Global Ball Grid Array (BGA) Socket Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Ball Grid Array (BGA) Socket Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

A ball grid array (BGA) socket is designed for mounting package boards that use a grid of solder balls, known as BGAs. Unlike the pin grid array (PGA) type, where lattice-shaped pins in a grid are inserted into a socket, BGA package boards are typically mounted by direct soldering. BGA sockets allow these boards to be mounted without soldering, making them easily removable.

According to our (Global Info Research) latest study, the global Ball Grid Array (BGA) Socket market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %during review period.

The global Ball Grid Array (BGA) socket market is expected to witness significant growth in the coming years, driven by the increasing demand for high-performance electronic devices such as smartphones, tablets, and laptops. BGA sockets are widely used in these devices due to their compact size, high reliability, and superior electrical performance.

One of the key factors driving the growth of the BGA socket market is the increasing adoption of advanced technologies such as 5G, artificial intelligence, and Internet of Things (IoT). These technologies require high-speed and high-density interconnect solutions, which can be provided by BGA sockets. Additionally, the growing demand for miniaturization and higher functionality in electronic devices is also fueling the demand for BGA sockets.

In terms of regional analysis, Asia Pacific is expected to dominate the BGA socket market, owing to the presence of major electronics manufacturers in countries like China, Japan, and South Korea. These countries are known for their strong manufacturing capabilities and technological advancements in the electronics industry. North America and Europe are also expected to witness significant growth in the BGA socket market, driven by the increasing adoption of advanced technologies in sectors such as automotive, aerospace, and defense.

This report is a detailed and comprehensive analysis for global Ball Grid Array (BGA) Socket market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Ball Grid Array (BGA) Socket market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2019-2030

Global Ball Grid Array (BGA) Socket market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2019-2030

Global Ball Grid Array (BGA) Socket market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2019-2030

Global Ball Grid Array (BGA) Socket market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Ball Grid Array (BGA) Socket

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Ball Grid Array (BGA) Socket market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Ironwood Electronics, Aries Electronics, 3M, Advanced Interconnections Corp., Andon Electronics, Robson Technologies, Inc., Electronic Salesmasters, Inc., Yamaichi Electronics, DSMI electronics SA., B.C.E. S.r.l., etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Ball Grid Array (BGA) Socket market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Full Array
Partial Array

Market segment by Application
Computer Motherboards
Networking Equipment
Consumer Electronics
Industrial Applications
Others

Major players covered
Ironwood Electronics
Aries Electronics
3M
Advanced Interconnections Corp.
Andon Electronics
Robson Technologies, Inc.
Electronic Salesmasters, Inc.
Yamaichi Electronics
DSMI electronics SA.
B.C.E. S.r.l.
EasyTechJunkie

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Ball Grid Array (BGA) Socket product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Ball Grid Array (BGA) Socket, with price, sales quantity, revenue, and global market share of Ball Grid Array (BGA) Socket from 2019 to 2024.

Chapter 3, the Ball Grid Array (BGA) Socket competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Ball Grid Array (BGA) Socket breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Ball Grid Array (BGA) Socket market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Ball Grid Array (BGA) Socket.

Chapter 14 and 15, to describe Ball Grid Array (BGA) Socket sales channel, distributors, customers, research findings and conclusion.