Global 3D IC & 2.5D IC Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global 3D IC & 2.5D IC Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

According to our (Global Info Research) latest study, the global 3D IC & 2.5D IC Packaging market size was valued at USD 7155.3 million in 2023 and is forecast to a readjusted size of USD 20320 million by 2030 with a CAGR of 16.1% during review period.

A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

The Global Info Research report includes an overview of the development of the 3D IC & 2.5D IC Packaging industry chain, the market status of Automotive (3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)), Consumer electronics (3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of 3D IC & 2.5D IC Packaging.

Regionally, the report analyzes the 3D IC & 2.5D IC Packaging markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global 3D IC & 2.5D IC Packaging market, with robust domestic demand, supportive policies, and a strong manufacturing base.

Key Features:

The report presents comprehensive understanding of the 3D IC & 2.5D IC Packaging market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the 3D IC & 2.5D IC Packaging industry.

The report involves analyzing the market at a macro level:

Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K Units), revenue generated, and market share of different by Type (e.g., 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)).

Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the 3D IC & 2.5D IC Packaging market.

Regional Analysis: The report involves examining the 3D IC & 2.5D IC Packaging market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.

Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the 3D IC & 2.5D IC Packaging market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.

The report also involves a more granular approach to 3D IC & 2.5D IC Packaging:

Company Analysis: Report covers individual 3D IC & 2.5D IC Packaging manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.

Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards 3D IC & 2.5D IC Packaging This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Automotive, Consumer electronics).

Technology Analysis: Report covers specific technologies relevant to 3D IC & 2.5D IC Packaging. It assesses the current state, advancements, and potential future developments in 3D IC & 2.5D IC Packaging areas.

Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the 3D IC & 2.5D IC Packaging market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.

Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.

Market Segmentation

3D IC & 2.5D IC Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type
3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

Market segment by Application
Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies

Major players covered
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering
JCET
TongFu Microelectronics

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe 3D IC & 2.5D IC Packaging product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of 3D IC & 2.5D IC Packaging, with price, sales, revenue and global market share of 3D IC & 2.5D IC Packaging from 2019 to 2024.

Chapter 3, the 3D IC & 2.5D IC Packaging competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the 3D IC & 2.5D IC Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and 3D IC & 2.5D IC Packaging market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of 3D IC & 2.5D IC Packaging.

Chapter 14 and 15, to describe 3D IC & 2.5D IC Packaging sales channel, distributors, customers, research findings and conclusion.