Substrate-like PCB: Global Industry Analysis 2018-2022 and Opportunity Assessment 2023-2033
A recent market study published by FMI on Substrate-like PCB offers a global industry analysis for 2018-2022 and opportunity assessment for 2023-2033. The study offers a comprehensive assessment of the most important market dynamics. After conducting thorough research on the historical and current growth parameters, the growth prospects of the market are obtained with maximum precision.
Market Segmentation
By Line or Space Type:
- Less than 25/25 µm
- 25/25 µm and 30/30 µm
By Inspection Technology:
- Automated Optical Inspection
- Direct Imaging or Laser Direct Imaging
- Automated Optical Shaping
By Application:
- Consumer Electronics Industries
- Computing and Communications Sector
- Automotive Industries
- Medical Sector
- Manufacturing Industries
- Military, Defense, and Aerospace Sector
- Other Applications
By Region:
- North America
- Latin America
- Europe
- East Asia
- South Asia and Pacific
- The Middle East and Africa (MEA)
Report Chapters
Executive Summary
The executive summary of the Substrate-like PCB includes the global market outlook, demand side trends, supply side trends and also include FMI analysis and recommendations of Substrate-like PCB.
Chapter 01 - Market Overview
Readers can find the detailed segmentation and definition of the Substrate-like PCB in this chapter, which will help to understand basic information about Substrate-like PCB. This section also highlights the market scope, taxonomy and limitations which help the reader understand the market coverage of Substrate-like PCB report.
Chapter 02 - Market Background
This chapter includes detailed analysis of the By Line or Space Type processing methods overview, consumer buying patterns & tendencies and policy developments and regulatory scenario. It also includes in depth analysis of macro-economic factors and covers topics like global GDP growth outlook, global industry value added, personal consumption, expenditures, modern trade penetration and consumer price indices. The chapter also covers forecast factors - relevance & impact, value chain analysis and market dynamics (drivers, restraints and opportunities) to better understand the market.
Chapter 03 - Global Substrate-like PCB Demand Analysis 2018-2022 and Forecast, 2023-2033
The chapter include historical market value (USD 1.4 billion) analysis (2018-2022) and current and future market value (USD 5.7 billion) and volume (13.5%) projections (2023-2033). The projections are based on the Y-O-Y growth trend analysis and absolute $ opportunity analysis country of operation.
Chapter 04 - Global Substrate-like PCB - Pricing Analysis
Based on By Line or Space Type, the pricing analysis chapter include Regional pricing analysis (USD/MT), global average pricing analysis benchmark, and key factors impacting the pricing.
Chapter 05 - Global Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033, By Line or Space Type
Based on By Line or Space Type, Substrate-like PCB is segmented into Less than 25/25 µm, 25/25 µm and 30/30 µm. Value forecast and Y-o-Y growth comparison will also be provided for above mentioned By Line or Space Type.
Chapter 06 - Global Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033, By Inspection Technology
Based on By Inspection Technology, Substrate-like PCB is segmented into Automated Optical Inspection, Direct Imaging or Laser Direct Imaging, Automated Optical Shaping. Value forecast and Y-o-Y growth comparison will also be provided for above mentioned By Inspection Technology.
Chapter 07 - Global Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033, By Application
Based on By Application, Substrate-like PCB is segmented into Consumer Electronics Industries, Computing and Communications Sector, Automotive Industries, Medical Sector, Manufacturing Industries, Military, Defense, and Aerospace Sector, Other Applications. This section also offers market attractiveness analysis based on By Application. Value forecast and Y-o-Y growth comparison will also be provided for above mentioned By Application.
Chapter 08 - Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033, By Region
Based on By Region, Substrate-like PCB is segmented into North America, Latin America, Europe, East Asia, South Asia, Oceania and MEA. This section also offers market attractiveness analysis based on By Region. Readers can also find value forecast and Y-o-Y growth comparison for all above mentioned By Region.
Chapter 09 - North America Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033
This chapter includes a detailed analysis of the growth of the Substrate-like PCB in the North American region, along with a country-wise assessment that includes the US and Canada. Readers can also find regional trends, regulations, and market growth based on different segment and countries in the North America region.
Chapter 10 - Latin America Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033
This chapter includes a detailed analysis of the growth of Substrate-like PCB in the Latin America region, along with a country-wise assessment that includes the Brazil, Mexico, Chile, Argentina, Peru and Rest of Latin America. Readers can find detailed information about several factors, such as the pricing analysis and regional trends, which are impacting growth of the Substrate-like PCB in the Latin America region.
Chapter 11 - Europe Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033
This chapter includes a detailed analysis of the growth of Substrate-like PCB in the European region, along with a country-wise assessment that includes the Germany, Italy, France, U.K., Spain, Russia, Nordic, Benelux and Rest of Europe. Readers can find detailed information about several factors, such as the pricing analysis and regional trends, which are impacting growth of the Substrate-like PCB in the regional market.
Chapter 12 - East Asia Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033
This chapter includes a detailed analysis of the growth of Substrate-like PCB in the East Asia region, along with a country-wise assessment that includes the China, Japan, and South Korea. Readers can find detailed information about several factors, such as the pricing analysis and regional trends, which are impacting growth of the Substrate-like PCB in the regional market.
Chapter 13 - South Asia Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033
This chapter includes a detailed analysis of the growth of Substrate-like PCB in the South Asia region, along with a country-wise assessment that includes the India, Indonesia, Malaysia, Thailand, and Rest of South Asia. Readers can find detailed information about several factors, such as the pricing analysis and regional trends, which are impacting growth of the Substrate-like PCB in the regional market.
Chapter 14 - Middle East and Africa Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033
This chapter includes a detailed analysis of the growth of Substrate-like PCB in the MEA region, along with a country-wise assessment that includes the GCC Countries, South Africa, North Africa, Turkey and Rest of MEA. Readers can find detailed information about several factors, such as the pricing analysis and regional trends, which are impacting growth of the Substrate-like PCB in the regional market.
Chapter 15 - Key Countries Substrate-like PCB Analysis 2018-2022 and Forecast 2023-2033
This chapter offers insights into how the Substrate-like PCB is expected to grow in major countries globally.
Chapter 16 - Market Structure Analysis- Global Assessment
This chapter includes company dashboard, industry structure analysis by tier of companies, 2022E, company share analysis of top players, 2022E, and competition benchmarking- matrix.
Chapter 17 - Competition Deep Dive (Tentative List)
This chapter includes company overview, By Line or Space Type portfolio of companies, profitability by market segments, sales footprint, SWOT analysis and strategy overview of the companies being studied in the report. Some of the market players featured in the report are Kinsus Interconnect Technology; Ibiden Co.; Ltd.; Compaq Manufacturing Co.; Ltd.; Unimicron Technology Corporation; Austria Technologie & Systemtechnik AG (AT&S); TTM Technologies; Samsung Electro-Mechanics; Korea International Circuit Incorporation; Zhen Ding Technology; Daeduck Gds Company; and Tripod Technology Corp
Chapter 18 - Assumptions and Acronyms
This chapter includes a list of acronyms and assumptions that provide a base to the information and statistics included in the Substrate-like PCB report.
Chapter 19 - Research Methodology
This chapter helps readers understand the research methodology followed to obtain various conclusions, as well as important qualitative and quantitative information, on Substrate-like PCB.