Global Chip On Film Underfill (COF) Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Chip On Film Underfill (COF) market size was valued at US$ 385 million in 2024 and is forecast to a readjusted size of USD 479 million by 2031 with a CAGR of 3.2% during review period.

Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without intermediate elements. Stresses arise at the solder bumps when the electronic modules are heated and cooled during operation due to the different coefficients of thermal expansion of the substrates. Underfill technology was developed to counteract these mechanical influences. The Chip On Film Underfill (COF) market covers Capillary Underfill (CUF), No Flow Underfill (NUF), Non-Conductive Paste (NCP) Underfill, Non-Conductive Film (NCF) Underfill, Molded Underfill (MUF) Underfill, etc. The typical players include Namics Corporation, AI Technology, Henkel, Shenzhen Dover, Darbond, LORD Corporation, Panacol, Won Chemical, etc.

Global Chip On Film Underfill (COF) includes Henkel, Won Chemical, etc. Global top 2 companies hold a share over 43.19%. Asia-Pacific is the largest market, with a share about 49.18%, followed by North America and Europe with the share about 24.91% and 18.09%.

This report is a detailed and comprehensive analysis for global Chip On Film Underfill (COF) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Chip On Film Underfill (COF) market size and forecasts, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/KG), 2020-2031

Global Chip On Film Underfill (COF) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/KG), 2020-2031

Global Chip On Film Underfill (COF) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (MT), and average selling prices (US$/KG), 2020-2031

Global Chip On Film Underfill (COF) market shares of main players, shipments in revenue ($ Million), sales quantity (MT), and ASP (US$/KG), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Chip On Film Underfill (COF)

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Chip On Film Underfill (COF) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Won Chemical, LORD Corporation, Hanstars, Fuji Chemical, Panacol, Namics Corporation, Shenzhen Dover, Shin-Etsu Chemical, Bondline, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Chip On Film Underfill (COF) market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Capillary Underfill (CUF)
No Flow Underfill (NUF)
Non-Conductive Paste (NCP) Underfill
Non-Conductive Film (NCF) Underfill
Molded Underfill (MUF) Underfill

Market segment by Application
Cell Phone
Tablet
LCD Display
Others

Major players covered
Henkel
Won Chemical
LORD Corporation
Hanstars
Fuji Chemical
Panacol
Namics Corporation
Shenzhen Dover
Shin-Etsu Chemical
Bondline
Zymet
AIM Solder
MacDermid (Alpha Advanced Materials)
Darbond
AI Technology
Master Bond

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Chip On Film Underfill (COF) product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Chip On Film Underfill (COF), with price, sales quantity, revenue, and global market share of Chip On Film Underfill (COF) from 2020 to 2025.

Chapter 3, the Chip On Film Underfill (COF) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Chip On Film Underfill (COF) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Chip On Film Underfill (COF) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Chip On Film Underfill (COF).

Chapter 14 and 15, to describe Chip On Film Underfill (COF) sales channel, distributors, customers, research findings and conclusion.