The Global Silicon Photonics and Photonic Integrated Circuits Market 2025-2035

The rapid growth of AI technology has put unprecedented demands on networks and data centers. Silicon photonics and photonic integrated circuits offer the most advanced networking solution to this problem. AI "factories" are a new class of data centers with extreme scale, and networking infrastructure must be reinvented to keep pace. The US-based artificial intelligence (AI) computing multinational NVIDIA recently announced its plan to leverage silicon photonics and co-packaged optics (CPO) to connect millions of GPUs in these AI factories.

Silicon photonics and photonic integrated circuits (PICs) represent a transformative technology at the intersection of semiconductors and optics, enabling the manipulation of light on silicon chips. As data centers face unprecedented bandwidth demands driven by AI workloads, cloud computing, and video streaming, traditional copper interconnects reach fundamental physical limitations in terms of bandwidth, power consumption, and density. Silicon photonics offers a solution by leveraging light's inherent advantages: higher bandwidth, lower latency, reduced power consumption, and immunity to electromagnetic interference.

The technology is particularly crucial now due to the exponential growth in AI/ML applications, which require massive data movement between processors, memory, and storage. Silicon photonics enables the high-bandwidth, energy-efficient interconnects essential for scaling these systems. Additionally, the convergence of silicon photonics with mature CMOS manufacturing processes allows for cost-effective production at scale, making widespread adoption increasingly viable.

Looking toward the future, silicon photonics will play a pivotal role in multiple frontier technologies. In quantum computing, PICs provide the precise control of photonic qubits necessary for quantum information processing. For next-generation sensing, PIC-based LiDAR systems will enable autonomous vehicles with improved performance and reduced cost. In telecommunications, silicon photonics will support the backbone of 5G/6G networks and beyond, meeting ever-increasing bandwidth demands.

As the technology matures, we're witnessing a transition from discrete optical components to highly integrated photonic circuits that combine multiple functions on a single chip, similar to the evolution seen in the electronic semiconductor industry. This integration, coupled with advanced packaging technologies like co-packaged optics, will continue to drive improvements in performance, energy efficiency, and cost, cementing silicon photonics as a foundational technology for our increasingly connected, data-intensive world.

The Global Silicon Photonics and Photonic Integrated Circuits Market 2023-2035 provides an in-depth analysis of the rapidly evolving silicon photonics and photonic integrated circuits (PICs) landscape, offering strategic insights into market dynamics, technology trends, and growth opportunities across multiple application segments from 2023 to 2035.

Key Report Features:
Material Platform Analysis: Comparative assessment of silicon, silicon nitride, lithium niobate, indium phosphide, and emerging material technologies
Application Segmentation: In-depth market forecasts for datacom, telecom, sensing, AI acceleration, and quantum computing applications
Manufacturing and Packaging: Evaluation of wafer processing challenges, yield management, and advanced packaging technologies including co-packaged optics
Competitive Landscape: Profiles of 186 companies across the entire value chain from materials suppliers to system integrators
Technology Roadmaps: Forecasts for product development timelines, performance improvements, and market adoption rates
Introduction to Silicon Photonics: Fundamental principles, comparative advantages over traditional technologies, and basic optical data transmission mechanisms
Materials and Components Analysis: Comprehensive review of platform technologies including silicon-on-insulator (SOI), germanium photodetectors, silicon nitride waveguides, thin-film lithium niobate, and hybrid integration approaches
Advanced Packaging Technologies: Detailed analysis of 2.5D and 3D integration technologies, through-silicon vias (TSVs), hybrid bonding, and co-packaged optics solutions

Market Applications in Depth:
Datacom: Data center architectures, transceiver evolution, co-packaged optics, and high-performance computing interconnects
Telecommunications: 5G/6G infrastructure, optical networking, and long-haul/metro applications
Sensing: LiDAR systems, chemical/biological sensing, and medical diagnostics
AI/ML: Photonic processors, neural network accelerators, and programmable photonic systems
Quantum: PIC-based quantum computing architectures, quantum communications, and single-photon sources

Market Forecasts 2023-2035:
Global market size and regional analysis
Segmentation by application, material platform, and component type
Pricing trends and volume projections for key product categories
Detailed forecasts for emerging segments including AI transceivers and quantum PICs
Supply Chain Analysis: Foundry landscape, fabless designers, integrated device manufacturers, and end-users
Technology Trends: Laser integration techniques, modulator innovations, photodetector developments, and waveguide advancements
Challenges and Future Directions: CMOS-foundry compatibility, power consumption issues, packaging optimization, and scalability solutions.

This report provides essential strategic intelligence for technology vendors, component manufacturers, system integrators, end-users, and investors to navigate the complex and rapidly evolving silicon photonics ecosystem. With detailed technical benchmarking, market forecasts, and competitive analysis, the report enables stakeholders to identify growth opportunities, anticipate technological disruptions, and develop informed strategies for this transformative market.

The report provides comprehensive profiles of 183 companies across the silicon photonics and photonic integrated circuits ecosystem, including Accelink Technologies, Aeva Technologies, Aeponyx, Advanced Fiber Resources, AIM Photonics, AIO Core, Alibaba Cloud, Amazon (AWS), ANSYS, Advanced Micro Foundry (AMF), Amkor Technology, AMO GmbH, Analog Photonics, Anello Photonics, Aryballe, A*STAR, ASE Holdings, Aurora Innovation, Axalume, AXT, Ayar Labs, Baidu, Bay Photonics, BE Epitaxy Semiconductor, Broadcom, Black Semiconductor, Broadex, ByteDance, Cadence, Camgraphic, CEA LETI, Celestial AI, Centera Photonics, Cambridge Industries Group (CIG), Ciena Corporation, CISCO Systems, CNIT, Coherent Corp., CompoundTek, Cornerstone, Crealights Technology, DustPhotonics, EFFECT Photonics, Eoptolink (Alpine Optoelectronics), Ephos, Epiphany, Fabrinet, Fast Photonics, Fiberhome, Fibertop China Shen Zhen Fibertop Technology, ficonTEC, FormFactor, Fujitsu, Genalyte, Gigalight, GlobalFoundries, HGGenuine, Hisense Broadband, HyperLight, HyperPhotonix, Icon Photonics, InnoLight Technology, Innosemi, IntelliEpi, Inphotec, Intel, Imec, IMECAS, iPronics, JABIL, JCET Group, JFS Laboratory, JSR Corporation, Juniper Networks, Ki3 Photonics, LandMark, Leoni AG, Ligentec, Lightelligence, Lightium, Lightmatter, Lightsynq Technologies, Lightwave Logic, Light Trace Photonics, Liobate Technologies, LioniX International, LPKF, Lumentum, Luceda, Luminous Computing, LuminWave Technology, Lumiphase AG, Luxshare Precision Industry, Luxtelligence SA, MACOM, Marvell, Molex, NanoLN, NanoWired, NEC Corporation, NewPhotonics, NGK Insulators, NLM Photonics, Nokia Corporation, Novel Si Integration Technology, NTT Corporation, Nvidia, O-Net, OpenLight Photonics, OriChip Optoelectronics Technology, Partow Technologies, PETRA, Phix, PHOTON IP, and many more. Each profile includes company background, technology focus, product offerings, manufacturing capabilities, partnerships, and market positioning to provide a complete view of the competitive landscape and ecosystem relationships.


  • EXECUTIVE SUMMARY
    • Market Overview
    • Electronic and Photonic Integration Compared
      • Table Silicon Photonics vs. Electronics: Key Metrics Comparison.
    • Silicon Photonic Transceiver Evolution
    • Market Map
    • Global Market Trends in Silicon Photonics
    • Competing and Complementary Photonics Technologies
      • Table Photonic Technologies Comparative Analysis.
      • Metaphotonics
      • III-V Photonics
      • Lithium Niobate Photonics
      • Polymer Photonics
      • Plasmonic Photonics
    • Potential of photonic AI acceleration
      • Table Comparison between electronic and photonic computing.
    • Commercial deployment of silicon photonics
      • Table Electronics companies silicon photonics commercial activities.
    • Manufacturing challenges
      • Table Manufacturing Metrics & Challenges.
      • Table Manufacturing Targets vs Current State.
  • INTRODUCTION TO SILICON PHOTONICS
    • What is Silicon Photonics?
      • Definition and Principles of Silicon Photonics
      • Comparison with traditional technologies
        • Table Comparative cost analysis.
        • Table Challenges for CMOS-Foundry-Compatible Photonic Devices.
      • Silicon and Photonic Integrated Circuits
        • Table Silicon Photonics Integration Schemes.
        • Table Benefits of PICs.
        • Table Current & Future Photonic Integrated Circuits Applications.
      • Optical IO, Coupling and Couplers
      • Emission and Photon Sources/Lasers
      • Detection and Photodetectors
        • Table Photodetector Performance.
      • Compound Semiconductor Lasers and Photodetectors (III-V)
        • Table III-V Device Performance.
      • Modulation, Modulators, and Mach-Zehnder Interferometers
        • Table Optical Modulator Performance Comparison.
      • Light Propagation and Waveguides
        • Table Silicon Photonic Waveguide Characteristics.
      • Optical Component Density
        • Table Optical Component Integration Metrics.
    • Advantages of Silicon Photonics
      • Table Advantages of Silicon Photonics.
    • Applications of Silicon Photonics
      • Table Applications of Silicon Photonics.
    • Comparison with Other Photonic Integration Technologies
      • Table Comparison with Other Photonic Integration Technologies.
    • Evolution from Electronic to Photonic Integration
    • Silicon Photonics vs Traditional Electronics
      • Table Silicon Photonics vs Traditional Electronics: Performance Metrics.
    • Modern high-performance AI data centers
      • Table Switch IC Bandwidth and CPO Technology Evolution.
      • Table Challenges in data center architectures.
      • Table Key Trends of Optical Transceivers in High-End Data Centers.
    • Core Technology Components
      • Table Core Components Specifications and Requirements
      • Optical IO, Coupling and Couplers
      • Emission and Photon Sources/Lasers
        • Table Types of Emission and Photon Sources/Lasers.
        • Table III-V Integration Challenges.
        • Table Laser Integration Approaches Comparison.
      • Detection and Photodetectors
      • Modulation Technologies
        • Table Modulator Types and Configurations.
      • Light Propagation and Waveguides
        • Table Waveguide Specifications and Requirements.
      • Optical Component Density
    • Basic Optical Data Transmission
      • Table Data Transmission Parameters and Specifications.
    • Silicon Photonic Circuit Architecture
      • Table Circuit Architecture Building Blocks.
      • Table Integration Approaches.
  • MATERIALS AND COMPONENTS
    • Silicon
      • Silicon as a Photonic Material
        • Table Silicon Photonics Component Specifications.
        • Table Optical Properties of Silicon.
        • Table Fabrication Processes for Silicon Photonics.
      • Silicon and Silicon-on-insulator (SOI)
        • Table Silicon Foundry Technology Comparison.
        • Table Silicon-on-insulator (SOI) Platform Benchmarking.
        • Table SOI Performance Benchmarks.
        • Table Key SOI Players.
    • Germanium
      • Germanium Integration in Silicon Photonics
        • Table Germanium Integration Methods and Applications.
      • Germanium Photodetectors
      • Germanium-on-Silicon Modulators
    • Silicon Nitride
      • Silicon Nitride (SiN) in Photonics Integrated Circuits
        • Table SiN Key Foundries.
      • Optical Properties and Fabrication of SiN
      • SiN Modulator Technologies
        • Table SiN Modulator Technologies.
      • SiN Applications in Photonics Integrated Circuits
        • Table Silicon (SOI and SiN) Device Heterogeneous Integration.
      • Advances in SiN Modulator Technologies
      • SiN-based Waveguides and Devices
      • SiN Performance Analysis
        • Table SiN Benchmarking.
      • Applications of SiN in Photonics
        • Table Applications of SiN in Photonics.
      • SiN PIC Players
        • Table SiN PIC Players.
    • Thin Film Lithium Niobate (TFLN)
      • Overview
        • Table Benchmarking of TFLN.
      • Lithium Niobate on Insulator (LNOI)
        • Table Characteristics and Properties of LNOI.
        • Table LNOI Fabrication Processes.
        • Table LNOI-based Modulator and Switch Technologies.
        • Table Emerging LNOI Device Technologies.
    • Indium Phosphide
      • Indium Phosphide (InP) Integration
        • Table InP Benchmarking.
        • Table Integration Technologies.
      • InP PIC Players
        • Table InP PIC Players.
    • Barium Titanite and Rare Earth metals
      • Table BTO Benchmarking.
      • Table Comparative analysis of materials.
      • Barium Titanate (BTO) Modulators
    • Organic Polymer on Silicon
      • Table Benchmarking of Polymer on Insulator.
      • Polymer-based Modulators
    • Wafer Processing
      • Wafer Sizes by Platform
        • Table Wafer Size Comparison by Platform.
      • Processing Challenges
        • Table Wafer Processing Challenges.
      • Yield Management
        • Table Yield Analysis by Process Step.
    • Hybrid and Heterogeneous Integration
      • Table Integration Scheme Comparison.
      • Monolithic Integration
      • Hybrid Integration
      • Heterogeneous Integration
      • III-V-on-Silicon
      • Bonding and Die-Attachment Techniques
        • Table Bonding and Die-Attachment Techniques.
      • Monolithic versus Hybrid Integration
        • Table Monolithic versus Hybrid Integration.
  • ADVANCED PACKAGING TECHNOLOGIES
    • Evolution of Packaging Technologies
      • Table Packaging Technology Comparison Matrix.
      • Table Evolution of semiconductor packaging.
      • Traditional Packaging Approaches
      • Advanced Packaging Roadmap
        • Table Summary of key advanced semiconductor packaging approaches.
      • Key Performance Metrics
        • Table Key Performance Metrics for Advanced Packaging Technologies.
    • 5D Integration Technologies
      • Silicon Interposer Technology
      • Glass Interposer Solutions
        • Table Glass Interposer Solutions.
      • Organic Substrate Options
        • Table Organic Substrate Options.
    • 3D Integration Approaches
      • Through-Silicon Via (TSV)
        • Table TSV Specifications by Application.
        • Table TSV Challenges and Solutions.
      • Hybrid Bonding Technologies
        • Table Comparative benchmark overview table of key semiconductor interconnection technologies
    • Co-Packaged Optics (CPO)
      • CPO Architecture Overview
      • Benefits and Challenges
        • Table CPO Benefits and Challenges.
        • Table Performance Metrics Comparison.
      • Integration Approaches
        • Table CPO Integration Approaches Comparison.
        • Table Manufacturing Process Comparison.
      • Thermal Management
        • Table Thermal Management Approaches.
      • Optical Coupling Solutions
        • Table Optical Coupling Solutions.
    • Optical Alignment
      • Table Alignment Tolerance Analysis.
      • Active vs Passive Alignment
        • Table Active vs Passive Alignment Comparison.
      • Coupling Efficiency
        • Table Coupling Efficiency Analysis.
    • Manufacturing Challenges
      • Table Advanced packaging manufacturing challenges.
  • MARKETS AND APPLICATIONS
    • Datacom Applications
      • Table Energy Consumption Analysis.
      • Data Center Architecture Evolution
      • Transceivers
      • Artificial intelligence (AI) and machine learning (ML)
      • Pluggable optics
      • Linear drive and linear pluggable optics (LPO)
      • Interconnects
        • Table Key Metrics for Advanced Semiconductor Packaging Performance.
        • Table Pluggable Optics vs. Co-Packaged Optics (CPO).
        • Table Future Challenges in Co-Packaged Optics (CPO).
        • Table Key Technology Building Blocks for Co-Packaged Optics.
        • Table Key Packaging Components for Co-Packaged Optics.
        • Table Key Players in Photonic Quantum Computing.
        • Table Comparison of PICs vs Traditional Optical Systems.
        • Table Future PIC Requirements of the Quantum Industry.
      • Optical Transceivers
        • Table Optical Transceivers Market Players.
      • Co-Packaged Optics for Switches
        • Table Power and Performance Benefits.
        • Table Implementation Challenges.
      • Data Center Networks
      • High-Performance Computing
        • Table Silicon Photonics in HPC: Technical Parameters
      • Chip-to-Chip and Board-to-Board Interconnects
      • Ethernet Networking
    • Telecommunications
      • Table Applications of Silicon Photonics in Telecommunications.
      • 5G/6G Infrastructure
      • Bandwidth Requirements
        • Table Bandwidth Requirements by Segment.
      • Long-Haul and Metro Networks
      • 5G and Fiber-to-the-X (FTTx) Applications
        • Table 5G and FTTx Applications Technical Parameters.
      • Optical Transceivers and Transponders
    • Sensing Applications
      • Lidar and Automotive Sensing
        • Table Opportunities for PIC Sensors in LiDAR Applications.
        • Table Challenges of PIC-based FMCW LiDARs.
        • Table Companies Developing PIC-based LiDAR.
      • Chemical and Biological Sensing
        • Table Companies Developing PIC Biosensors.
        • Table Companies Developing PIC-based Gas Sensors.
        • Table Companies Developing Spectroscopy PICs.
      • Optical Coherence Tomography
    • Artificial Intelligence and Machine Learning
      • AI Data Traffic Requirements
        • Table AI Data Traffic Requirements. Application Type
      • Silicon Photonics for AI Accelerators
      • Photonic Processors
      • Photonic Processing for AI
      • Programmable Photonics
      • Neural Network Applications
        • Table Neural Network Applications.
      • Future AI Architecture Requirements
        • Table Future AI Architecture Requirements.
    • Quantum Computing and Communication
      • Quantum Photonic Requirements
        • Table Quantum Photonic Requirements.
      • Integration Challenges
        • Table Integration Challenges in Quantum Computing and Communication.
      • Photonic Platform Quantum Computing
      • PICs for Quantum systems
      • Operational cycle of photonic quantum computers
        • Table Future PIC Requirements of the Quantum Industry.
        • Table Roadmap for Photonic Quantum Hardware.
      • Market Players and Development
        • Table Market players and development.
    • Biophotonics and Medical Diagnostics
      • Table Biophotonics Applications.
  • GLOBAL MARKET SIZE
    • Global Silicon Photonics and Photonic Integrated Circuits Market Overview
      • Market Size and Growth Trends
        • Table Global Market for Silicon Photonics and Photonic Integrated Circuits 2023-2035 (Billions USD).
      • Market Segmentation by Application
        • Table Market Segmentation by Application 2023-2035 (Billions USD).
        • Table Silicon Photonics and Photonic Integrated Circuits Server Boards, CPUs and GPUs/Accelerators Forecast.
      • Modules & PICs (Dies) Market Forecast 2023-2035
        • Table Modules & PICs (Dies) Market Forecast 2023-2035.
      • SOI Wafers Market Forecast 2023-2035
        • Table SOI Wafers Market Forecast 2023-2035.
      • LPO & New Modulator Materials Market Forecast 2023-2035
        • Table LPO & New Modulator Materials Market Forecast 2023-2035.
    • Datacom Applications
      • Market Forecast 2023-2035
        • Table Market Forecast for Silicon Photonics in Datacom Applications 2023-2035 (Billions USD).
        • Table Modules Market Forecast 2023-2035.
        • Table PICs (Dies) Market Forecast 2023-2035.
        • Table PIC Transceivers for AI Units Forecast, 2023-2035.
        • Table PIC Transceiver Pricing.
        • Table PIC Datacom Transceiver Market Forecast, 2025-2035.
        • Table PIC Datacom Transceiver Revenue Forecast
        • Table Quantum PIC Market Forecast, 2023-2035.
      • Key Drivers and Restraints
        • Table Key market drivers and restraints for silicon photonics in Datacom Applications.
    • Telecom Applications
      • Market Forecast 2023-2035
        • Table Market Forecast for Silicon Photonics in Telecom Applications 2023-2035 (Billions USD)
      • Key Drivers and Restraints
        • Table Key market drivers and restraints for silicon photonics in Telecom Applications.
    • Sensing Applications
      • Market Forecast 2023-2035
        • Table Market Forecast for Silicon Photonics in Sensing Applications 2023-2035 (Billions USD).
      • PIC-based Sensor Market Forecast
      • PIC-based LiDAR Market Forecast, 2023-2035
      • Key Drivers and Restraints
        • Table Key market drivers and restraints for silicon photonics in Sensing Applications.
    • Photonic Integrated Circuit Market, by Material
      • Table Photonic Integrated Circuit Market, by Material, 2023-2035.
  • SUPPLY CHAIN ANALYSIS
    • Foundries and Wafer Suppliers
      • CMOS Foundries
        • Table CMOS Foundries.
      • Specialty Photonics Foundries
        • Table Specialty Photonics Foundries.
    • Integrated Device Manufacturers (IDMs)
      • Fabless Companies
        • Table Fabless Companies.
      • Fully Integrated Photonics Companies
        • Table Fully Integrated Photonics Companies.
    • Foundries and Wafer Suppliers
      • Table Foundries and Wafer Suppliers.
    • Packaging and Testing
      • Chip-Scale Packaging
      • Module-Level Packaging
      • Testing and Characterization
    • System Integrators and End-Users
      • Table System Integrators and End-Users.
  • TECHNOLOGY TRENDS
    • Laser Integration Techniques
      • Table Laser Integration Methods Comparison.
      • Direct Epitaxial Growth
      • Flip-Chip Bonding
      • Hybrid Integration
      • Advances and Challenges
        • Table Advanced Techniques and Challenges.
    • Modulator Technologies
      • Table Modulator Technology Benchmarking.
      • Silicon Modulators
      • Germanium Modulators
      • Lithium Niobate Modulators
      • Polymer Modulators
    • Photodetector Technologies
      • Table Photodetector Performance Metrics .
      • Silicon Photodetectors
      • Germanium Photodetectors
      • III-V Photodetectors
    • Waveguide and Coupling Innovations
      • Silicon Waveguides
      • Silicon Nitride Waveguides
      • Coupling Techniques
    • Packaging and Integration Advancements
      • Chip-Scale Packaging
      • Wafer-Scale Integration
      • 3D Integration and Interposer Technologies
  • CHALLENGES AND FUTURE TRENDS
    • CMOS-Foundry-Compatible Devices and Integration
      • Scaling and Miniaturization
      • Process Complexity and Yield Improvement
    • Power Consumption and Thermal Management
      • Energy-Efficient Photonic Devices
      • Thermal Optimization Techniques
    • Packaging and Testing
      • Advanced Packaging Solutions
      • Automated Testing and Characterization
    • Scalability and Cost-Effectiveness
      • Wafer-Scale Integration
      • Outsourced Semiconductor Assembly and Test (OSAT)
    • Emerging Materials and Hybrid Integration
      • Novel Semiconductor Materials
        • Table Novel semiconductor materials for silicon photonics.
      • Heterogeneous Integration Approaches
  • COMPANY PROFILES
    • Accelink Technologies, Co. Ltd.
    • Aeva Technologies, Inc.
    • Aeponyx
    • Advanced Fiber Resources (AFR)
    • AIM Photonics
    • AIO Core
    • Alibaba Cloud
    • Amazon (AWS)
    • ANSYS, Inc.
    • Advanced Micro Foundry (AMF)
    • Amkor Technology
    • AMO GmbH
    • Analog Photonics
    • Anello Photonics
    • Aryballe
    • A*STAR
    • ASE Holdings
    • Aurora Innovation, Inc.
    • Axalume
    • AXT
    • Ayar Labs
    • Baidu
    • Bay Photonics
    • BE Epitaxy Semiconductor
    • Broadcom
    • Black Semiconductor
    • Broadex
    • ByteDance
    • Cadence
    • Camgraphic
    • CEA LETI
    • Celestial AI
    • Centera Photonics
    • Cambridge Industries Group (CIG
    • Ciena Corporation
    • CISCO Systems, Inc.
    • CNIT
    • Coherent Corp.
    • CompoundTek
    • Cornerstone
    • Crealights Technology (Suzhou) Co., Ltd.
    • DustPhotonics
    • EFFECT Photonics
    • Eoptolink (Alpine Optoelectronics)
    • Ephos
    • Epiphany
    • Fabrinet
    • Fast Photonics
    • Fiberhome
    • Fibertop China Shen Zhen Fibertop Technology Co., Ltd.
    • ficonTEC
    • FormFactor, Inc.
    • Fujitsu
    • Genalyte
    • Gigalight
    • GlobalFoundries, Inc.
    • HGGenuine
    • Hisense Broadband
    • HyperLight
    • HyperPhotonix
    • Icon Photonics
    • InnoLight Technology
    • Innosemi
    • IntelliEpi
    • Inphotec
    • Intel
    • Imec
    • IMECAS
    • iPronics
    • JABIL
    • JCET Group
    • JFS Laboratory
    • JSR Corporation
    • Juniper Networks
    • Ki3 Photonics
    • LandMark
    • Leoni AG
    • Ligentec
    • Lightelligence
    • Lightium
    • Lightmatter
    • Lightsynq Technologies, Inc.
    • Lightwave Logic
    • Light Trace Photonics
    • Liobate Technologies
    • LioniX International
    • LPKF
    • Lumentum
    • Luceda
    • Luminous Computing
    • LuminWave Technology
    • Lumiphase AG
    • Luxshare Precision Industry Co., Ltd.
    • Luxtelligence SA
    • MACOM
    • Marvell
    • Molex
    • NanoLN
    • NEC Corporation
    • NewPhotonics
    • NGK Insulators
    • NLM Photonics
    • Nokia Corporation
    • Novel Si Integrqtion Technology
    • NTT Corporation
    • Nvidia
    • O-Net
    • OpenLight Photonics
    • OriChip Optoelectronics Technology Co. Ltd.
    • Partow Technologies
    • PETRA
    • Phix
    • PHOTON IP
    • Photonic, Inc.
    • POET Technologies
    • Pointcloud
    • Polariton Technologies
    • PsiQuantum
    • Q.ANT
    • QC82
    • Quandela
    • Quantum Computing Inc.
    • Quantum Source
    • Quantum Transistors
    • Quintessent
    • QuiX Quantum
    • Qutronix
    • Rain Tree Photonics
    • Ranovus
    • Rapid Photonics
    • Salience Labs
    • Samsung
    • Sanan IC
    • Scantinel Photonics
    • Scintil Photonics
    • Sentea
    • ShinEtsu
    • Sicoya GmbH
    • SiFotonics Technologies, Co., Ltd.
    • SiLC Technologies
    • Silex Microsystems
    • Silicon Extreme
    • SiLUX
    • SilTerra
    • SiPhotonIC
    • Sivers Photonics
    • Skorpios Technologies
    • Skywater Technology
    • SOITEC
    • Source Photonics
    • Spark Photonics
    • Sparrow Quantum ApS
    • SRICO
    • SteerLight
    • STMicroelectronics
    • Super Photonics Integrated Circuit Xiamen
    • sureCore Ltd.
    • Synopsys
    • TDK
    • Tencent
    • Teramount
    • Teraxion
    • Tower Semiconductor Ltd.
    • Tokyo Ohka Kogyo Co., Ltd. (TOK)
    • TSMC
    • TuringQ
    • Ultra-low Loss Technologies
    • UMEC
    • United Microelectronics (UMC)
    • Versics AG
    • Vexlum Oy
    • Viqthor
    • VLC Photonics
    • Voyant Photonics
    • VPEC
    • Wave Photonics
    • Xanadu
    • X-FAB
    • Xphor
    • Xscape Photonics
    • Yuanjie Semiconductor Technology
    • ZKTel
    • ZTE Corporation
  • APPENDICES
    • Glossary of Terms
      • Table Glossary of terms.
    • List of Abbreviations
      • Table List of abbreviations.
    • Research Methodology
  • REFERENCES

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