Global ABF (Ajinomoto Build-up Film) Substrate Supply, Demand and Key Producers, 2023-2029

Global ABF (Ajinomoto Build-up Film) Substrate Supply, Demand and Key Producers, 2023-2029

The global ABF (Ajinomoto Build-up Film) Substrate market size is expected to reach $ 9484.8 million by 2029, rising at a market growth of 6.6% CAGR during the forecast period (2023-2029).

Global key players of ABF (ajinomoto build-up film) substrate include Unimicron, AT&S, Nan Ya PCB, etc. The top three players hold a share about 48%. The global ABF (ajinomoto build-up film) substrates are mainly produced in Japan, South Korea and China Taiwan, they occupied for a share over 75%. Asia-Pacific is the largest market, has a share about 75%, followed by North America and Europe, with share 15% and 8%, separately.

ABF, otherwise known as “Ajinomoto Build-up Film” is a resin substrate that acts as an insulator in all modern ICs. The ABF is a highly durable and rigid film that resists expansion and contraction with changes in temperature, making it ideal for use as a substrate between the nanometer-scale and millimeter-scale components of a processor or IC. The AFB substrate consists of multiple layers of microcircuits, known as a “build-up substrate” which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.

This report studies the global ABF (Ajinomoto Build-up Film) Substrate production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for ABF (Ajinomoto Build-up Film) Substrate, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of ABF (Ajinomoto Build-up Film) Substrate that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global ABF (Ajinomoto Build-up Film) Substrate total production and demand, 2018-2029, (K Square Meters)

Global ABF (Ajinomoto Build-up Film) Substrate total production value, 2018-2029, (USD Million)

Global ABF (Ajinomoto Build-up Film) Substrate production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (K Square Meters)

Global ABF (Ajinomoto Build-up Film) Substrate consumption by region & country, CAGR, 2018-2029 & (K Square Meters)

U.S. VS China: ABF (Ajinomoto Build-up Film) Substrate domestic production, consumption, key domestic manufacturers and share

Global ABF (Ajinomoto Build-up Film) Substrate production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (K Square Meters)

Global ABF (Ajinomoto Build-up Film) Substrate production by Type, production, value, CAGR, 2018-2029, (USD Million) & (K Square Meters)

Global ABF (Ajinomoto Build-up Film) Substrate production by Application production, value, CAGR, 2018-2029, (USD Million) & (K Square Meters).

This reports profiles key players in the global ABF (Ajinomoto Build-up Film) Substrate market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera and TOPPAN, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World ABF (Ajinomoto Build-up Film) Substrate market.

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Square Meters) and average price (US$/Sqm) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global ABF (Ajinomoto Build-up Film) Substrate Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global ABF (Ajinomoto Build-up Film) Substrate Market, Segmentation by Type
4-8 Layers ABF Substrate
8-16 Layers ABF Substrate
Others

Global ABF (Ajinomoto Build-up Film) Substrate Market, Segmentation by Application
PCs
Server & Data Center
HPC/AI Chips
Communication
Others

Companies Profiled:
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
ACCESS
NCAP China
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech

Key Questions Answered

1. How big is the global ABF (Ajinomoto Build-up Film) Substrate market?

2. What is the demand of the global ABF (Ajinomoto Build-up Film) Substrate market?

3. What is the year over year growth of the global ABF (Ajinomoto Build-up Film) Substrate market?

4. What is the production and production value of the global ABF (Ajinomoto Build-up Film) Substrate market?

5. Who are the key producers in the global ABF (Ajinomoto Build-up Film) Substrate market?

6. What are the growth factors driving the market demand?