Printed Circuit Board Market

Printed Circuit Board Market



Growth Factors of Printed Circuit Board Market

The Printed Circuit Board Market size was valued at USD 69.69 billion in 2023. The market is projected to grow from USD 71.57 billion in 2024 to USD 113.49 billion by 2032, exhibiting a CAGR of 5.9% during the forecast period of 2024-2032.

The COVID-19 pandemic disrupted worldwide supply chains, affecting the production and distribution of published circuit forums (PCBs). Manufacturing plants faced closures, leading to delays in production and transport. The electronics industry, which closely relies on PCBs, skilled huge shortages, in particular in sectors like automotive and purchaser electronics. However, the call for for PCBs within the healthcare enterprise surged, pushed by using the want for scientific gadgets like ventilators and tracking structures. Overall, while sure sectors confronted setbacks, the pandemic underscored the important role of PCBs in important technology sectors.

One distinguished fashion in the PCB marketplace is the shift towards miniaturization and high-density interconnect (HDI) era. As customer electronics, specifically smartphones, wearables, and IoT gadgets, maintain to reduce in size, producers are adopting HDI PCBs to accommodate more functionality within smaller spaces. These superior PCBs permit for extra additives in compact designs, enhancing device overall performance without increasing size. This trend is driving innovation in PCB production, pushing for greater sophisticated production techniques to satisfy the growing call for for smaller, greater green electronic additives.

A key riding element inside the PCB market is the increasing call for for car electronics, in particular with the upward thrust of electric automobiles (EVs). PCBs are important for various car structures, together with battery management, infotainment, and advanced driving force help systems (ADAS). As automakers retain to put money into EV era and self reliant driving functions, the want for dependable, excessive-overall performance PCBs is developing. This shift is fueling the enlargement of the PCB marketplace, as producers innovate to fulfill the unique necessities of the car sector, which includes thermal control and sturdiness in harsh situations.

Comprehensive Analysis of Printed Circuit Board Market

The Printed Circuit Board Market growth is rising at an exponential rate due to its marketplace segmentation. This market expansion correctly affords a detailed local assessments thinking about the dominant supply and call for forces that effect the enterprise. These segmentations are methodically segregated by . By Product Type include Rigid Board , HDI Board ,Flexible Board, Others. By Application include Automotive, Consumer Electronics, Telecommunication ,Healthcare ,Energy & Power, Others (Military, Utilities).

The Asia Pacific region lead the Printed Circuit Board Market share by benefitting a market size of USD 39.51 billion The global PCB industry is growing with a stable CAGR and a rising need for precision components and compact devices.

The top players in the market play a crucial role in the industry assuring market growth and setting market standards. These players include, Google LLC (Alphabet, Inc.), Magic Leap, Inc., ReWalk Robotics, SAMSUNG, B-Temia, Panasonic Holdings Corporation, NVIDIA Corporation, Microsoft, Ekso Bionics, Vuzix,these market players provide a level-playing competitive landscape.

February 2024: TTM Technologies Inc., a main revealed circuit board producer, brought a new collection of radio frequency and specialty aspect enterprise gadgets for the 5G Transceiver and electricity amplifier.

Segmentation Table

ATTRIBUTE DETAILS

Study Period 2019-2032

Base Year 2023

Estimated Year 2024

Forecast Period 2024-2032

Historical Period 2019-2022

Growth Rate CAGR of 5.9% from 2024 to 2032

Unit Value (USD Billion)

Segmentation By Product Type
  • Rigid Board
  • Single Layer Board
  • Double Layer Board
  • Others (Multilayer)
HDI Board

Flexible Board

Others

By Application
  • Automotive
  • Consumer Electronics
  • Telecommunication
  • Healthcare
  • Energy & Power
  • Others (Military, Utilities)
By Region
  • North America (By Product Type, Application, and Country)
  • U.S. (By Product Type)
  • Canada (By Product Type)
  • Mexico (By Product Type)
Europe (By Product Type, Application, and Country)
  • Germany (By Product Type)
  • U.K. (By Product Type)
  • France (By Product Type)
  • Italy (By Product Type)
  • Spain (By Product Type)
  • Russia (By Product Type)
  • Nordics (By Product Type)
  • Benelux (By Product Type)
  • Rest of Europe
Asia Pacific (By Product Type, Application, and Country)
  • China (By Product Type)
  • India (By Product Type)
  • Japan (By Product Type)
  • South Korea (By Product Type)
  • ASEAN (By Product Type)
  • Oceania (By Product Type)
  • Rest of Asia Pacific
Middle East & Africa (By Product Type, Application, and Country)
  • GCC (By Product Type)
  • South Africa (By Product Type)
  • North Africa (By Product Type)
  • Turkey (By Product Type)
  • Israel (By Product Type)
  • Rest of the Middle East & Africa
South America (By Product Type, Application, and Country)
  • Brazil (By Product Type)
  • Argentina (By Product Type)
  • Rest of South America


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1. Introduction
1.1. Definition, By Segment
1.2. Research Methodology/Approach
1.3. Data Sources
2. Executive Summary
3. Market Dynamics
3.1. Macro and Micro Economic Indicators
3.2. Drivers, Restraints, Opportunities and Trends
3.3. Impact of Generative AI
4. Competition Landscape
4.1. Business Strategies Adopted by Key Players
4.2. Consolidated SWOT Analysis of Key Players
4.3. Global Printed Circuit Board Key Players Market Share/Ranking, 2023
5. Global Printed Circuit Board Market Size Estimates and Forecasts, By Segments, 2019-2032
5.1. Key Findings
5.2. By Product Type (USD)
5.2.1. Rigid Board
5.2.1.1. Single Layer Board
5.2.1.2. Double Layer Board
5.2.1.3. Others (Multilayer, and Others)
5.2.2. HDI Board
5.2.3. Flexible Board
5.2.4. Others
5.3. By Application (USD)
5.3.1. Automotive
5.3.2. Consumer Electronics
5.3.3. Telecommunication
5.3.4. Healthcare
5.3.5. Energy & Power
5.3.6. Others (Military, Utilities, and Others)
5.4. By Region (USD)
5.4.1. North America
5.4.2. Europe
5.4.3. Asia Pacific
5.4.4. Middle East & Africa
5.4.5. South America
6. North America Printed Circuit Board Market Size Estimates and Forecasts, By Segments, 2019-2032
6.1. Key Findings
6.2. By Product Type (USD)
6.2.1. Rigid Board
6.2.1.1. Single Layer Board
6.2.1.2. Double Layer Board
6.2.1.3. Others (Multilayer, and Others)
6.2.2. HDI Board
6.2.3. Flexible Board
6.2.4. Others
6.3. By Application (USD)
6.3.1. Automotive
6.3.2. Consumer Electronics
6.3.3. Telecommunication
6.3.4. Healthcare
6.3.5. Energy & Power
6.3.6. Others (Military, Utilities, and Others)
6.4. By Country (USD)
6.4.1. United States
6.4.1.1. By Product Type
6.4.2. Canada
6.4.2.1. By Product Type
6.4.3. Mexico
6.4.3.1. By Product Type
7. Europe Printed Circuit Board Market Size Estimates and Forecasts, By Segments, 2019-2032
7.1. Key Findings
7.2. By Product Type (USD)
7.2.1. Rigid Board
7.2.1.1. Single Layer Board
7.2.1.2. Double Layer Board
7.2.1.3. Others (Multilayer, and Others)
7.2.2. HDI Board
7.2.3. Flexible Board
7.2.4. Others
7.3. By Application (USD)
7.3.1. Automotive
7.3.2. Consumer Electronics
7.3.3. Telecommunication
7.3.4. Healthcare
7.3.5. Energy & Power
7.3.6. Others (Military, Utilities, and Others)
7.4. By Country (USD)
7.4.1. United Kingdom
7.4.1.1. By Product Type
7.4.2. Germany
7.4.2.1. By Product Type
7.4.3. France
7.4.3.1. By Product Type
7.4.4. Italy
7.4.4.1. By Product Type
7.4.5. Spain
7.4.5.1. By Product Type
7.4.6. Russia
7.4.6.1. By Product Type
7.4.7. Nordics
7.4.7.1. By Product Type
7.4.8. Benelux
7.4.8.1. By Product Type
7.4.9. Rest of Europe
8. Asia Pacific Printed Circuit Board Market Size Estimates and Forecasts, By Segments, 2019-2032
8.1. Key Findings
8.2. By Product Type (USD)
8.2.1. Rigid Board
8.2.1.1. Single Layer Board
8.2.1.2. Double Layer Board
8.2.1.3. Others (Multilayer, and Others)
8.2.2. HDI Board
8.2.3. Flexible Board
8.2.4. Others
8.3. By Application (USD)
8.3.1. Automotive
8.3.2. Consumer Electronics
8.3.3. Telecommunication
8.3.4. Healthcare
8.3.5. Energy & Power
8.3.6. Others (Military, Utilities, and Others)
8.4. By Country (USD)
8.4.1. China
8.4.1.1. By Product Type
8.4.2. India
8.4.2.1. By Product Type
8.4.3. Japan
8.4.3.1. By Product Type
8.4.4. South Korea
8.4.4.1. By Product Type
8.4.5. ASEAN
8.4.5.1. By Product Type
8.4.6. Oceania
8.4.6.1. By Product Type
8.4.7. Rest of Asia Pacific
9. Middle East & Africa Printed Circuit Board Market Size Estimates and Forecasts, By Segments, 2019-2032
9.1. Key Findings
9.2. By Product Type (USD)
9.2.1. Rigid Board
9.2.1.1. Single Layer Board
9.2.1.2. Double Layer Board
9.2.1.3. Others (Multilayer, and Others)
9.2.2. HDI Board
9.2.3. Flexible Board
9.2.4. Others
9.3. By Application (USD)
9.3.1. Automotive
9.3.2. Consumer Electronics
9.3.3. Telecommunication
9.3.4. Healthcare
9.3.5. Energy & Power
9.3.6. Others (Military, Utilities, and Others)
9.4. By Country (USD)
9.4.1. GCC
9.4.1.1. By Product Type
9.4.2. South Africa
9.4.2.1. By Product Type
9.4.3. North Africa
9.4.3.1. By Product Type
9.4.4. Turkey
9.4.4.1. By Product Type
9.4.5. Israel
9.4.5.1. By Product Type
9.4.6. Rest of MEA
10. South America Printed Circuit Board Market Size Estimates and Forecasts, By Segments, 2019-2032
10.1. Key Findings
10.2. By Product Type (USD)
10.2.1. Rigid Board
10.2.1.1. Single Layer Board
10.2.1.2. Double Layer Board
10.2.1.3. Others (Multilayer, and Others)
10.2.2. HDI Board
10.2.3. Flexible Board
10.2.4. Others
10.3. By Application (USD)
10.3.1. Automotive
10.3.2. Consumer Electronics
10.3.3. Telecommunication
10.3.4. Healthcare
10.3.5. Energy & Power
10.3.6. Others (Military, Utilities, and Others)
10.4. By Country (USD)
10.4.1. Brazil
10.4.1.1. By Product Type
10.4.2. Argentina
10.4.2.1. By Product Type
10.4.3. Rest of South America
11. Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)
11.1. Zhen Ding
11.1.1. Overview
11.1.1.1. Key Management
11.1.1.2. Headquarters
11.1.1.3. Offerings/Business Segments
11.1.2. Key Details (Key details are consolidated data and not product/service specific)
11.1.2.1. Employee Size
11.1.2.2. Past and Current Revenue
11.1.2.3. Geographical Share
11.1.2.4. Business Segment Share
11.1.2.5. Recent Developments
11.2. Unimicron
11.2.1. Overview
11.2.1.1. Key Management
11.2.1.2. Headquarters
11.2.1.3. Offerings/Business Segments
11.2.2. Key Details (Key details are consolidated data and not product/service specific)
11.2.2.1. Employee Size
11.2.2.2. Past and Current Revenue
11.2.2.3. Geographical Share
11.2.2.4. Business Segment Share
11.2.2.5. Recent Developments
11.3. DSBJ
11.3.1. Overview
11.3.1.1. Key Management
11.3.1.2. Headquarters
11.3.1.3. Offerings/Business Segments
11.3.2. Key Details (Key details are consolidated data and not product/service specific)
11.3.2.1. Employee Size
11.3.2.2. Past and Current Revenue
11.3.2.3. Geographical Share
11.3.2.4. Business Segment Share
11.3.2.5. Recent Developments
11.4. Nippon Mektron
11.4.1. Overview
11.4.1.1. Key Management
11.4.1.2. Headquarters
11.4.1.3. Offerings/Business Segments
11.4.2. Key Details (Key details are consolidated data and not product/service specific)
11.4.2.1. Employee Size
11.4.2.2. Past and Current Revenue
11.4.2.3. Geographical Share
11.4.2.4. Business Segment Share
11.4.2.5. Recent Developments
11.5. Compeq
11.5.1. Overview
11.5.1.1. Key Management
11.5.1.2. Headquarters
11.5.1.3. Offerings/Business Segments
11.5.2. Key Details (Key details are consolidated data and not product/service specific)
11.5.2.1. Employee Size
11.5.2.2. Past and Current Revenue
11.5.2.3. Geographical Share
11.5.2.4. Business Segment Share
11.5.2.5. Recent Developments
11.6. Tripod
11.6.1. Overview
11.6.1.1. Key Management
11.6.1.2. Headquarters
11.6.1.3. Offerings/Business Segments
11.6.2. Key Details (Key details are consolidated data and not product/service specific)
11.6.2.1. Employee Size
11.6.2.2. Past and Current Revenue
11.6.2.3. Geographical Share
11.6.2.4. Business Segment Share
11.6.2.5. Recent Developments
11.7. TTM Technologies
11.7.1. Overview
11.7.1.1. Key Management
11.7.1.2. Headquarters
11.7.1.3. Offerings/Business Segments
11.7.2. Key Details (Key details are consolidated data and not product/service specific)
11.7.2.1. Employee Size
11.7.2.2. Past and Current Revenue
11.7.2.3. Geographical Share
11.7.2.4. Business Segment Share
11.7.2.5. Recent Developments
11.8. SCC
11.8.1. Overview
11.8.1.1. Key Management
11.8.1.2. Headquarters
11.8.1.3. Offerings/Business Segments
11.8.2. Key Details (Key details are consolidated data and not product/service specific)
11.8.2.1. Employee Size
11.8.2.2. Past and Current Revenue
11.8.2.3. Geographical Share
11.8.2.4. Business Segment Share
11.8.2.5. Recent Developments
11.9. Ibiden
11.9.1. Overview
11.9.1.1. Key Management
11.9.1.2. Headquarters
11.9.1.3. Offerings/Business Segments
11.9.2. Key Details (Key details are consolidated data and not product/service specific)
11.9.2.1. Employee Size
11.9.2.2. Past and Current Revenue
11.9.2.3. Geographical Share
11.9.2.4. Business Segment Share
11.9.2.5. Recent Developments
11.10. Hannstar Board
11.10.1. Overview
11.10.1.1. Key Management
11.10.1.2. Headquarters
11.10.1.3. Offerings/Business Segments
11.10.2. Key Details (Key details are consolidated data and not product/service specific)
11.10.2.1. Employee Size
11.10.2.2. Past and Current Revenue
11.10.2.3. Geographical Share
11.10.2.4. Business Segment Share
11.10.2.5. Recent Developments
12. Key Takeaways
13.

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