Semiconductor Manufacturing Equipment Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast to 2024-2032
Growth Factors of Semiconductor Manufacturing Equipment Market
The semiconductor manufacturing equipment market size was valued at USD 110.91 billion in 2023, and the market is now projected to grow from USD 121.17 billion in 2024 to USD 270.38 billion by 2032, exhibiting a CAGR of 10.6% during the forecast period of 2023-2032.
Government has put restrictions on social gatherings, events and moving out from home which make the people homesick. Numerous companies are encountering hurdles due to covid pandemic as the outbreak situation has curtailed production and supply chain which has hindered the market switched to treating covid patients as priority over the other procedures which led the semiconductor manufacturing equipment market growth. Additionally, manpower shortages affected manufacturing plants and slowed production due to movement restrictions and lockdowns in several regions. Stopped providing on-site maintenance and installations market growth sputtered amid the pandemic.
Growing product demand in the manufacturing and wireless technology sectors will support semiconductor manufacturing equipment market growth during forecast period. The use of semiconductor components, IC chips, and logic circuits is increasing significantly in a number of industries, including consumer electronics, home appliances, connected devices, electric vehicles, and autonomous vehicles.
Technological developments to help the semiconductor manufacturing equipment market expand during forecast period. To reach the fastest manufacturing rates, leading companies in the market are focusing their efforts on introducing cutting-edge technologies like nano-imprinting and state-of-the-art lithography. These machines are notable for their precision and large production capacity.
Comprehensive Analysis of Semiconductor Manufacturing Equipment Market
The semiconductor manufacturing equipment market and machinery and equipment industry is rising at an exponential rate due to its market segmentation. This market expansion effectively provides a detailed regional assessment considering the dominant supply and demand forces that impact the machinery and equipment benefit management industry. These segmentations are methodically segregated by Equipment Type, by Dimension and by application. The Equipment Type segmentations include Front-end Equipment and Back-end Equipment, By Dimension segmentations include 2D, 2.5D, and 3Da, and By Application segmentations include Semiconductor Fabrication Plant/Foundry, Semiconductor Electronics Manufacturing, and Test Home.
The Asia Pacific region lead the semiconductor manufacturing equipment market by benefitting a market size of USD 75.30 billion in 2023 due to growing product demand in the manufacturing and wireless technology sectors.
The top players in the market play a crucial role in the machinery and equipment industry assuring industrial prospectus growth and setting market standards. These key industry players include, Applied Materials Inc (U.S.) Tokyo Electron Limited (Japan) Lam Research Corporation (U.S.) ASML (Netherlands) Dainippon Screen Group (Japan) KLA Corporation (Netherlands) Ferrotec Holdings Corporation (Japan) Hitachi High-Technologies Corporation (Japan) ASM International (U.S.) Canon Machinery Inc (Japan) these market players provide a level-playing competitive landscape.
In March 2023, To meet the increasing need for accurate pattern formation on large substrates and metal masks, especially in telecommunications and IoT infrastructure, SCREEN PE Solutions Co., Ltd., a division of SCREEN Holdings Co., Ltd., unveiled the Ledia 7F-L direct imaging system.
Segmentation Table
ATTRIBUTE DETAILS
Study Period 2019 – 2032
Base Year 2023
Estimated Year 2024
Forecast Period 2024 – 2032
Historical Period 2019 – 2022
Growth Rate CAGR of 10.6% over 2024 to 2032
Unit Value (USD Billion)
Segmentation By Equipment Type
Front-end Equipment
Silicon Wafer Manufacturing
Wafer Processing Equipment
Back-end Equipment
Testing Equipment
Assembling & Packaging Equipment
By Dimension
2D
2.5D
3D
By Application
Semiconductor Fabrication Plant/Foundry
Semiconductor Electronics Manufacturing
Test Home
By Region
North America (Equipment Type, Dimension, Application, and Country)
U.S. (By Equipment Type)
Canada (By Equipment Type)
Mexico (By Equipment Type)
Europe (Equipment Type, Dimension, Application, and Country)
Germany (By Equipment Type)
U.K. (By Equipment Type)
France (By Equipment Type)
Italy (By Equipment Type)
Rest of Europe
Asia Pacific (Equipment Type, Dimension, Application, and Country)
China (By Equipment Type)
India (By Equipment Type)
Japan (By Equipment Type)
South Korea (By Equipment Type)
Taiwan (By Equipment Type)
Rest of Asia Pacific
Middle East and Africa (Equipment Type, Dimension, Application, and Country)
GCC Countries (By Equipment Type)
South Africa (By Equipment Type)
Rest of Middle East and Africa
South America (Equipment Type, Dimension, Application, and Country)
Brazil (By Equipment Type)
Argentina (By Equipment Type)
Rest of South America
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- 1. Introduction
- 1.1. Definition, By Segment
- 1.2. Research Methodology/Approach
- 1.3. Data Sources
- 2. Executive Summary
- 3. Market Dynamics
- 3.1. Macro and Micro Economic Indicators
- 3.2. Drivers, Restraints, Opportunities and Trends
- 4. Competition Landscape
- 4.1. Business Strategies Adopted by Key Players
- 4.2. Consolidated SWOT Analysis of Key Players
- 4.3. Global Semiconductor Manufacturing Equipment Market Key Players Market Share Insights and Analysis, 2023
- 5. Global Semiconductor Manufacturing Equipment Market Size Estimates and Forecasts (Quantitative Data), By Segments, 2019-2032
- 5.1. Key Findings
- 5.2. By Equipment Type (USD)
- 5.2.1. Front-end Equipment
- 5.2.2. Back-end Equipment
- 5.3. By Dimension (USD)
- 5.3.1. 2D
- 5.3.2. 2.5D
- 5.3.3. 3D
- 5.4. By Application (USD)
- 5.4.1. Semiconductor Fabrication Plant/ Foundry
- 5.4.2. Semiconductor Electronics Manufacturing
- 5.4.3. Test Home
- 5.5. By Region (USD)
- 5.5.1. North America
- 5.5.2. Europe
- 5.5.3. Asia Pacific
- 5.5.4. South America
- 5.5.5. Middle East and Africa
- 6. North America Semiconductor Manufacturing Equipment Market Size Estimates and Forecasts (Quantitative Data), By Segments, 2019-2032
- 6.1. Key Findings
- 6.2. By Equipment Type (USD)
- 6.2.1. Front-end Equipment
- 6.2.2. Back-end Equipment
- 6.3. By Dimension (USD)
- 6.3.1. 2D
- 6.3.2. 2.5D
- 6.3.3. 3D
- 6.4. By Application (USD)
- 6.4.1. Semiconductor Fabrication Plant/ Foundry
- 6.4.2. Semiconductor Electronics Manufacturing
- 6.4.3. Test Home
- 6.5. By Country (USD)
- 6.5.1. U.S.
- 6.5.1.1. Equipment Type
- 6.5.1.1.1. Front-end Equipment
- 6.5.1.1.2. Back-end Equipment
- 6.5.2. Canada
- 6.5.2.1. Equipment Type
- 6.5.2.1.1. Front-end Equipment
- 6.5.2.1.2. Back-end Equipment
- 6.5.3. Mexico
- 6.5.3.1. Equipment Type
- 6.5.3.1.1. Front-end Equipment
- 6.5.3.1.2. Back-end Equipment
- 7. Europe Semiconductor Manufacturing Equipment Market Size Estimates and Forecasts (Quantitative Data), By Segments, 2019-2032
- 7.1. Key Findings
- 7.2. By Equipment Type (USD)
- 7.2.1. Front-end Equipment
- 7.2.2. Back-end Equipment
- 7.3. By Dimension (USD)
- 7.3.1. 2D
- 7.3.2. 2.5D
- 7.3.3. 3D
- 7.4. By Application (USD)
- 7.4.1. Semiconductor Fabrication Plant/ Foundry
- 7.4.2. Semiconductor Electronics Manufacturing
- 7.4.3. Test Home
- 7.5. By Country (USD)
- 7.5.1. U.K.
- 7.5.1.1. Equipment Type
- 7.5.1.1.1. Front-end Equipment
- 7.5.1.1.2. Back-end Equipment
- 7.5.2. Germany
- 7.5.2.1. Equipment Type
- 7.5.2.1.1. Front-end Equipment
- 7.5.2.1.2. Back-end Equipment
- 7.5.3. France
- 7.5.3.1. Equipment Type
- 7.5.3.1.1. Front-end Equipment
- 7.5.3.1.2. Back-end Equipment
- 7.5.4. Italy
- 7.5.4.1. Equipment Type
- 7.5.4.1.1. Front-end Equipment
- 7.5.4.1.2. Back-end Equipment
- 7.5.5. Rest of Europe
- 8. Asia Pacific Semiconductor Manufacturing Equipment Market Size Estimates and Forecasts (Quantitative Data), By Segments, 2019-2032
- 8.1. Key Findings
- 8.2. By Equipment Type (USD)
- 8.2.1. Front-end Equipment
- 8.2.2. Back-end Equipment
- 8.3. By Dimension (USD)
- 8.3.1. 2D
- 8.3.2. 2.5D
- 8.3.3. 3D
- 8.4. By Application (USD)
- 8.4.1. Semiconductor Fabrication Plant/ Foundry
- 8.4.2. Semiconductor Electronics Manufacturing
- 8.4.3. Test Home
- 8.5. By Country (USD)
- 8.5.1. China
- 8.5.1.1. Equipment Type
- 8.5.1.1.1. Front-end Equipment
- 8.5.1.1.2. Back-end Equipment
- 8.5.2. Japan
- 8.5.2.1. Equipment Type
- 8.5.2.1.1. Front-end Equipment
- 8.5.2.1.2. Back-end Equipment
- 8.5.3. India
- 8.5.3.1. Equipment Type
- 8.5.3.1.1. Front-end Equipment
- 8.5.3.1.2. Back-end Equipment
- 8.5.4. South Korea
- 8.5.4.1. Equipment Type
- 8.5.4.1.1. Front-end Equipment
- 8.5.4.1.2. Back-end Equipment
- 8.5.5. Rest of Asia-Pacific
- 9. South America Semiconductor Manufacturing Equipment Market Size Estimates and Forecasts (Quantitative Data), By Segments, 2019-2032
- 9.1. Key Findings
- 9.2. By Equipment Type (USD)
- 9.2.1. Front-end Equipment
- 9.2.2. Back-end Equipment
- 9.3. By Dimension (USD)
- 9.3.1. 2D
- 9.3.2. 2.5D
- 9.3.3. 3D
- 9.4. By Application (USD)
- 9.4.1. Semiconductor Fabrication Plant/ Foundry
- 9.4.2. Semiconductor Electronics Manufacturing
- 9.4.3. Test Home
- 9.5. By Country (USD)
- 9.5.1. Brazil
- 9.5.1.1. Equipment Type
- 9.5.1.1.1. Front-end Equipment
- 9.5.1.1.2. Back-end Equipment
- 9.5.2. Argentina
- 9.5.2.1. Equipment Type
- 9.5.2.1.1. Front-end Equipment
- 9.5.2.1.2. Back-end Equipment
- 9.5.3. Rest of South America
- 10. Middle East and Africa Semiconductor Manufacturing Equipment Market Size Estimates and Forecasts (Quantitative Data), By Segments, 2019-2032
- 10.1. Key Findings
- 10.2. By Equipment Type (USD)
- 10.2.1. Front-end Equipment
- 10.2.2. Back-end Equipment
- 10.3. By Dimension (USD)
- 10.3.1. 2D
- 10.3.2. 2.5D
- 10.3.3. 3D
- 10.4. By Application (USD)
- 10.4.1. Semiconductor Fabrication Plant/ Foundry
- 10.4.2. Semiconductor Electronics Manufacturing
- 10.4.3. Test Home
- 10.5. By Country (USD)
- 10.5.1. GCC
- 10.5.1.1. Equipment Type
- 10.5.1.1.1. Front-end Equipment
- 10.5.1.1.2. Back-end Equipment
- 10.5.2. South Africa
- 10.5.2.1. Equipment Type
- 10.5.2.1.1. Front-end Equipment
- 10.5.2.1.2. Back-end Equipment
- 10.5.3. Rest of Middle East and Africa
- 11. Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)
- 11.1. ASML
- 11.1.1. Overview
- 11.1.2. Offerings/Business Segments
- 11.1.3. Employee Size
- 11.1.4. Key Financials
- 11.1.5. Recent Developments
- 11.2. KLA Corporation
- 11.2.1. Overview
- 11.2.2. Offerings/Business Segments
- 11.2.3. Employee Size
- 11.2.4. Key Financials
- 11.2.5. Recent Developments
- 11.3. Teradyne
- 11.3.1. Overview
- 11.3.2. Offerings/Business Segments
- 11.3.3. Employee Size
- 11.3.4. Key Financials
- 11.3.5. Recent Developments
- 11.4. Lam Research Corporation
- 11.4.1. Overview
- 11.4.2. Offerings/Business Segments
- 11.4.3. Employee Size
- 11.4.4. Key Financials
- 11.4.5. Recent Developments
- 11.5. Advantest
- 11.5.1. Overview
- 11.5.2. Offerings/Business Segments
- 11.5.3. Employee Size
- 11.5.4. Key Financials
- 11.5.5. Recent Developments
- 11.6. Applied Materials Inc.
- 11.6.1. Overview
- 11.6.2. Offerings/Business Segments
- 11.6.3. Employee Size
- 11.6.4. Key Financials
- 11.6.5. Recent Developments
- 11.7. Plasma-Therm
- 11.7.1. Overview
- 11.7.2. Offerings/Business Segments
- 11.7.3. Employee Size
- 11.7.4. Key Financials
- 11.7.5. Recent Developments
- 11.8. Tokyo Electron Limited
- 11.8.1. Overview
- 11.8.2. Offerings/Business Segments
- 11.8.3. Employee Size
- 11.8.4. Key Financials
- 11.8.5. Recent Developments
- 11.9. Ferrotec Holdings Corporation
- 11.9.1. Overview
- 11.9.2. Offerings/Business Segments
- 11.9.3. Employee Size
- 11.9.4. Key Financials
- 11.9.5. Recent Developments
- 11.10. Samsung Electronics Co Ltd
- 11.10.1. Overview
- 11.10.2. Offerings/Business Segments
- 11.10.3. Employee Size
- 11.10.4. Key Financials
- 11.10.5. Recent Developments
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