Semiconductor Lead Frame Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast to 2024-2032
Growth Factors of Semiconductor Lead Frame Market
The semiconductor lead frame market size was valued at USD 3.18 billion in 2021, and the market is now projected to grow from USD 3.33 billion in 2022 to USD 5.32 billion by 2029, exhibiting a CAGR of 6.9% during the forecast period of 2022-2029.
The disrupted supply chain and obstacles in the manufacturing process had hampered the semiconductor lead frame market growth. The increased raw material costs have created restrictions in the construction line due to transportation limitations. Product scarcity increased and the supply-demand gaps broadened and obstructed fabrication in COVID-19 pandemic. The imposition of a lockdown by the government has affected the manufacturing activities. It has disturbed the production processes.
The rising requirement of hardware has augmented semiconductor lead frame market share worldwide. The faster internet accessibility is highly attracting the end-users which are increasing demand for the electronic products consequently are boosting the market growth. The rising market penetration of consumer electronics due to digitization is propelling the market expansion.
The trend is growing demand for advanced packaging in small electronic solutions is boosting market growth. The evolution of 5G and advancement in network infrastructure is a requirement for the modern work culture. The rising adoption of equipment in electric vehicles due to advantages of integrating them with battery insulation and advanced cooling are boosting market growth.
Comprehensive Analysis of Semiconductor Lead Frame Market
The semiconductor lead frame market and semiconductor & electronics industry is rising at an exponential rate due to its market segmentation. This market expansion effectively presents a detailed regional assessment considering the dominant supply and demand forces that impact the semiconductor & electronics industry. These segmentations are methodically segregated by packaging type, application, and industry vertical. The packaging types include dual inline pin package, small out-line package, small outline transistor, quad flat pack, dual flat no-leads, quad flat no-leads, flip chip, and others. The applications are integrated circuit, discrete devices, and others. The industry verticals include consumer electronics, industrial and consumer electronics, industrial and commercial electronics, automotive, and others.
The Asia Pacific region is conducive to the global semiconductor lead frame market, leading to a recall of USD 1.52 billion owing to a strong supply chain of electronic devices and the rising circuits, discrete devices, and logic circuits across the region have given a push to the sales of electronic devices.
The top players in the market play a vital role in the semiconductor & electronics industry assuring industrial prospectus growth and setting market standards. These players include Haesungds (Korea), Mitsui High-tec, Inc. (Japan), Shinko Electric Industries Co., Ltd. (Japan), Chang Wah Technology Co., Ltd (China), ASMPT (Singapore), Ningbo Hualong Electronics Co., Ltd (China), Wuxi Huajing Leadframe Co., Ltd (China), QPL Limited (Hong Kong), SDI Group, Inc. (Taiwan), and Dynacraft Industries Sdn Bhd (Malaysia), these market players provide a level-playing competitive landscape.
In November 2021, Haesung Industrial Co., Ltd made a spending of worth USD 293 million in partnership with LT Precision Co., Ltd. Through this investment, they will add 370 new jobs in Changwon, Gyeongnam.
Segmentation Table
Global Semiconductor Lead Frame Market Scope
ATTRIBUTE
DETAILS
Study Period
2018-2029
Base Year
2021
Forecast Period
2022-2029
Historical Period
2018-2020
Unit
Value (USD Billion) and Volume (Million Units)
Segmentation
By Packaging Type, Application, Industry Vertical, and Region
By Packaging Type
DIP (Dual Inline Pin Package)
SOP (Small Out-Line Package)
SOT (Small Outline Transistor)
QFP (Quad Flat Pack)
DFN (Dual Flat No-Leads)
QFN (Quad Flat No-Leads)
FCF (Flip Chip)
Others
By Application
Integrated Circuit
Discrete Device
Others
By Industry Vertical
Consumer Electronics
Industrial and Commercial Electronics
Automotive
Others (Network and Communication)
By Region
North America (By Packaging Type, By Application, By Industry Vertical, By Country)
U.S. (By Industry Vertical)
Canada (By Industry Vertical)
Europe (By Packaging Type, By Application, By Industry Vertical, By Country)
Germany (By Industry Vertical)
U.K. (By Industry Vertical)
France (By Industry Vertical)
Italy (By Industry Vertical)
Russia (By Industry Vertical)
Rest of Europe
Asia Pacific (By Packaging Type, By Application, By Industry Vertical, By Country)
China (By Industry Vertical)
India (By Industry Vertical)
Japan (By Industry Vertical)
South Korea (By Industry Vertical)
Taiwan (By Industry Vertical)
Southeast Asia (By Industry Vertical)
Australia (By Industry Vertical)
Rest of Asia Pacific
Middle East & Africa (By Packaging Type, By Application, By Industry Vertical, By Country)
Turkey (By Industry Vertical)
Israel (By Industry Vertical)
GCC (By Industry Vertical)
North Africa (By Industry Vertical)
South Africa (By Industry Vertical)
Rest of Middle East & Africa
Latin America (By Packaging Type, By Application, By Industry Vertical, By Country)
Brazil (By Industry Vertical)
Mexico (By Industry Vertical)
Rest of Latin AmericaPlease Note: It will take 5-6 business days to complete the report upon order confirmation.
- 1. Introduction
- 1.1. Definition, By Segment
- 1.2. Research Methodology/Approach
- 1.3. Data Sources
- 2. Executive Summary
- 3. Market Dynamics
- 3.1. Macro and Micro Economic Indicators
- 3.2. Drivers, Restraints, Opportunities and Trends
- 3.3. Impact of COVID-19
- 3.4. Supply Chain Analysis Semiconductor Lead Frame Market
- 3.5. Major Suppliers of Sourced Down Lead Frames
- 4. Competition Landscape
- 4.1. Business Strategies Adopted by Key Players
- 4.2. Consolidated SWOT Analysis of Key Players
- 4.3. Global Semiconductor Lead frame Key Players Market Share/Ranking, 2022
- 5. Global Semiconductor Lead Frame Key Market Indicators
- 5.1. Lead Frames for Source Down Packaging Technology
- 5.2. Technology of 100X300mm Size, with Etching Technology or Press Technology
- 5.3. Adhesion Improvement Technology between Mold Compound
- 6. Global Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
- 6.1. Key Findings
- 6.2. By Packaging Type (USD Mn & Million Units)
- 6.2.1. DIP (Dual Inline Pin Package)
- 6.2.2. SOP (Small Out-Line Package)
- 6.2.3. SOT (Small Outline Transistor)
- 6.2.4. QFP (Quad Flat Pack)
- 6.2.5. DFN (Dual Flat No-Leads)
- 6.2.6. QFN (Quad Flat No-Leads)
- 6.2.7. FCF (Flip Chip)
- 6.2.8. Others
- 6.3. By Application (USD Mn & Million Units)
- 6.3.1. Integrated Circuit
- 6.3.2. Discrete Device
- 6.3.3. Others
- 6.4. By Industry Vertical (USD Mn & Million Units)
- 6.4.1. Consumer Electronics
- 6.4.2. Industrial and Commercial Electronics
- 6.4.3. Automotive
- 6.4.4. Others (Network and Communication)
- 6.5. By Country (USD Mn & Million Units)
- 6.5.1. North America
- 6.5.2. Europe
- 6.5.3. Asia Pacific
- 6.5.4. The Middle East & Africa
- 6.5.5. Latin America
- 7. North America Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
- 7.1. Key Findings
- 7.2. By Packaging Type (USD Mn & Million Units)
- 7.2.1. DIP (Dual Inline Pin Package)
- 7.2.2. SOP (Small Out-Line Package)
- 7.2.3. SOT (Small Outline Transistor)
- 7.2.4. QFP (Quad Flat Pack)
- 7.2.5. DFN (Dual Flat No-Leads)
- 7.2.6. QFN (Quad Flat No-Leads)
- 7.2.7. FCF (Flip Chip)
- 7.2.8. Others
- 7.3. By Application (USD Mn & Million Units)
- 7.3.1. Integrated Circuit
- 7.3.2. Discrete Device
- 7.3.3. Others
- 7.4. By Industry Vertical (USD Mn & Million Units)
- 7.4.1. Consumer Electronics
- 7.4.2. Industrial and Commercial Electronics
- 7.4.3. Automotive
- 7.4.4. Others (Network and Communication)
- 7.5. By Country (USD Mn & Million Units)
- 7.5.1. United States
- 7.5.2. Canada
- 8. Europe Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
- 8.1. Key Findings
- 8.2. By Packaging Type (USD Mn & Million Units)
- 8.2.1. DIP (Dual Inline Pin Package)
- 8.2.2. SOP (Small Out-Line Package)
- 8.2.3. SOT (Small Outline Transistor)
- 8.2.4. QFP (Quad Flat Pack)
- 8.2.5. DFN (Dual Flat No-Leads)
- 8.2.6. QFN (Quad Flat No-Leads)
- 8.2.7. FCF (Flip Chip)
- 8.2.8. Others
- 8.3. By Application (USD Mn & Million Units)
- 8.3.1. Integrated Circuit
- 8.3.2. Discrete Device
- 8.3.3. Others
- 8.4. By Industry Vertical (USD Mn & Million Units)
- 8.4.1. Consumer Electronics
- 8.4.2. Industrial and Commercial Electronics
- 8.4.3. Automotive
- 8.4.4. Others (Network and Communication)
- 8.5. By Country (USD Mn & Million Units)
- 8.5.1. Germany
- 8.5.2. United Kingdom
- 8.5.3. France
- 8.5.4. Italy
- 8.5.5. Russia
- 8.5.6. Rest of Europe
- 9. Asia Pacific Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
- 9.1. Key Findings
- 9.2. By Packaging Type (USD Mn & Million Units)
- 9.2.1. DIP (Dual Inline Pin Package)
- 9.2.2. SOP (Small Out-Line Package)
- 9.2.3. SOT (Small Outline Transistor)
- 9.2.4. QFP (Quad Flat Pack)
- 9.2.5. DFN (Dual Flat No-Leads)
- 9.2.6. QFN (Quad Flat No-Leads)
- 9.2.7. FCF (Flip Chip)
- 9.2.8. Others
- 9.3. By Application (USD Mn & Million Units)
- 9.3.1. Integrated Circuit
- 9.3.2. Discrete Device
- 9.3.3. Others
- 9.4. By Industry Vertical (USD Mn & Million Units)
- 9.4.1. Consumer Electronics
- 9.4.2. Industrial and Commercial Electronics
- 9.4.3. Automotive
- 9.4.4. Others (Network and Communication)
- 9.5. By Country (USD Mn & Million Units)
- 9.5.1. China
- 9.5.2. India
- 9.5.3. Japan
- 9.5.4. South Korea
- 9.5.5. Taiwan
- 9.5.6. Southeast Asia
- 9.5.7. Australia
- 9.5.8. Rest of Asia Pacific
- 10. Middle East & Africa Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
- 10.1. Key Findings
- 10.2. By Packaging Type (USD Mn & Million Units)
- 10.2.1. DIP (Dual Inline Pin Package)
- 10.2.2. SOP (Small Out-Line Package)
- 10.2.3. SOT (Small Outline Transistor)
- 10.2.4. QFP (Quad Flat Pack)
- 10.2.5. DFN (Dual Flat No-Leads)
- 10.2.6. QFN (Quad Flat No-Leads)
- 10.2.7. FCF (Flip Chip)
- 10.2.8. Others
- 10.3. By Application (USD Mn & Million Units)
- 10.3.1. Integrated Circuit
- 10.3.2. Discrete Device
- 10.3.3. Others
- 10.4. By Industry Vertical (USD Mn & Million Units)
- 10.4.1. Consumer Electronics
- 10.4.2. Industrial and Commercial Electronics
- 10.4.3. Automotive
- 10.4.4. Others (Network and Communication)
- 10.5. By Country (USD Mn & Million Units)
- 10.5.1. Turkey
- 10.5.2. Israel
- 10.5.3. GCC
- 10.5.4. North Africa
- 10.5.5. South Africa
- 10.5.6. Rest of MEA
- 11. Latin America Semiconductor Lead frame Market Size Estimates and Forecasts, By Segments, 2018-2029
- 11.1. Key Findings
- 11.2. By Packaging Type (USD Mn & Million Units)
- 11.2.1. DIP (Dual Inline Pin Package)
- 11.2.2. SOP (Small Out-Line Package)
- 11.2.3. SOT (Small Outline Transistor)
- 11.2.4. QFP (Quad Flat Pack)
- 11.2.5. DFN (Dual Flat No-Leads)
- 11.2.6. QFN (Quad Flat No-Leads)
- 11.2.7. FCF (Flip Chip)
- 11.2.8. Others
- 11.3. By Application (USD Mn & Million Units)
- 11.3.1. Integrated Circuit
- 11.3.2. Discrete Device
- 11.3.3. Others
- 11.4. By Industry Vertical (USD Mn & Million Units)
- 11.4.1. Consumer Electronics
- 11.4.2. Industrial and Commercial Electronics
- 11.4.3. Automotive
- 11.4.4. Others (Network and Communication)
- 11.5. By Country (USD Mn & Million Units)
- 11.5.1. Brazil
- 11.5.2. Mexico
- 11.5.3. Rest of Latin America
- 12. Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)
- 12.1. Mitsui High-tec, Inc.
- 12.1.1. Overview
- 12.1.1.1. Key Management
- 12.1.1.2. Headquarters
- 12.1.1.3. Offerings/Business Segments
- 12.1.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.1.2.1. Employee Size
- 12.1.2.2. Past and Current Revenue
- 12.1.2.3. Geographical Share
- 12.1.2.4. Business Segment Share
- 12.1.2.5. Recent Developments
- 12.2. Shinko electric industries co., Ltd.
- 12.2.1. Overview
- 12.2.1.1. Key Management
- 12.2.1.2. Headquarters
- 12.2.1.3. Offerings/Business Segments
- 12.2.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.2.2.1. Employee Size
- 12.2.2.2. Past and Current Revenue
- 12.2.2.3. Geographical Share
- 12.2.2.4. Business Segment Share
- 12.2.2.5. Recent Developments
- 12.3. Chang Wah Technology Co., Ltd.
- 12.3.1. Overview
- 12.3.1.1. Key Management
- 12.3.1.2. Headquarters
- 12.3.1.3. Offerings/Business Segments
- 12.3.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.3.2.1. Employee Size
- 12.3.2.2. Past and Current Revenue
- 12.3.2.3. Geographical Share
- 12.3.2.4. Business Segment Share
- 12.3.2.5. Recent Developments
- 12.4. Haesungds
- 12.4.1. Overview
- 12.4.1.1. Key Management
- 12.4.1.2. Headquarters
- 12.4.1.3. Offerings/Business Segments
- 12.4.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.4.2.1. Employee Size
- 12.4.2.2. Past and Current Revenue
- 12.4.2.3. Geographical Share
- 12.4.2.4. Business Segment Share
- 12.4.2.5. Recent Developments
- 12.5. ASMPT
- 12.5.1. Overview
- 12.5.1.1. Key Management
- 12.5.1.2. Headquarters
- 12.5.1.3. Offerings/Business Segments
- 12.5.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.5.2.1. Employee Size
- 12.5.2.2. Past and Current Revenue
- 12.5.2.3. Geographical Share
- 12.5.2.4. Business Segment Share
- 12.5.2.5. Recent Developments
- 12.6. Ningbo Hualong Electronics Co.,Ltd.
- 12.6.1. Overview
- 12.6.1.1. Key Management
- 12.6.1.2. Headquarters
- 12.6.1.3. Offerings/Business Segments
- 12.6.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.6.2.1. Employee Size
- 12.6.2.2. Past and Current Revenue
- 12.6.2.3. Geographical Share
- 12.6.2.4. Business Segment Share
- 12.6.2.5. Recent Developments
- 12.7. QPL Limited
- 12.7.1. Overview
- 12.7.1.1. Key Management
- 12.7.1.2. Headquarters
- 12.7.1.3. Offerings/Business Segments
- 12.7.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.7.2.1. Employee Size
- 12.7.2.2. Past and Current Revenue
- 12.7.2.3. Geographical Share
- 12.7.2.4. Business Segment Share
- 12.7.2.5. Recent Developments
- 12.8. Wuxi Huajing Leadframe Co.,Ltd.
- 12.8.1. Overview
- 12.8.1.1. Key Management
- 12.8.1.2. Headquarters
- 12.8.1.3. Offerings/Business Segments
- 12.8.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.8.2.1. Employee Size
- 12.8.2.2. Past and Current Revenue
- 12.8.2.3. Geographical Share
- 12.8.2.4. Business Segment Share
- 12.8.2.5. Recent Developments
- 12.9. SDI Group, Inc.
- 12.9.1. Overview
- 12.9.1.1. Key Management
- 12.9.1.2. Headquarters
- 12.9.1.3. Offerings/Business Segments
- 12.9.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.9.2.1. Employee Size
- 12.9.2.2. Past and Current Revenue
- 12.9.2.3. Geographical Share
- 12.9.2.4. Business Segment Share
- 12.9.2.5. Recent Developments
- 12.10. Dynacraft Industries Sdn Bhd
- 12.10.1. Overview
- 12.10.1.1. Key Management
- 12.10.1.2. Headquarters
- 12.10.1.3. Offerings/Business Segments
- 12.10.2. Key Details (Key details are consolidated data and not product/service specific)
- 12.10.2.1. Employee Size
- 12.10.2.2. Past and Current Revenue
- 12.10.2.3. Geographical Share
- 12.10.2.4. Business Segment Share
- 12.10.2.5. Recent Developments
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