, with revenue, gross margin, and global market share of Chip Packaging from 2019 to 2024.

Chapter 3, the Chip Packaging competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2019 to 2030.

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and Chip Packaging market forecast, by regions, by Type and by Application, with consumption value, from 2024 to 2030.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Chip Packaging.

Chapter 13, to describe Chip Packaging research findings and conclusion.