Substrate-Like PCB

Substrate-Like PCB

Global Substrate-Like PCB Market to Reach US$9.9 Billion by 2030

The global market for Substrate-Like PCB estimated at US$3.2 Billion in the year 2023, is expected to reach US$9.9 Billion by 2030, growing at a CAGR of 17.6% over the analysis period 2023-2030. 25 / 25 & 30 / 30 µm Line / Space, one of the segments analyzed in the report, is expected to record a 18.0% CAGR and reach US$7.3 Billion by the end of the analysis period. Growth in the Below 25 / 25 µm Line / Space segment is estimated at 16.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$878.2 Million While China is Forecast to Grow at 16.6% CAGR

The Substrate-Like PCB market in the U.S. is estimated at US$878.2 Million in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.5 Billion by the year 2030 trailing a CAGR of 16.6% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 15.5% and 14.8% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 12.6% CAGR.

Global Substrate-Like PCB Market - Key Trends and Drivers Summarized

How Is Substrate-Like PCB Revolutionizing Electronic Manufacturing?

Substrate-Like PCB (SLP) represents the next-generation evolution in printed circuit board technology, offering high-density interconnects (HDI) and ultra-fine circuit patterns that meet the demands of advanced electronic devices. SLPs are characterized by their thinner, more compact designs, enabling higher component density and better electrical performance. These PCBs are widely used in smartphones, wearable devices, automotive electronics, and IoT products, where space efficiency and improved signal transmission are crucial. As electronic devices become smaller, more powerful, and feature-rich, SLPs have emerged as a vital component for manufacturers seeking to enhance device performance while maintaining compact sizes.

What Are the Key Segments in the Substrate-Like PCB Market?

Key material types include rigid, flexible, and rigid-flex substrates, with rigid substrates holding the largest market share due to their stability and reliability in high-performance electronic devices. Applications of SLPs cover smartphones, tablets, laptops, automotive electronics, and IoT devices, with smartphones representing a significant segment driven by the need for compact PCBs to accommodate advanced features like 5G connectivity, higher memory, and powerful processors. End-users include consumer electronics manufacturers, automotive companies, and telecommunications providers, with consumer electronics leading the market as they integrate SLPs to enhance device functionality and miniaturization.

How Is Substrate-Like PCB Integrated Across Electronics?

In smartphones, SLPs enable the integration of advanced features, including faster processors, multi-camera systems, and 5G connectivity, by providing higher wiring density and reduced signal loss. In wearable devices, SLPs support compact designs with flexible capabilities, allowing for curved displays and extended battery life. Automotive electronics utilize SLPs in advanced driver-assistance systems (ADAS), infotainment units, and electric vehicle components, where space efficiency and high-speed data transmission are critical. Additionally, IoT devices rely on SLPs for seamless connectivity, energy efficiency, and integration of sensors and microprocessors, supporting applications in smart homes, industrial automation, and healthcare.

What Factors Are Driving the Growth in the Substrate-Like PCB Market?

The growth in the Substrate-Like PCB market is driven by several factors, including increasing demand for miniaturized electronic components that offer high performance, particularly in smartphones, wearable devices, and automotive electronics. Advancements in PCB manufacturing technologies, such as laser direct imaging (LDI) and advanced photolithography, have enabled higher density circuits and reduced layer thickness, supporting broader adoption across electronic products. The focus on 5G deployment, IoT expansion, and electric vehicle production has further fueled demand, as SLPs provide the necessary connectivity and performance in these applications. Additionally, rising investments in semiconductor manufacturing, growing consumer demand for advanced electronics, and the shift towards compact, multi-functional devices have contributed to market growth, encouraging the integration of SLPs across electronic manufacturing.

SCOPE OF STUDY:

The report analyzes the Substrate-Like PCB market in terms of US$ Thousand by the following Application; Line / Space, and Geographic Regions/Countries:

Segments:
Line / Space (25 / 25 & 30 / 30 µm, Below 25 / 25 µm); Application (Consumer Electronics, Computing & Telecommunications, Automotive, Medical, Other Applications)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 36 Featured) -

• ATandS
• Bio-Active
• China Circuit Technology Corporation
• Compeq Manufacturing
• HannStar Board Corporation
• Kinsus Interconnect Technology Corp
• SAA
• Shenzhen Fastprint Circuit Tech
• Simmtech
• Symtek Automation Asia
• Tripod Technology Corporation
• TTM Technologies, Inc
• Unimicron Corporation
• Unitech
• Zhen Ding Tech

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