Semiconductor Assembly and Test Services (SATS) Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast to 2024-2032
Growth Factors of Semiconductor Assembly and Test Services Market
The global semiconductor assembly and test services market size was valued at USD 30.71 billion in 2020 and is projected to grow from USD 31.86 billion in 2021 to USD 46.24 billion by 2028, exhibiting a CAGR of 5.5% during the forecast period of 2021-2028.
The outbreak forced the suspension of manufacturing of semiconductor assembly and test services, affected the supply chain, and reduced the availability of the team of workers. However, the recovery of demand for the digital age and the use of semiconductors also supported the semiconductor assembly and test services market growth during the pandemic as the development was gradual.
The Semiconductor Assembly and Test Services Market is pushed with a rising call for advanced semiconductors in industries like automobile, client electronics, and telecommunications, as well as technological advancements, miniaturization, and the increase of IoT and 5G networks.
AI and gadget studying are revolutionizing the semiconductor meeting and check services market. By reading many facts, AI and ML algorithms can expect system screw-ups and optimize upkeep schedules, lowering downtime and improving operational performance, expanding the global semiconductor assembly and test services market share. Furthermore, AI-powered inspection systems can perceive defects more accurately, improving product first-rate and yield. These technologies drive innovation and enhance the overall performance of semiconductor manufacturing approaches.
Comprehensive Analysis of Semiconductor Assembly and Test Services Market
The semiconductor assembly and test services market is segmented by service type and application. The testing offerings section is expected to develop at the highest CAGR, pushed by the call for high-quality validation through purposeful, bodily, and electric checking out. The assembly & packaging phase holds the most significant marketplace proportion, supported by technological advancements like organic-substrate-interposer and silicon interposer assembly, improving scalability and decreasing costs. The customer electronics phase is ready to develop quickly in terms of application due to the expanded demand for smartphones, capsules, and 5G technology. The automobile region is also increasing unexpectedly, as semiconductor services are crucial for autonomous vehicle generation and battery testing. Other segments, which include industrial, conversation, and networking, are seeing constant growth, as semiconductor assembly and trying out are crucial for integrated circuits and efficient product capability.
The Asia Pacific region led the semiconductor assembly and test services market by benefitting a size of USD 14.54 billion in 2020 due to the increasing automotive industry and supportive efforts from the idea, semiconductor meeting, and checking out services, which are experiencing growth across the place.
The leading players in the Semiconductor Assembly and Test Services market significantly influence its growth trajectory and set industry standards. These key players, including Amkor Technology (U.S.), ASE Group (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Jiangsu Changjiang Electronics Technology Co., Ltd. (China), Unisem (M) Berhad (Malaysia), Powertech Technology Inc. (Taiwan), Integra Technologies (U.S.), UTAC (Singapore), Tianshui Huatian Technology Co., Ltd (China), King Yuan Electronics Co., Ltd. (Taiwan), Chipbond Technology Corporation (Taiwan), GLOBALFOUNDRIES U.S. Inc. (U.S.), ChipMOS Technologies Inc. (Taiwan), Walton Advanced Engineering Inc. (Taiwan), Lingsen Precision Industries, Ltd. (Taiwan), Teledyne Technologies Inc. (U.S.), and Formosa Advanced Technologies Co., Ltd (Taiwan), contribute to a competitive landscape, driving innovation and market advancement.
In March 2021, Deca Technologies, an issuer of advanced semiconductor packaging solutions, partnered with ASE Group and Siemens Digital Industries Software to launch 'APDK', an Adaptive Patterning Design Kit designed to meet patron demand for more robust electrical overall performance innovation.
Segmentation Table
ATTRIBUTE DETAILS
Study Period2017 – 2028
Base Year2020
Estimated Year 2021
Forecast Period2021 – 2028
Historical Period2017 – 2019
UnitValue (USD billion)
SegmentationService Type, Application, and Region
By Service TypeAssembly and Packaging
Testing
By ApplicationCommunication
Automotive Electronics
Industrial
Consumer Electronics
Computing and Networking
By RegionNorth America (Service Type, Application and Country)
U.S. (By Application)
Canada (By Application)
Mexico (By Application)
Europe (Service Type, Application and Country)
U.K. (By Application)
Germany (By Application)
France (By Application)
Italy (By Application)
Rest of Europe (By Application)
Asia Pacific (Service Type, Application and Country)
China (By Application)
Japan (By Application)
India (By Application)
South Korea (By Application)
Taiwan (By Application)
Rest of Asia Pacific (By Application)
Middle East & Africa (Service Type, Application and Country)
South Africa (By Application)
GCC (By Application)
Rest of Middle East & Africa (By Application)
South America (Service Type, Application and Country)
Brazil (By Application)
Argentina (By Application)
Rest of South America (By Application)
Please Note: It will take 5-6 business days to complete the report upon order confirmation.
- 1. Introduction
- 1.1. Definition, By Segment
- 1.2. Research Methodology/Approach
- 1.3. Data Sources
- 2. Executive Summary
- 3. Market Dynamics
- 3.1. Macro and Micro Economic Indicators
- 3.2. Drivers, Restraints, Opportunities and Trends
- 3.3. Impact of COVID-19 on Semiconductor assembly and test services (SATS) Market
- 3.3.1. Short-term Impact
- 3.3.2. Long-term Impact
- 4. Competition Landscape
- 4.1. Business Strategies Adopted by Key Players
- 4.2. Consolidated SWOT Analysis of Key Players
- 4.3. Porter’s Five Forces Analysis
- 4.4. Global Semiconductor assembly and test services (SATS) Market Share Analysis and Matrix, 2020
- 5. Key Market Insights and Strategic Recommendations
- 6. Profiles of Key Players (Would be provided for 10 players only)
- 6.1. Overview
- 7.
- 7.1.
- 7.1.1. Key Management
- 7.1.2. Headquarters etc.
- 7.2. Offerings/Business Segments
- 7.3. Key Details (Key details are subjected to data availability in public domain and/or on paid databases)
- 7.3.1. Employee Size
- 7.3.2. Past and Current Revenue
- 7.3.3. Geographical Share
- 7.3.4. Business Segment Share
- 7.4. Recent Developments
- 8. Primary Interview Responses
- 9. Annexure / Appendix
- 9.1. Global Semiconductor assembly and test services (SATS) Market Analysis, Insights and Forecast (Quantitative Data), By Segments, 2017-2028
- 9.1.1. By Service Type (USD Bn)
- 9.1.1.1. Assembly and Packaging
- 9.1.1.2. Testing
- 9.1.2. By Application (USD Bn)
- 9.1.2.1. Communication
- 9.1.2.2. Automotive Electronics
- 9.1.2.3. Industrial
- 9.1.2.4. Consumer Electronics
- 9.1.2.5. Computing and Networking
- 9.1.3. By Region (USD Bn)
- 9.1.3.1. North America
- 9.1.3.2. Europe
- 9.1.3.3. Asia Pacific
- 9.1.3.4. Middle East & Africa
- 9.1.3.5. South America
- 9.2. North America Semiconductor assembly and test services (SATS) Market Analysis, Insights and Forecast (Quantitative Data), By Segments, 2017-2028
- 9.2.1. By Service Type (USD Bn)
- 9.2.1.1. Assembly and Packaging
- 9.2.1.2. Testing
- 9.2.2. By Application (USD Bn)
- 9.2.2.1. Communication
- 9.2.2.2. Automotive Electronics
- 9.2.2.3. Industrial
- 9.2.2.4. Consumer Electronics
- 9.2.2.5. Computing and Networking
- 9.2.3. By Country (USD Bn)
- 9.2.3.1. U.S.
- 9.2.3.1.1. By Application
- 9.2.3.1.1.1. Communication
- 9.2.3.1.1.2. Automotive Electronics
- 9.2.3.1.1.3. Industrial
- 9.2.3.1.1.4. Consumer Electronics
- 9.2.3.1.1.5. Computing and Networking
- 9.2.3.2. Canada
- 9.2.3.2.1. By Application
- 9.2.3.2.1.1. Communication
- 9.2.3.2.1.2. Automotive Electronics
- 9.2.3.2.1.3. Industrial
- 9.2.3.2.1.4. Consumer Electronics
- 9.2.3.2.1.5. Computing and Networking
- 9.2.3.3. Mexico
- 9.2.3.3.1. By Application
- 9.2.3.3.1.1. Communication
- 9.2.3.3.1.2. Automotive Electronics
- 9.2.3.3.1.3. Industrial
- 9.2.3.3.1.4. Consumer Electronics
- 9.2.3.3.1.5. Computing and Networking
- 9.3. Europe Semiconductor assembly and test services (SATS) Market Analysis, Insights and Forecast (Quantitative Data), By Segments, 2017-2028
- 9.3.1. By Service Type (USD Bn)
- 9.3.1.1. Assembly and Packaging
- 9.3.1.2. Testing
- 9.3.2. By Application (USD Bn)
- 9.3.2.1. Communication
- 9.3.2.2. Automotive Electronics
- 9.3.2.3. Industrial
- 9.3.2.4. Consumer Electronics
- 9.3.2.5. Computing and Networking
- 9.3.3. By Country (USD Bn)
- 9.3.3.1. U.K.
- 9.3.3.1.1. By Application
- 9.3.3.1.1.1. Communication
- 9.3.3.1.1.2. Automotive Electronics
- 9.3.3.1.1.3. Industrial
- 9.3.3.1.1.4. Consumer Electronics
- 9.3.3.1.1.5. Computing and Networking
- 9.3.3.2. Germany
- 9.3.3.2.1. By Application
- 9.3.3.2.1.1. Communication
- 9.3.3.2.1.2. Automotive Electronics
- 9.3.3.2.1.3. Industrial
- 9.3.3.2.1.4. Consumer Electronics
- 9.3.3.2.1.5. Computing and Networking
- 9.3.3.3. France
- 9.3.3.3.1. By Application
- 9.3.3.3.1.1. Communication
- 9.3.3.3.1.2. Automotive Electronics
- 9.3.3.3.1.3. Industrial
- 9.3.3.3.1.4. Consumer Electronics
- 9.3.3.3.1.5. Computing and Networking
- 9.3.3.4. Italy
- 9.3.3.4.1. By Application
- 9.3.3.4.1.1. Communication
- 9.3.3.4.1.2. Automotive Electronics
- 9.3.3.4.1.3. Industrial
- 9.3.3.4.1.4. Consumer Electronics
- 9.3.3.4.1.5. Computing and Networking
- 9.3.3.5. Rest of Europe
- 9.3.3.5.1. Application
- 9.3.3.5.1.1. Communication
- 9.3.3.5.1.2. Automotive Electronics
- 9.3.3.5.1.3. Industrial
- 9.3.3.5.1.4. Consumer Electronics
- 9.3.3.5.1.5. Computing and Networking
- 9.4. Asia Pacific Semiconductor assembly and test services (SATS) Market Analysis, Insights and Forecast (Quantitative Data), By Segments, 2017-2028
- 9.4.1. By Service Type (USD Bn)
- 9.4.1.1. Assembly and Packaging
- 9.4.1.2. Testing
- 9.4.2. By Application (USD Bn)
- 9.4.2.1. Communication
- 9.4.2.2. Automotive Electronics
- 9.4.2.3. Industrial
- 9.4.2.4. Consumer Electronics
- 9.4.2.5. Computing and Networking
- 9.4.3. By Country (USD Bn)
- 9.4.3.1. China
- 9.4.3.1.1. By Application
- 9.4.3.1.1.1. Communication
- 9.4.3.1.1.2. Automotive Electronics
- 9.4.3.1.1.3. Industrial
- 9.4.3.1.1.4. Consumer Electronics
- 9.4.3.1.1.5. Computing and Networking
- 9.4.3.2. Japan
- 9.4.3.2.1.
- 9.4.3.2.1.1. Communication
- 9.4.3.2.1.2. Automotive Electronics
- 9.4.3.2.1.3. Industrial
- 9.4.3.2.1.4. Consumer Electronics
- 9.4.3.2.1.5. Computing and Networking
- 9.4.3.3. India
- 9.4.3.3.1. By Application
- 9.4.3.3.1.1. Communication
- 9.4.3.3.1.2. Automotive Electronics
- 9.4.3.3.1.3. Industrial
- 9.4.3.3.1.4. Consumer Electronics
- 9.4.3.3.1.5. Computing and Networking
- 9.4.3.4. South Korea
- 9.4.3.4.1. By Application
- 9.4.3.4.1.1. Communication
- 9.4.3.4.1.2. Automotive Electronics
- 9.4.3.4.1.3. Industrial
- 9.4.3.4.1.4. Consumer Electronics
- 9.4.3.4.1.5. Computing and Networking
- 9.4.3.5. Taiwan
- 9.4.3.5.1. By Application
- 9.4.3.5.1.1. Communication
- 9.4.3.5.1.2. Automotive Electronics
- 9.4.3.5.1.3. Industrial
- 9.4.3.5.1.4. Consumer Electronics
- 9.4.3.5.1.5. Computing and Networking
- 9.4.3.6. Rest of Asia Pacific
- 9.4.3.6.1. Application
- 9.4.3.6.1.1. Communication
- 9.4.3.6.1.2. Automotive Electronics
- 9.4.3.6.1.3. Industrial
- 9.4.3.6.1.4. Consumer Electronics
- 9.4.3.6.1.5. Computing and Networking
- 9.5. Middle East & Africa Semiconductor assembly and test services (SATS) Market Analysis, Insights and Forecast (Quantitative Data), By Segments, 2017-2028
- 9.5.1. By Service Type (USD Bn)
- 9.5.1.1. Assembly and Packaging
- 9.5.1.2. Testing
- 9.5.2. By Application (USD Bn)
- 9.5.2.1. Communication
- 9.5.2.2. Automotive Electronics
- 9.5.2.3. Industrial
- 9.5.2.4. Consumer Electronics
- 9.5.2.5. Computing and Networking
- 9.5.3. By Country (USD Bn)
- 9.5.3.1. South Africa
- 9.5.3.1.1. By Application
- 9.5.3.1.1.1. Communication
- 9.5.3.1.1.2. Automotive Electronics
- 9.5.3.1.1.3. Industrial
- 9.5.3.1.1.4. Consumer Electronics
- 9.5.3.1.1.5. Computing and Networking
- 9.5.3.2. GCC
- 9.5.3.2.1. By Application
- 9.5.3.2.1.1. Communication
- 9.5.3.2.1.2. Automotive Electronics
- 9.5.3.2.1.3. Industrial
- 9.5.3.2.1.4. Consumer Electronics
- 9.5.3.2.1.5. Computing and Networking
- 9.5.3.3. Rest of Middle East & Africa
- 9.5.3.3.1. Application
- 9.5.3.3.1.1. Communication
- 9.5.3.3.1.2. Automotive Electronics
- 9.5.3.3.1.3. Industrial
- 9.5.3.3.1.4. Consumer Electronics
- 9.5.3.3.1.5. Computing and Networking
- 9.6. South America Semiconductor assembly and test services (SATS) Market Analysis, Insights and Forecast (Quantitative Data), By Segments, 2017-2028
- 9.6.1. By Service Type (USD Bn)
- 9.6.1.1. Assembly and Packaging
- 9.6.1.2. Testing
- 9.6.2. By Application (USD Bn)
- 9.6.2.1. Communication
- 9.6.2.2. Automotive Electronics
- 9.6.2.3. Industrial
- 9.6.2.4. Consumer Electronics
- 9.6.2.5. Computing and Networking
- 9.6.3. By Country (USD Bn)
- 9.6.3.1. Brazil
- 9.6.3.1.1. By Application
- 9.6.3.1.1.1. Communication
- 9.6.3.1.1.2. Automotive Electronics
- 9.6.3.1.1.3. Industrial
- 9.6.3.1.1.4. Consumer Electronics
- 9.6.3.1.1.5. Computing and Networking
- 9.6.3.2. Argentina
- 9.6.3.2.1. By Application
- 9.6.3.2.1.1. Communication
- 9.6.3.2.1.2. Automotive Electronics
- 9.6.3.2.1.3. Industrial
- 9.6.3.2.1.4. Consumer Electronics
- 9.6.3.2.1.5. Computing and Networking
- 9.6.3.3. Rest of South America
- 9.6.3.3.1. Application
- 9.6.3.3.1.1. Communication
- 9.6.3.3.1.2. Automotive Electronics
- 9.6.3.3.1.3. Industrial
- 9.6.3.3.1.4. Consumer Electronics
- 9.6.3.3.1.5. Computing and Networking
- 10. List of some of the companies (to name a few and not limited to) considered in the scope for understanding the market ecosystem/value chain.
- 11. (Note that the purpose of the below list is to highlight the exhaustiveness of coverage. This does not necessarily mean that all the below companies would be profile in the scope. However, at the same, we are open to profile additional company(s) on specific request).
- 12. Amkor Technology
- 13. ASE Group
- 14. Siliconware Precision Industries Co., Ltd.
- 15. Jiangsu Changjiang Electronics Technology Co., Ltd.
- 16. Unisem (M) Berhad
- 17. Powertech Technology Inc.
- 18. Integra Technologies
- 19. UTAC
- 20. Tianshui Huatian Technology Co., Ltd
- 21. King Yuan ELECTRONICS CO., LTD.
- 22. Chipbond Technology Corporation
- 23. GLOBALFOUNDRIES U.S. Inc.
- 24. ChipMOS TECHNOLOGIES INC.
- 25. Walton Advanced Engineering Inc.
- 26. Lingsen Precision Industries, LTD.
- 27. Teledyne Technologies Inc.
- 28. Formosa Advanced Technologies Co., Ltd
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