Global Alumina DBC (Direct Bond Copper Substrate) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Alumina DBC (Direct Bond Copper Substrate) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic.

This report studies the Al2O3 DBC ceramic substrate.

According to our (Global Info Research) latest study, the global Alumina DBC (Direct Bond Copper Substrate) market size was valued at US$ 312 million in 2023 and is forecast to a readjusted size of USD 559 million by 2030 with a CAGR of 8.8% during review period.

In global alumina DBC substrate production market,Europe took the main share(about 41%)，South Korea took 29% share.

The global market is dominated by few players, two of the world"s largest manufacturers occupy for over 60% of global market share in 2019. Rogers/Curamik is the largest producer.

This report is a detailed and comprehensive analysis for global Alumina DBC (Direct Bond Copper Substrate) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Thickness and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Alumina DBC (Direct Bond Copper Substrate) market size and forecasts, in consumption value ($ Million), sales quantity (K Sq.m), and average selling prices (USD/Sq.m), 2019-2030

Global Alumina DBC (Direct Bond Copper Substrate) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sq.m), and average selling prices (USD/Sq.m), 2019-2030

Global Alumina DBC (Direct Bond Copper Substrate) market size and forecasts, by Thickness and by Application, in consumption value ($ Million), sales quantity (K Sq.m), and average selling prices (USD/Sq.m), 2019-2030

Global Alumina DBC (Direct Bond Copper Substrate) market shares of main players, shipments in revenue ($ Million), sales quantity (K Sq.m), and ASP (USD/Sq.m), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Alumina DBC (Direct Bond Copper Substrate)

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Alumina DBC (Direct Bond Copper Substrate) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rogers/Curamik, KCC, Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics), Heraeus Electronics, Nanjing Zhongjiang New Material Science & Technology, NGK Electronics Devices, Littelfuse IXYS, Remtec, Stellar Industries Corp, Tong Hsing (acquired HCS), etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Alumina DBC (Direct Bond Copper Substrate) market is split by Thickness and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Thickness, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Thickness
0.38mm and Below
Above 0.38mm

Market segment by Application
IGBT Module
Others

Major players covered
Rogers/Curamik
KCC
Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics)
Heraeus Electronics
Nanjing Zhongjiang New Material Science & Technology
NGK Electronics Devices
Littelfuse IXYS
Remtec
Stellar Industries Corp
Tong Hsing (acquired HCS)
Zibo Linzi Yinhe High-Tech Development
BYD
Shengda Tech
Ecocera
Chengdu Wanshida Ceramic Industry

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Alumina DBC (Direct Bond Copper Substrate) product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Alumina DBC (Direct Bond Copper Substrate), with price, sales quantity, revenue, and global market share of Alumina DBC (Direct Bond Copper Substrate) from 2019 to 2024.

Chapter 3, the Alumina DBC (Direct Bond Copper Substrate) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Alumina DBC (Direct Bond Copper Substrate) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Thickness and by Application, with sales market share and growth rate by Thickness, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Alumina DBC (Direct Bond Copper Substrate) market forecast, by regions, by Thickness, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Alumina DBC (Direct Bond Copper Substrate).

Chapter 14 and 15, to describe Alumina DBC (Direct Bond Copper Substrate) sales channel, distributors, customers, research findings and conclusion.