3D IC and 2.5D IC Packaging

3D IC and 2.5D IC Packaging

Global 3D IC and 2.5D IC Packaging Market to Reach US$6.4 Billion by 2030

The global market for 3D IC and 2.5D IC Packaging estimated at US$3.6 Billion in the year 2023, is expected to reach US$6.4 Billion by 2030, growing at a CAGR of 8.6% over the analysis period 2023-2030. 3D Wafer-level Chip-Scale Packaging, one of the segments analyzed in the report, is expected to record a 8.5% CAGR and reach US$2.8 Billion by the end of the analysis period. Growth in the 3D TSV segment is estimated at 9.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$1.1 Billion While China is Forecast to Grow at 8.1% CAGR

The 3D IC and 2.5D IC Packaging market in the U.S. is estimated at US$1.1 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.1 Billion by the year 2030 trailing a CAGR of 8.1% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 7.7% and 7.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 6.7% CAGR.

Global 3D IC and 2.5D IC Packaging Market - Key Trends and Drivers Summarized

Is 3D IC and 2.5D IC Packaging Leading the Next Generation of Semiconductor Technology?

3D IC and 2.5D IC packaging are advanced semiconductor technologies that have emerged to meet the increasing demands for higher performance, greater functionality, and lower power consumption in electronic devices. Traditional integrated circuit (IC) packaging involves placing chips side by side on a single flat substrate. In contrast, 3D IC packaging stacks multiple layers of chips vertically, connecting them with through-silicon vias (TSVs), which are tiny vertical electrical connections that pass through the silicon wafers. This vertical stacking reduces the physical footprint of the IC and shortens the distance between the chips, leading to faster data transfer and better overall performance. On the other hand, 2.5D IC packaging bridges the gap between traditional 2D packaging and fully stacked 3D ICs by placing multiple chips side by side on a single interposer substrate. The interposer provides high-speed connections between the chips while maintaining the flexibility to use different types of chips, such as memory and processors, within the same package. Both 3D IC and 2.5D IC packaging represent significant advances in semiconductor technology, allowing for the integration of more functionality in smaller form factors and supporting the next wave of innovations in consumer electronics, data centers, and beyond.

How Are 3D IC and 2.5D IC Packaging Transforming the Semiconductor Industry?

The introduction of 3D IC and 2.5D IC packaging is driving a profound transformation in the semiconductor industry, reshaping the way chips are designed, manufactured, and deployed in a variety of applications. These packaging technologies address the growing need for higher performance and more power-efficient devices, especially in sectors like smartphones, artificial intelligence (AI), high-performance computing (HPC), and automotive systems. One of the most significant advantages of 3D IC packaging is the dramatic increase in performance it enables by reducing the signal delays caused by long interconnects between chips in traditional 2D designs. By stacking multiple chips vertically and connecting them with TSVs, data can travel faster between memory, processors, and other components, leading to better computational performance, lower power consumption, and increased bandwidth. In contrast, 2.5D IC packaging allows for heterogeneous integration, meaning chips from different process nodes or functions can be combined on a single platform. This flexibility enables designers to mix and match high-performance processors, specialized accelerators, and large memory modules in a compact package, further enhancing the performance of devices while optimizing cost and design complexity. These innovations are particularly beneficial in industries that require high-speed data processing and low-latency communication, such as AI and machine learning, where the ability to integrate diverse components in a tight space is critical. By enabling higher density, reduced power consumption, and enhanced performance, 3D IC and 2.5D IC packaging are transforming the semiconductor industry’s approach to chip design and manufacturing.

What Are the Challenges and Limitations of 3D IC and 2.5D IC Packaging?

Despite the clear advantages, 3D IC and 2.5D IC packaging face several technical and economic challenges that must be addressed before they can achieve widespread adoption. One of the most significant technical hurdles is the complexity of manufacturing these advanced packages. The fabrication of 3D ICs, in particular, requires precise alignment of stacked chips and the creation of reliable TSVs, both of which add layers of complexity to the traditional chip-making process. Managing the heat generated within densely packed 3D ICs is another challenge, as the vertical stacking of multiple chips makes efficient heat dissipation more difficult. This can lead to overheating issues, which, if not properly managed, could degrade performance and reduce the lifespan of the device. For 2.5D IC packaging, the development of high-quality interposers that can handle high-speed data transfers between chips is critical, but the cost of producing these interposers remains a barrier. Additionally, the integration of chips from different manufacturers or process nodes can introduce compatibility issues, which require careful design and testing to resolve. From an economic perspective, the costs associated with developing and manufacturing 3D and 2.5D IC packages are still relatively high compared to traditional 2D packaging, limiting their use to high-end applications where performance benefits justify the expense. Furthermore, the semiconductor industry faces challenges in scaling these technologies for mass production, particularly in ensuring yield rates that make these processes cost-effective. As the industry continues to innovate and refine the manufacturing techniques, overcoming these challenges will be crucial for broader adoption.

What’s Driving the Expansion of the 3D IC and 2.5D IC Packaging Market?

The growth in the 3D IC and 2.5D IC packaging market is driven by several key factors that highlight the increasing demand for more advanced, efficient, and high-performance semiconductor solutions. One of the primary drivers is the growing need for smaller, faster, and more powerful devices, particularly in consumer electronics, where smartphones, tablets, and wearables continue to demand higher performance while shrinking in size. 3D IC and 2.5D IC packaging allow manufacturers to meet these demands by packing more functionality into a smaller form factor without compromising on performance or energy efficiency. Additionally, the rapid expansion of AI, machine learning, and data analytics is fueling demand for higher computing power and data bandwidth. These applications benefit greatly from the increased processing speed and reduced latency that 3D IC and 2.5D IC packaging provide, as these technologies allow for the integration of specialized processors, accelerators, and memory in close proximity, optimizing data flow and power consumption. The automotive industry is another significant growth driver, as electric vehicles (EVs), autonomous driving systems, and advanced driver-assistance systems (ADAS) require highly integrated, compact, and efficient electronic systems. 3D and 2.5D packaging are well-suited to these applications, offering the necessary performance and space-saving advantages. Moreover, the rise of the Internet of Things (IoT) and the proliferation of edge computing devices are pushing the demand for smaller, low-power chips that can perform complex tasks at the edge of the network. Governments and industry leaders are also heavily investing in research and development to enhance these packaging technologies, driving innovation and reducing costs. These factors, combined with the ongoing demand for high-performance computing in data centers, cloud infrastructure, and telecommunication networks, are propelling the 3D IC and 2.5D IC packaging market forward, positioning it as a key enabler of the next generation of semiconductor technologies.

Select Competitors (Total 13 Featured) -
  • Amkor Technology: ASE Group
  • Broadcom Ltd.
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Samsung Electronics Co., Ltd.
  • Stmicroelectronics Nv
  • Taiwan Semiconductor Manufacturing Company Limited
  • Toshiba Corp.
  • United Microelectronics Corp.
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I. METHODOLOGY
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
Global Economic Update
Influencer Market Insights
World Market Trajectories
3D IC and 2.5D IC Packaging – Global Key Competitors Percentage Market Share in 2024 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Rising Demand for High-Performance Computing Expands Market Opportunity for 3D IC and 2.5D IC Packaging
Advancements in Semiconductor Fabrication Propel Growth in 3D and 2.5D IC Packaging
Here`s How the Shift Toward Miniaturization Drives Adoption of 3D IC and 2.5D IC Packaging Solutions
Increasing Need for Power Efficiency Spurs Demand for 3D IC Packaging in Consumer Electronics
Growing Use of 3D and 2.5D IC Packaging in AI and Machine Learning Applications Strengthens Market Potential
Here`s the Story: Expanding Applications in Data Centers and Cloud Computing Accelerate Demand for Advanced IC Packaging
Rising Integration of IoT Devices Generates Opportunities for 2.5D and 3D IC Packaging Technologies
Increasing Investment in 5G Infrastructure Propels Growth in 3D IC and 2.5D IC Packaging
Here`s How the Need for Faster Data Processing Fuels Adoption of 3D IC and 2.5D IC Packaging
Expanding Use of Advanced Packaging in Automotive and Autonomous Systems Strengthens Business Case
Growing Complexity of Semiconductor Designs Drives Market for 3D IC and 2.5D IC Packaging Technologies
Rising Demand for Wearable and Portable Devices Boosts Adoption of 3D IC Packaging
Increasing Use of 2.5D IC Packaging in High-Performance GPUs and CPUs Generates New Market Opportunities
4. GLOBAL MARKET PERSPECTIVE
TABLE 1: World 3D IC and 2.5D IC Packaging Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
TABLE 2: World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 3: World Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 4: World 16-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
TABLE 5: World Recent Past, Current & Future Analysis for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 6: World Historic Review for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 7: World 16-Year Perspective for 3D Wafer-level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 8: World Recent Past, Current & Future Analysis for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 9: World Historic Review for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 10: World 16-Year Perspective for 3D TSV by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 11: World Recent Past, Current & Future Analysis for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 12: World Historic Review for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 13: World 16-Year Perspective for 2.5D by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 14: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 15: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 16: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 17: World Recent Past, Current & Future Analysis for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 18: World Historic Review for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 19: World 16-Year Perspective for Telecommunication by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 20: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 21: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 22: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 23: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 24: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 25: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 26: World Recent Past, Current & Future Analysis for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 27: World Historic Review for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 28: World 16-Year Perspective for Smart Technologies by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 29: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 30: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 31: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 32: World Recent Past, Current & Future Analysis for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 33: World Historic Review for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 34: World 16-Year Perspective for Logic by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 35: World Recent Past, Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 36: World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 37: World 16-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 38: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 39: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 40: World 16-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 41: World Recent Past, Current & Future Analysis for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 42: World Historic Review for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 43: World 16-Year Perspective for MEMS / Sensors by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 44: World Recent Past, Current & Future Analysis for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 45: World Historic Review for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 46: World 16-Year Perspective for LED by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
TABLE 47: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 48: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 49: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
III. MARKET ANALYSIS
UNITED STATES
Market Facts & Figures
US 3D IC and 2.5D IC Packaging Market Share (in %) by Company: 2018 & 2027
3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share Analysis (in %) of Leading Players in the US for 2018 & 2027
3D TSV (Packaging Technology) Competitor Revenue Share (in %) in the US: 2018 & 2027
2.5D (Packaging Technology) Market Share Breakdown (in %) of Major Players in the US: 2018 & 2027
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
Market Analytics
TABLE 50: USA Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 51: USA Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 52: USA 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 53: USA Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 54: USA Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 55: USA 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 56: USA Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 57: USA Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 58: USA 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
CANADA
TABLE 59: Canada Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 60: Canada Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 61: Canada 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 62: Canada Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 63: Canada Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 64: Canada 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 65: Canada Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 66: Canada Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 67: Canada 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
JAPAN
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
TABLE 68: Japan Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 69: Japan Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 70: Japan 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 71: Japan Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 72: Japan Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 73: Japan 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 74: Japan Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 75: Japan Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 76: Japan 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
CHINA
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
TABLE 77: China Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 78: China Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 79: China 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 80: China Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 81: China Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 82: China 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 83: China Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 84: China Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 85: China 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
EUROPE
Market Facts & Figures
European 3D IC and 2.5D IC Packaging Market: Competitor Market Share Scenario (in %) for 2018 & 2027
3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share (in %) by Company in Europe: 2018 & 2027
3D TSV (Packaging Technology) Market Share (in %) of Major Players in Europe: 2018 & 2027
2.5D (Packaging Technology) Competitor Market Share Analysis (in %) in Europe: 2018 & 2027
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
Market Analytics
TABLE 86: Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
TABLE 87: Europe Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 88: Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
TABLE 89: Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 90: Europe Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 91: Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 92: Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 93: Europe Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 94: Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 95: Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 96: Europe Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 97: Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
FRANCE
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
TABLE 98: France Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 99: France Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 100: France 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 101: France Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 102: France Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 103: France 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 104: France Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 105: France Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 106: France 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
GERMANY
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
TABLE 107: Germany Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 108: Germany Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 109: Germany 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 110: Germany Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 111: Germany Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 112: Germany 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 113: Germany Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 114: Germany Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 115: Germany 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
ITALY
TABLE 116: Italy Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 117: Italy Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 118: Italy 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 119: Italy Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 120: Italy Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 121: Italy 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 122: Italy Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 123: Italy Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 124: Italy 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
UNITED KINGDOM
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
TABLE 125: UK Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 126: UK Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 127: UK 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 128: UK Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 129: UK Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 130: UK 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 131: UK Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 132: UK Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 133: UK 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
REST OF EUROPE
TABLE 134: Rest of Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 135: Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 136: Rest of Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 137: Rest of Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 138: Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 139: Rest of Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 140: Rest of Europe Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 141: Rest of Europe Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 142: Rest of Europe 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
ASIA-PACIFIC
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
TABLE 143: Asia-Pacific Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 144: Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 145: Asia-Pacific 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 146: Asia-Pacific Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 147: Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 148: Asia-Pacific 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 149: Asia-Pacific Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 150: Asia-Pacific Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 151: Asia-Pacific 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
REST OF WORLD
TABLE 152: Rest of World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 153: Rest of World Historic Review for 3D IC and 2.5D IC Packaging by Packaging Technology - 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 154: Rest of World 16-Year Perspective for 3D IC and 2.5D IC Packaging by Packaging Technology - Percentage Breakdown of Value Revenues for 3D Wafer-level Chip-Scale Packaging, 3D TSV and 2.5D for the Years 2014, 2024 & 2030
TABLE 155: Rest of World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 156: Rest of World Historic Review for 3D IC and 2.5D IC Packaging by End-Use - Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 157: Rest of World 16-Year Perspective for 3D IC and 2.5D IC Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Telecommunication, Industrial, Automotive, Smart Technologies and Other End-Uses for the Years 2014, 2024 & 2030
TABLE 158: Rest of World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
TABLE 159: Rest of World Historic Review for 3D IC and 2.5D IC Packaging by Application - Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
TABLE 160: Rest of World 16-Year Perspective for 3D IC and 2.5D IC Packaging by Application - Percentage Breakdown of Value Revenues for Logic, Imaging & Optoelectronics, Memory, MEMS / Sensors, LED and Other Applications for the Years 2014, 2024 & 2030
IV. COMPETITION

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