Global ABF Substrate (FC-BGA) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global ABF Substrate (FC-BGA) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices. This report studies the FC BGA substrate, also called ABF (Ajinomoto Build-up Film) substrates, which are IC Substrates made of Ajinomoto Build-up Film. The ABF (Ajinomoto Build-up Film) substrate consists of multiple layers of microcircuits, known as a "build-up substrate" which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.

According to our (Global Info Research) latest study, the global ABF Substrate (FC-BGA) market size was valued at US$ 5316 million in 2023 and is forecast to a readjusted size of USD 10380 million by 2030 with a CAGR of 9.6% during review period.

Global key players of ABF Substrate (FC-BGA) include Unimicron, Ibiden, AT&S, Nan Ya PCB, Shinko Electric Industries, etc. The top five players hold a share about 74%. Asia Pacific is the largest market, and has a share about 78%, followed by North America and Europe, with shares 13% and 7%, separately. In terms of product type, 4-8 Layers ABF Substrate is the largest segment, accounting for a share of 74%. In terms of application, PCs have a share about 40 percent.

This report is a detailed and comprehensive analysis for global ABF Substrate (FC-BGA) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global ABF Substrate (FC-BGA) market size and forecasts, in consumption value ($ Million), sales quantity (K Square Meters), and average selling prices (USD/Square Meter), 2019-2030

Global ABF Substrate (FC-BGA) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Square Meters), and average selling prices (USD/Square Meter), 2019-2030

Global ABF Substrate (FC-BGA) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Square Meters), and average selling prices (USD/Square Meter), 2019-2030

Global ABF Substrate (FC-BGA) market shares of main players, shipments in revenue ($ Million), sales quantity (K Square Meters), and ASP (USD/Square Meter), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for ABF Substrate (FC-BGA)

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global ABF Substrate (FC-BGA) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

ABF Substrate (FC-BGA) market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
4-8 Layers ABF Substrate
8-16 Layers ABF Substrate
Others

Market segment by Application
PCs
Server & Data Center
HPC/AI Chips
Communication
Others

Major players covered
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
Zhuhai Access Semiconductor
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe ABF Substrate (FC-BGA) product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of ABF Substrate (FC-BGA), with price, sales quantity, revenue, and global market share of ABF Substrate (FC-BGA) from 2019 to 2024.

Chapter 3, the ABF Substrate (FC-BGA) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the ABF Substrate (FC-BGA) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and ABF Substrate (FC-BGA) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of ABF Substrate (FC-BGA).

Chapter 14 and 15, to describe ABF Substrate (FC-BGA) sales channel, distributors, customers, research findings and conclusion.