Global High Density Interconnect Market to Reach $40 Billion by 2030
The global market for High Density Interconnect estimated at US$18.7 Billion in the year 2023, is expected to reach US$40 Billion by 2030, growing at a CAGR of 11.5% over the analysis period 2023-2030. 4-6 Layers High Density Interconnect, one of the segments analyzed in the report, is expected to record a 9.5% CAGR and reach US$9.5 Billion by the end of the analysis period. Growth in the 8-10 Layers High Density Interconnect segment is estimated at 11.5% CAGR for the next 7-year period.
The U.S. Market is Estimated at $5.7 Billion, While China is Forecast to Grow at 10.9% CAGR
The High Density Interconnect market in the U.S. is estimated at US$5.7 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$6.9 Billion by the year 2030 trailing a CAGR of 10.9% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 9.9% and 9.7% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 8.2% CAGR.
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