System-in-Package (SiP) Technology

Global System-in-Package (SiP) Technology Market to Reach US$58.0 Billion by 2030

The global market for System-in-Package (SiP) Technology estimated at US$36.2 Billion in the year 2024, is expected to reach US$58.0 Billion by 2030, growing at a CAGR of 8.2% over the analysis period 2024-2030. 2.5-D IC, one of the segments analyzed in the report, is expected to record a 8.0% CAGR and reach US$27.2 Billion by the end of the analysis period. Growth in the 2-D IC segment is estimated at 6.1% CAGR over the analysis period.

The U.S. Market is Estimated at US$9.4 Billion While China is Forecast to Grow at 11.8% CAGR

The System-in-Package (SiP) Technology market in the U.S. is estimated at US$9.4 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$14.0 Billion by the year 2030 trailing a CAGR of 11.8% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 4.4% and 7.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.1% CAGR.

Global System-in-Package (SiP) Technology Market - Key Trends and Drivers Summarized

System-in-Package (SiP) technology represents a significant advancement in semiconductor design and manufacturing, moving beyond the traditional focus on integrating more transistors into a single silicon chip to a more holistic approach of integrating entire systems into compact packages. This shift addresses key industry challenges such as the escalating costs associated with Moore`s Law and the growing complexity of components. SiP technology simplifies the usage of integrated circuits by abstracting the complexities of individual component optimization and leveraging the best processes for silicon integration without continuous heavy investments in new fabrication technologies. This approach not only enhances the performance of electronic products but also provides a more cost-effective alternative for companies, enabling faster development cycles and reduced total ownership costs.

The design and manufacture of Application-Specific Integrated Circuits (ASICs) have historically been dominated by specialized semiconductor companies. However, the landscape has shifted dramatically, with major technology firms now spearheading ASIC development to produce proprietary SiPs. These SiPs are central to the products in which they are embedded, paving the way for groundbreaking technological advancements. The collaboration among technology firms, Outsourced Semiconductor Assembly and Test (OSAT) providers, and substrate design specialists has led to the creation of high-quality SiPs tailored to specific applications, optimizing performance while reducing the size and complexity of the overall system. This trend reflects a broader move towards proprietary component development and integration, aimed at enhancing product performance and competitive edge in the market.

Several key drivers are fueling the growth of the SiP market. The surge in consumer interest in wearable technology, such as smartwatches and fitness trackers, fuels the demand for SiPs due to their need for compact, efficient, and highly integrated systems. Advancements in medical device technology also drive SiP adoption, as these devices increasingly incorporate advanced sensors and miniature electronic systems, essential for portable diagnostic devices and implantable technology. The expansion of the Internet of Things (IoT) ecosystem, including smart home devices, industrial IoT applications, and automotive electronics, requires high-performance, space-efficient chip solutions that SiPs uniquely offer. Consumer electronics demand sleeker, more powerful devices, necessitating the development of compact, multifunctional integrated circuits enabled by SiPs. Furthermore, the progress in AI and machine learning technologies requires high computational power in small dimensions, which SiPs facilitate by integrating complex circuitry within constrained spaces. Enhanced telecommunication capabilities with the rollout of 5G technology also rely on SiPs for improved performance and integration at lower power consumption. Lastly, environmental and sustainability concerns drive the adoption of SiPs, as they reduce electronic waste and enhance device longevity by minimizing the number of separate components needed. These factors collectively underscore the critical role of SiP technology in the next generation of electronic product development.

SCOPE OF STUDY:

The report analyzes the System-in-Package (SiP) Technology market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Packaging Technology (2.5-D IC, 2-D IC, 3-D IC); Packaging Method (Flip Chip, Wire Bond & Die Attach, FOWLP); Application (Consumer Electronics, Telecommunications, Automotive, Aerospace & Defense, Industrial, Other Applications)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 49 Featured) -

• Amkor Technology Inc.
• ChipMOS Technologies Inc.
• Fujitsu Limited
• GS Nanotech
• Insight SiP
• Intel Corporation
• Jiangsu Changjiang Electronics Technology Co. Ltd.
• Powertech Technologies Inc.
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd.
• Si2 Microsystems Private Limited
• STATS ChipPAC Ltd.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA
CHINA
MEXICO
CANADA
EU
JAPAN
INDIA
176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

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