Global 2.5D and 3D Semiconductor Packaging Market 2022-2028

Global 2.5D and 3D Semiconductor Packaging Market 2022-2028

The global 2.5d and 3d semiconductor packaging market is anticipated to increase by USD 8.5 billion till 2028 at an average annual growth of 13.6 percent as per the latest report by Gen Consulting Company.

The report covers market size and growth, segmentation, regional breakdowns, competitive landscape, trends and strategies for global 2.5d and 3d semiconductor packaging market. It traces the market’s historic and forecast market growth. The report identifies top segments for opportunities and strategies based on market trends and leading competitors’ approaches. This study also provides an analysis of the impact of the COVID-19 crisis on the 2.5d and 3d semiconductor packaging industry.

This industry report offers market estimates and forecasts of the global market, followed by a detailed analysis of the technology, end user, and region. The global market for 2.5d and 3d semiconductor packaging can be segmented by technology: 2.5D, 3D. According to the research, the 3D segment had the largest share in the global 2.5d and 3d semiconductor packaging market. 2.5d and 3d semiconductor packaging market is further segmented by end user: automotive, consumer electronics, medical devices, telecommunications, others. Based on region, the 2.5d and 3d semiconductor packaging market is segmented into: China, Japan, South Korea, Taiwan, United States, Rest of the World (RoW). Among these, Taiwan was accounted for the highest revenue generator in 2021.

Market Segmentation

By technology: 2.5D, 3D

By end user: automotive, consumer electronics, medical devices, telecommunications, others

By region: China, Japan, South Korea, Taiwan, United States, Rest of the World (RoW)

The report also provides analysis of the key companies of the industry and their detailed company profiles including Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., GlobalFoundries Inc., Intel Corporation, JCET Group Co., Ltd., Powertech Technology Inc., Samsung Electronics Co., Ltd., Siliconware Precision Industries Co., Ltd. (SPIL), Taiwan Semiconductor Manufacturing Company Limited (TSMC), Tezzaron Semiconductor Corp., among others.

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Historical & Forecast Period

This research report provides analysis for each segment from 2018 to 2028 considering 2021 to be the base year.

Scope of the Report

• To analyze and forecast the market size of the global 2.5d and 3d semiconductor packaging market.
• To classify and forecast the global 2.5d and 3d semiconductor packaging market based on technology, end user, region.
• To identify drivers and challenges for the global 2.5d and 3d semiconductor packaging market.
• To examine competitive developments such as mergers & acquisitions, agreements, collaborations and partnerships, etc., in the global 2.5d and 3d semiconductor packaging market.
• To identify and analyze the profile of leading players operating in the global 2.5d and 3d semiconductor packaging market.

• Gain a reliable outlook of the global 2.5d and 3d semiconductor packaging market forecasts from 2022 to 2028 across scenarios.
• Identify growth segments for investment.
• Stay ahead of competitors through company profiles and market data.
• The market estimate for ease of analysis across scenarios in Excel format.
• Strategy consulting and research support for three months.
• Print authentication provided for the single-user license.