Global 2.5D and 3D IC Packaging Supply, Demand and Key Producers, 2023-2029

Global 2.5D and 3D IC Packaging Supply, Demand and Key Producers, 2023-2029

The global 2.5D and 3D IC Packaging market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.

This report studies the global 2.5D and 3D IC Packaging demand, key companies, and key regions.

This report is a detailed and comprehensive analysis of the world market for 2.5D and 3D IC Packaging, and provides market size (US$ million) and Year-over-Year (YoY) growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of 2.5D and 3D IC Packaging that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global 2.5D and 3D IC Packaging total market, 2018-2029, (USD Million)

Global 2.5D and 3D IC Packaging total market by region & country, CAGR, 2018-2029, (USD Million)

U.S. VS China: 2.5D and 3D IC Packaging total market, key domestic companies and share, (USD Million)

Global 2.5D and 3D IC Packaging revenue by player and market share 2018-2023, (USD Million)

Global 2.5D and 3D IC Packaging total market by Type, CAGR, 2018-2029, (USD Million)

Global 2.5D and 3D IC Packaging total market by Application, CAGR, 2018-2029, (USD Million)

This reports profiles major players in the global 2.5D and 3D IC Packaging market based on the following parameters – company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics, Xilinx, Intel, Micron Technology, TSMC and SK Hynix, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World 2.5D and 3D IC Packaging market

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), by player, by regions, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global 2.5D and 3D IC Packaging Market, By Region:

United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global 2.5D and 3D IC Packaging Market, Segmentation by Type

2.5D
3D TSV
3D Wafer-level Chip-scale Packaging

Global 2.5D and 3D IC Packaging Market, Segmentation by Application

Consumer Electronics
Medical Devices
Communications and Telecom
Automotive
Other

Companies Profiled:
ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology

Key Questions Answered

1. How big is the global 2.5D and 3D IC Packaging market?

2. What is the demand of the global 2.5D and 3D IC Packaging market?

3. What is the year over year growth of the global 2.5D and 3D IC Packaging market?

4. What is the total value of the global 2.5D and 3D IC Packaging market?

5. Who are the major players in the global 2.5D and 3D IC Packaging market?

6. What are the growth factors driving the market demand?