Global Back Grinding Tape and Dicing Tape Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Back Grinding Tape and Dicing Tape Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

According to our (Global Info Research) latest study, the global Back Grinding Tape and Dicing Tape market size was valued at USD 1043.4 million in 2023 and is forecast to a readjusted size of USD 1513.2 million by 2030 with a CAGR of 5.5% during review period.

BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling. Dicing Tape is a type of adhesive tape used in semiconductor manufacturing, also known as cutting tape. It is usually made of polyimide film, with high strength and high temperature resistance. In semiconductor manufacturing, chips need to be separated by cutting them into small pieces. Dicing Tape fixes the chip on the back cutting machine and protects the chip surface from damage during the cutting process. The selection of Dicing Tape depends on the size and shape of the chip, as well as the cutting disc and cutting parameters used during the cutting process. Usually, manufacturers provide different types and specifications of Dicing Tapes to meet different application requirements.

The Global Info Research report includes an overview of the development of the Back Grinding Tape and Dicing Tape industry chain, the market status of Front-End Process (Back Grinding Tape, Dicing Tape), Back-End Process (Back Grinding Tape, Dicing Tape), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Back Grinding Tape and Dicing Tape.

Regionally, the report analyzes the Back Grinding Tape and Dicing Tape markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Back Grinding Tape and Dicing Tape market, with robust domestic demand, supportive policies, and a strong manufacturing base.

Key Features:

The report presents comprehensive understanding of the Back Grinding Tape and Dicing Tape market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Back Grinding Tape and Dicing Tape industry.

The report involves analyzing the market at a macro level:

Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K Sqm), revenue generated, and market share of different by Type (e.g., Back Grinding Tape, Dicing Tape).

Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Back Grinding Tape and Dicing Tape market.

Regional Analysis: The report involves examining the Back Grinding Tape and Dicing Tape market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.

Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Back Grinding Tape and Dicing Tape market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.

The report also involves a more granular approach to Back Grinding Tape and Dicing Tape:

Company Analysis: Report covers individual Back Grinding Tape and Dicing Tape manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.

Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Back Grinding Tape and Dicing Tape This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Front-End Process, Back-End Process).

Technology Analysis: Report covers specific technologies relevant to Back Grinding Tape and Dicing Tape. It assesses the current state, advancements, and potential future developments in Back Grinding Tape and Dicing Tape areas.

Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Back Grinding Tape and Dicing Tape market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.

Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.

Market Segmentation

Back Grinding Tape and Dicing Tape market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type
Back Grinding Tape
Dicing Tape

Market segment by Application
Front-End Process
Back-End Process

Major players covered
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
LG Chem
Maxell
D&X
AI Technology
Suzhou Boyan Jingjin Photoelectric
Shanghai Guke Adhesive Tape
WISE New Material
Taicang Zhanxin Adhesive Material
Shanghai Plusco Tech
Kunshan BYE Science Macromolecule Material
Cybrid Technologies

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Back Grinding Tape and Dicing Tape product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Back Grinding Tape and Dicing Tape, with price, sales, revenue and global market share of Back Grinding Tape and Dicing Tape from 2019 to 2024.

Chapter 3, the Back Grinding Tape and Dicing Tape competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Back Grinding Tape and Dicing Tape breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Back Grinding Tape and Dicing Tape market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Back Grinding Tape and Dicing Tape.

Chapter 14 and 15, to describe Back Grinding Tape and Dicing Tape sales channel, distributors, customers, research findings and conclusion.