The Global Market for Advanced Semiconductor Packaging 2024-2035
The global landscape of semiconductor manufacturing is rapidly evolving, with advanced packaging emerging as a critical component of manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. Advanced packaging allows for the creation of faster, cost-effective systems by integrating various chips, a technique that's increasingly essential given the physical limitations of traditional chip miniaturization. It is reshaping the industry, enabling the integration of diverse chip types and enhancing processing speeds.
The U.S. government recognizes the importance of advanced packaging and has introduced a $3 billion National Advanced Packaging Manufacturing Program aimed at establishing high-volume packaging facilities by the end of the decade. The focus on packaging complements the existing efforts under the CHIPS and Science Act, emphasizing the interconnectedness of chipmaking and packaging.
The Global Market for Advanced Semiconductor Packaging 2024-2035 provides a comprehensive analysis of the global advanced semiconductor packaging technologies market from 2020-2035. It encompasses packaging approaches like wafer-level packaging, 2.5D/3D integration, chiplets, fan-out, and flip chip, analyzing market values in the billions (USD) by type, region, and end-use application.
Trends analyzed include heterogeneous integration, interconnects, thermal solutions, miniaturization, supply chain maturity, simulation/data analytics. Leading companies profiled include TSMC, Samsung, Intel, JCET, Amkor. Applications covered include AI, mobile, automotive, aerospace, IoT, communications (5G/6G), high performance computing, medical, and consumer electronics.
Regional markets explored include North America, Asia Pacific, Europe, China, Japan, and RoW. The report also assesses drivers like ML/AI, data centers, EV/ADAS; challenges like costs, complexity, reliability; emerging approaches like system-in-package, monolithic 3D ICs, advanced substrates, novel materials. Overall an in-depth benchmark analysis of the opportunities within the advancing semiconductor packaging industry.
Report contents include:
Market size and forecasts
Key technology trends
Growth drivers and challenges
Competitive landscape analysis
Future packaging trends outlook
In-depth analysis of wafer level packaging (WLP)
System-in-Package (SiP) and heterogeneous integration
Monolithic 3D ICs overview
Advanced semiconductor packaging applications across key markets: AI, mobile, automotive, aerospace, IoT, communications, HPC, medical, consumer electronics
Regional market breakdown
Assessment of key industry challenges: complexity, costs, supply chain maturity, standards
Company profiles: Strategies and technologies of 128 key players. Companies profiled include 3DSEMI, Amkor, Chipbond, ChipMOS, Intel Corporation, Leader-Tech Semiconductor, Powertech, Samsung Electronics, Silicon Box, SJ Semiconductor Corp., SK hynix, SPIL, Tongfu, Taiwan Semiconductor Manufacturing Company (TSMC) and Yuehai Integrated (Full list of companies profiled in table of contents).
- RESEARCH METHODOLOGY
- EXECUTIVE SUMMARY
- Semiconductor Packaging Technology Overview
- Key challenges
- Evolution of semiconductor packaging
- Table Evolution of semiconductor packaging.
- Conventional packaging approaches
- Advanced packaging approaches
- Table Summary of key advanced semiconductor packaging approaches.
- Semiconductor Supply Chain
- Advanced Packaging Supply Chain
- Key Technology Trends in Advanced Packaging
- Table Key Technology Trends in Advanced Semiconductor Packaging.
- Market Growth Drivers
- Table Market Growth Drivers for advanced semiconductor packaging.
- Competitive Landscape
- Market Challenges
- Table Challenges Facing Advanced Packaging Adoption.
- Future outlook
- Heterogeneous Integration
- Chiplets and Die Disaggregation
- Advanced Interconnects
- Scaling and Miniaturization
- Thermal Management
- Materials Innovation
- Supply Chain Developments
- Role of Simulation and Data Analytics
- Semiconductor Packaging Technology Overview
- SEMICONDUCTOR PACKAGING TECHNOLOGIES
- Transistor Device Scaling
- Overview
- Heterogeneous Architecture Transition
- Co-Design Focus Areas
- Table Challenges in transistor scaling.
- Wafer Level Packaging
- Fan-Out Wafer Level Packaging
- Chiplets
- Table Use cases and benefits of using chiplets in semiconductor design.
- AMD EPYC and Ryzen processor families
- Disaggregation Needs
- Interconnection in Semiconductor Packaging
- Table Specifications of interconnection methods.
- Overview
- Table Interconnection technique in semiconductor packaging
- Wire Bonding
- Flip-chip bonding
- Interposer
- Table Passive vs active interposer.
- Through-silicon via (TSV) bonding
- Hybrid bonding with chiplets
- Table Comparative benchmark overview table of key semiconductor interconnection technologies
- 2.5D and 3D Packaging
- 2.5D packaging
- Table Fan-out packaging process overview.
- Table Comparison between mainstream silicon dioxide (SiO2) and leading organic dielectrics for electronic interconnect substrates.
- Table Benefits of glass in 2.5D glass-based packaging.
- Table Comparison between key properties of glass and polymer molding compounds commonly used in semiconductor packaging applications.
- Table Challenges of glass semiconductor packaging.
- Table Comparison between silicon, organic laminates and glass as packaging substrates.
- Table 2.5D vs. 3D packaging.
- Table 2.5D packaging challenges.
- Table Market players in 2.5D packaging.
- 3D packaging
- Table Advantages and disadvantages of 3D packaging.
- Table Comparison between 2.5D, 3D micro bump, and 3D hybrid bonding.
- Table Challenges in 3D Hybrid Bonding.
- Table Challenges in scaling bumps.
- Table Key methods for enabling copper-to-copper (Cu-Cu) hybrid bonding in advanced semiconductor packaging:
- Table Micro bumps vs Cu-Cu bumpless hybrid bonding.
- 2.5D packaging
- Transistor Device Scaling
- WAFER-LEVEL PACKAGING
- Introduction
- Benefits
- Table Benefits of Wafer-Level Packaging.
- Types of Wafer Level Packaging
- Table Types of wafer level packaging.
- Wafer Level Chip Scale Packaging
- Wafer Level Fan-Out Packaging
- Wafer Level Fan-In Packaging
- Other Types of WLP
- WLP Manufacturing Processes
- Wafer Preparation
- RDL Buildup
- Bumping
- Encapsulation
- Integration
- Test and Singulation
- Wafer Level Packaging Trends
- Table Key trends shaping wafer level packaging.
- Applications of Wafer Level Packaging
- Mobile and Consumer Electronics
- Automotive Electronics
- IoT and Industrial
- High Performance Computing
- Aerospace and Defense
- Wafer Level Packaging Outlook
- SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION
- Introduction
- Approaches for heterogenous integration
- Technology Building Blocks
- SiP Manufacturing Approaches
- Table Packaging approaches utilized for assembling System-in-Package modules.
- 2.5D Integrated Interposers
- Multi-Chip Modules
- 3D Stacked packages
- Fan-Out Wafer Level Packaging
- Flip Chip Package-on-Package
- SiP Component Integration
- Table Considerations for integrating key component categories into system-in-package (SiP) modules/
- Heterogeneous Integration Drivers
- Table Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages.
- Trends Driving SiP Adoption
- Table Key trends influencing adoption of System-in-Package modules.
- SiP Applications
- Table System-in-package (SiP) module applications.
- SiP Industry Landscape
- Future Outlook on Heterogeneous Integration
- MONOLITHIC 3D IC
- Overview
- Transitioning from 2D Systems
- Motivation for developing monolithic 3D manufacturing
- Improved M3D Interconnect Density
- Heterogenous 3D vs Monolithic 3D
- Table Comparison between heterogeneous 3D integration and monolithic 3D integration.
- 2D Materials
- Table Key 2D materials in monolithic 3D integrated circuits.
- Benefits
- Table Benefits of monolithic 3D ICs.
- Challenges
- Table Challenges of monolithic 3D ICs.
- Future outlook
- Overview
- MARKETS AND APPLICATIONS
- Market value chain
- SiP OEM/Designers
- Chiplet OEM/Designer and Chiplet Foundry
- Chiplet Integrator
- Material Suppliers
- Equipment Suppliers
- Substrate and PCB suppliers
- EDA Tools Suppliers
- Interposer Foundry
- Packaging trends by market
- Table Advanced semiconductor packaging trends by market.
- Mobile Devices
- High-Performance Computing (HPC)
- Automotive
- Internet of Things (IoT)
- Consumer Electronics
- Aerospace and Defense
- Medical Devices
- Design requirements
- Table Design requirements in advanced packaging, by market.
- Artificial Intelligence (AI)
- Challenges in AI
- Advanced Packaging Solutions
- Addressing AI Challenges through Advanced Packaging
- Applications
- Mobile Devices
- Challenges
- Advanced Packaging Solutions
- Addressing Challenges through Advanced Packaging
- Applications
- Future trends
- High Performance Computing (HPC)
- Challenges
- Advanced Packaging Solutions for HPC
- Addressing HPC Challenges through Advanced Packaging
- Applications
- Future Trends
- Automotive Electronics
- Challenges
- Advanced Packaging Solutions for Automotive Electronics
- Addressing Automotive Electronics Challenges through Advanced Packaging
- Applications
- Future Trends
- Internet of Things (IoT) Devices
- Challenges
- Advanced Packaging Solutions for IoT Devices
- Addressing IoT Device Challenges through Advanced Packaging
- Applications
- Future Trends
- 5G & 6G Communications Infrastructure
- Challenges
- Trends in 5G and 6G packaging
- Advanced Packaging Solutions for 5G and 6G Communications Infrastructure
- Addressing 5G and 6G Infrastructure Challenges through Advanced Packaging
- Applications
- Future Trends
- Aerospace and Defense Electronics
- Challenges
- Advanced Packaging Solutions for Aerospace and Defense Electronics
- Addressing Aerospace and Defense Electronics Challenges through Advanced Packaging
- Applications
- Future Trends
- Medical Electronics
- Challenges
- Advanced Packaging Solutions for Medical Electronics
- Addressing Medical Electronics Challenges through Advanced Packaging
- Applications
- Future Trends
- Consumer Electronics
- Challenges
- Advanced Packaging Solutions for Consumer Electronics
- Addressing Consumer Electronics Challenges through Advanced Packaging
- Applications
- Future Trends
- Additive manufacturing for advanced packaging
- Silicon photonics
- Global market (Revenues)
- By type
- Table Global market for Advanced semiconductor packaging, 2020-2035, by packaging type, (billions USD).
- By market
- Table Global market for Advanced semiconductor packaging, 2020-2035, by end use market (billions USD).
- By region
- Table Recent expansion activities by companies in Malaysia.
- Table Global market for Advanced semiconductor packaging, 2020-2035, by region (billions USD).
- By type
- Market value chain
- MARKET PLAYERS
- Integrated Device Manufacturers
- Outsourced Semiconductor Assembly and Test (OSAT) Companies
- Foundries
- Table Main Global Wafer Foundry Companies 2023.
- Electronics OEMs
- Packaging Equipment and Materials Companies
- MARKET CHALLENGES
- Table Market challenges for advanced semiconductor packaging.
- COMPANY PROFILES
- AaltoSemi
- Absolic, Inc.
- ACCRETECH (Europe) GmbH
- Adeia, Inc.
- Advanced Micro Devices, Inc. (AMD)
- Table AMD AI chip range.
- Analog Devices, Inc. (ADI)
- Amkor Technology
- Anmuquan Intelligent Technology (AMQ Intelligent)
- Apple
- Applied Materials
- Ardentec Corporation
- ARM
- ASE
- ASMPT Ltd
- Besi
- Biren Technology
- Blue Ocean Smart System
- Brewer Science
- Broadcom
- BroadPak
- Cambricon Technologies Co.,
- Capcon Semiconductor
- CAS Microelectronics Integration
- CD Micro-Technology
- CEA-Leti
- Cerebras
- China Wafer Level CSP Co
- Chipbond Technology Corporation
- Chipletz
- ChipMOS Technologies, Inc.
- Corning
- Dewo Advanced Automation (DAA
- Disco
- Dupont
- Ebara
- Eliyan
- EMC Semi-Conductor Technology
- EPS Technology
- Entegris
- EV Group
- GlobalFoundries
- Global Unichip
- Gloway
- Goldenscope Tech
- Gona Semiconductor Technology
- Graphcore
- Greatek Electronics Inc
- Hangke Chuangxing (Aero Inno-Star)
- Hanmi Semiconductor
- HiSilicon
- HLMC (Shanghai Huali Microelectronics Corporation)
- Huatian Huichuang Technology (Xi'an) Co., Ltd.
- Huawei
- Ibiden
- IBM
- ICLeague Technology Co Ltd
- IMEC
- Infineon Technologies AG
- Integra
- Inari Amertron Berhad
- Intel Corporation
- Table Intel's products that adopt 3D FOVEROS.
- JCET Group
- Jiangsu IC Assembly & Test (ICAT)
- Jingdu Semiconductor
- Keyang Semiconductor (KYS)
- King Yuan Electronics Co., Ltd.
- Kioxia
- KyLitho
- Kyocera
- Lam Research
- Lapis Technology
- LB Semicon Co Ltd
- Leading Interconnect Semiconductor Technology
- Lidrotec GmbH
- Lux Semiconductors
- Malaysian Pacific Industries Berhad
- Micron Technology, Inc.
- Mediatek
- Micross Components
- Mitsubishi
- National Center For Advanced Packaging China (NCAP China)
- NEC
- Nvidia Corporation
- Nepes Corporation
- Onsemi
- Orient Semiconductor Electronics Ltd.
- Panasonic
- Powertech Technology Inc.
- Pragmatic Semiconductor
- Qorvo
- Renesas
- Rigger Micro Technologies (RMT)
- Rohm
- Rong Semiconductor
- Samsung Electronics
- Samtec, Inc.
- Schott AG
- Sharp
- Shinko Electric Industries
- Showa Denko
- Sigurd Microelectronics Corporation
- Silicon Box
- Siliconware Precision Industries (SPIL)
- SJ Semiconductor
- SK Hynix
- Skywater
- Sony Corporation
- Starmask
- STMicroelectronics
- Suss Microtec
- SZLQ Intelligence (Suzhou Lieqi Intelligent Equipment)
- Taiwan Semiconductor Manufacturing Company (TSMC)
- Techsense International
- Tezzaron Semiconductor
- Tongfu Microelectronics Co., Ltd.
- Texas Instruments
- Tokyo Seimitsu Co., Ltd.
- Tong Hsing Electronic Industries, Ltd.
- Toshiba
- Tower Semiconductor
- Unimicron
- Unisem
- UTAC Group
- Walton Advanced Engineering Inc.
- Winstek Semiconductor Technology Co., Ltd.
- Xinhe Semiconductor
- Yibu Semiconductor
- Yuehai Integrated
- REFERENCES
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