Chip Mounters

Chip Mounters

Global Chip Mounters Market to Reach US$11.2 Billion by 2030

The global market for Chip Mounters estimated at US$7.6 Billion in the year 2023, is expected to reach US$11.2 Billion by 2030, growing at a CAGR of 5.5% over the analysis period 2023-2030. Surface Mount Technology (SMT), one of the segments analyzed in the report, is expected to record a 5.8% CAGR and reach US$9.3 Billion by the end of the analysis period. Growth in the Through-Hole Technology (THT) segment is estimated at 4.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.1 Billion While China is Forecast to Grow at 5.1% CAGR

The Chip Mounters market in the U.S. is estimated at US$2.1 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.7 Billion by the year 2030 trailing a CAGR of 5.1% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.2% and 4.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.2% CAGR.

Global Chip Mounters Market - Key Trends and Drivers Summarized

Why Are Chip Mounters Critical in Modern Electronics Manufacturing?

Chip mounters have become indispensable in the electronics manufacturing industry, playing a key role in assembling the complex devices that are ubiquitous in today’s world. Chip mounters, or Surface Mount Technology (SMT) machines, are responsible for placing electronic components, such as resistors, capacitors, and integrated circuits (ICs), onto printed circuit boards (PCBs) with precision and speed. As consumer electronics, automotive systems, telecommunications devices, and industrial machines grow more complex, the need for highly automated, efficient assembly processes has escalated. Chip mounters not only improve production speed and accuracy but also enable manufacturers to meet the demands of high-volume production, ensuring that devices can be produced quickly and with minimal defects. As devices continue to shrink in size while increasing in functionality, chip mounters have become a vital piece of equipment for manufacturers seeking to remain competitive in a rapidly evolving market.

How Do Chip Mounters Meet the Challenges of Miniaturization and High-Precision Assembly?

The trend toward miniaturization in electronics is pushing the capabilities of chip mounters to new levels. One of the key features of modern chip mounters is their ability to handle a wide range of component sizes, from large connectors to micro-sized passive components and tiny integrated circuits. High-end chip mounters are equipped with advanced vision systems and placement heads that can precisely locate and place components as small as 01005 (0.4 mm × 0.2 mm), a size commonly used in smartphones, wearables, and medical devices. The accuracy required in modern electronics manufacturing is measured in micrometers, and chip mounters must ensure that each component is placed with pinpoint precision to avoid costly defects. In addition to precision, speed is another critical factor. Chip mounters are designed to place thousands of components per hour, significantly increasing the production throughput of manufacturers. The ability to place components rapidly while maintaining high accuracy helps companies meet the growing demand for smaller, more complex electronic devices. Moreover, modern chip mounters are highly flexible, allowing manufacturers to quickly reconfigure their machines to handle different products or production runs, ensuring that they can adapt to changing market demands. This flexibility is crucial in industries such as automotive and telecommunications, where product lifecycles are short, and there is a constant need to innovate and produce next-generation devices.

What Technological Advancements Are Driving Innovation in Chip Mounters?

The technology behind chip mounters is continuously evolving, with advancements that are pushing the boundaries of what these machines can achieve. One significant development is the increasing use of artificial intelligence (AI) and machine learning in chip mounters. AI-enabled machines can monitor their performance in real-time, adjusting placement strategies on the fly to optimize speed, accuracy, and yield. This leads to fewer errors, higher throughput, and less downtime for maintenance. AI can also be used to predict potential issues before they become critical, such as component misalignment or machine wear, helping to prevent production interruptions. Another important innovation is the integration of 3D vision systems, which allow chip mounters to achieve higher placement accuracy by providing real-time feedback on component position and height. This is particularly useful for handling complex components and ensuring that they are placed correctly on the PCB, reducing the need for rework. Additionally, the development of multi-head placement systems has increased the speed of chip mounters by allowing multiple components to be placed simultaneously. These multi-head systems are now common in high-volume production environments, where efficiency is paramount. Modular designs are also becoming more popular, enabling manufacturers to scale up production by adding additional placement heads or upgrading existing equipment as production demands grow.

What Are the Factors Fueling Expansion of the Chip Mounter Market?

The growth in the chip mounter market is driven by several factors, including the rapid expansion of consumer electronics, the rise of the Internet of Things (IoT), and advancements in automotive electronics. As consumer demand for smaller, more powerful devices increases, manufacturers need equipment that can efficiently place the ever-shrinking components required for modern gadgets such as smartphones, tablets, and wearable devices. Chip mounters that can handle miniaturized components with high accuracy and speed are essential in meeting this demand. The continued growth of IoT devices, which require the assembly of sensors, wireless communication modules, and microcontrollers, is another key driver of the market. These devices often require high-density PCBs, making precision component placement critical to their functionality. The automotive industry is also a significant factor in the chip mounter market’s growth. With the increasing integration of advanced electronics in vehicles—ranging from infotainment systems to advanced driver-assistance systems (ADAS) and electric vehicle (EV) components—there is a growing need for high-reliability, high-precision manufacturing processes. Chip mounters capable of handling automotive-grade components are in high demand to ensure the performance and safety of these systems. Additionally, the shift towards electric and autonomous vehicles is further driving the need for advanced electronics assembly, pushing the market for high-performance chip mounters. The rise of smart factories and Industry 4.0 is another growth driver, with manufacturers adopting automated, data-driven systems to improve efficiency and reduce production costs. These trends, combined with the relentless pace of technological innovation, ensure that the chip mounter market will continue to expand as the demand for cutting-edge electronic devices grows across multiple industries.

Select Competitors (Total 38 Featured) -

• ASM Pacific Technology Ltd.
• Canon India Pvt Ltd.
• Essemtec AG
• Hanwha Techwin Co., Ltd.
• Hitachi Ltd.
• JUKI Corporation
• Nitto Denko Corporation
• NORDSON Corporation
• Ohashi Engineering Co., Ltd.
• Panasonic System Solutions Company of North America - Process Automation
• Sony Corporation
• SUN Electronic Industries Corporation
• TOA Vietnam Co., Ltd
• Yamaha Corporation

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