Advanced Semiconductor Packaging Market - Global Advanced Semiconductor Packaging Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, and Forecast 2023-2030 (By Packaging Type Coverage, By Application Coverage, By Geographic Coverage and By

Advanced Semiconductor Packaging Market - Global Advanced Semiconductor Packaging Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, and Forecast 2023-2030 (By Packaging Type Coverage, By Application Coverage, By Geographic Coverage and By Company)


Global Advanced Semiconductor Packaging Market Poised for Rapid Growth at a 10.8% CAGR, Expected to Surpass US$90 Billion by 2030
The advanced semiconductor packaging market is gearing up for substantial growth, with a projected compound annual growth rate (CAGR) of 10.8% expected between 2023 and 2030. This market focuses on developing and integrating advanced packaging technologies for semiconductor devices, providing mechanical support, thermal control, and electrical connections to protect and connect integrated circuits (ICs) or chips. Various packaging technologies, including 2.5D and 3D packaging, fan-out wafer-level packaging (FOWLP), system-in-package (SiP), flip-chip packing, and wafer-level chip-scale packaging (WLCSP), are driving this growth. Factors such as increasing demand for consumer electronics, technological advancements, and ongoing innovation in the consumer electronics industry are propelling the advanced semiconductor packaging market forward.

Key Report Findings
1. Impressive Growth: The global advanced semiconductor packaging market is set to expand at a significant rate of 10.8% CAGR between 2023 and 2030.
2. Technological Advancements Drive Demand: Increasing demand for advanced semiconductor packaging is being fueled by continuous technological advancements in semiconductors.
3. FOWLP Leads Demand: Fan-out wafer-level packaging (FOWLP) remains in high demand in the advanced semiconductor packaging market.
4. Consumer Electronics Dominates: Consumer electronics emerged as the largest revenue generator in the advanced semiconductor packaging market in 2022.
5. Asia Pacific Leads: Asia Pacific continues to lead the global market, while North America exhibits the strongest growth potential through 2030.

Growth Drivers
1. Rising Consumer Electronics Sales and R&D Investments: The surge in consumer electronics demand and substantial R&D investments by major players are driving the advanced semiconductor packaging market. These packaging technologies enable smaller, more powerful, and feature-rich devices in response to consumer preferences.
2. Semiconductor Technological Advancements: The expansion of the semiconductor industry and technological advancements are major drivers of the advanced semiconductor packaging market. These innovations facilitate the integration, miniaturization, and performance enhancement of semiconductor devices, propelling the entire industry forward.

Market Challenges
1. Complexity of Integrated Circuits and High Costs: The complexity of integrated circuits and the high costs associated with designing and manufacturing advanced semiconductor packaging solutions pose significant challenges. Handling complex interconnects, heterogeneous components, and effective heat management requires advanced design techniques, simulation tools, and expertise.
2. High Manufacturing Costs: The development and manufacturing of sophisticated packaging solutions, such as wafer-level or 2.5D/3D packaging, can be capital-intensive, potentially limiting adoption in cost-sensitive industries.

Overview of Key Segments
1. FOWLP Dominates: Fan-out wafer-level packaging (FOWLP) remains the dominant segment in the advanced semiconductor packaging market, driven by its integration potential, small form size, and performance improvements.
2. Consumer Electronics Leader: Consumer electronics lead the market, relying on advanced semiconductor packaging to enable smaller, more powerful, and feature-rich devices.

Growth Opportunities Across Regions
1. Asia Pacific Leads: Asia Pacific, with key players in semiconductor manufacturing hubs like China, South Korea, Taiwan, and Japan, will continue to dominate the advanced semiconductor packaging market. Growing demand for innovative packaging technologies to meet various industry needs, including 5G, AI, and IoT, is a key driver.
2. North America's Rapid Growth: North America, especially the US, is witnessing significant growth potential due to its focus on AI, ML, and electric vehicles (EVs). Advanced packaging technologies are crucial in these applications, driving the market's growth.

Key Players
Leading players in the advanced semiconductor packaging market include Advanced Semiconductor Engineering, Inc., Advanced Micro Devices, Inc. (AMD), Intel Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology (JCET), STMicroelectronics N.V., Hitachi Chemical, Infineon, Avery Dennison, ASE Group, Kyocera, China Wafer Level CSP, Sumitomo Chemical, ChipMOS TECHNOLOGIES, FlipChip International, HANA Micron, Interconnect Systems (Molex), Tongfu Microelectronics, Nepes, Powertech Technology (PTI), King Yuan Electronics, SIGNETICS, Tianshui Huatian, Ultratech, and UTAC.

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1. Executive Summary
1.1. Global Advanced Semiconductor Packaging Market Snapshot
1.2. Future Projections
1.3. Key Market Trends
1.4. Regional Snapshot, by Value, 2022
1.5. Analyst Recommendations
2. Market Overview
2.1. Market Definitions and Segmentations
2.2. Market Dynamics
2.2.1. Drivers
2.2.2. Restraints
2.2.3. Market Opportunities
2.3. Value Chain Analysis
2.4. Porter’s Five Forces Analysis
2.5. Covid-19 Impact Analysis
2.5.1. Supply
2.5.2. Demand
2.6. Impact of Ukraine-Russia Conflict
2.7. Economic Overview
2.7.1. World Economic Projections
2.8. PESTLE Analysis
3. Global Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
3.1. Global Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
3.1.1. Key Highlights
3.1.1.1. FO WLP
3.1.1.2. 2.5D/3D
3.1.1.3. FI WLP
3.1.1.4. Flip Chip
3.2. Global Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
3.2.1. Key Highlights
3.2.1.1. Automotive
3.2.1.2. Aerospace and Defense
3.2.1.3. Medical Devices
3.2.1.4. Consumer Electronics
3.2.1.5. Other
3.3. Global Advanced Semiconductor Packaging Market Outlook, by Region, Value (US$ Bn), 2018 – 2030
3.3.1. Key Highlights
3.3.1.1. North America
3.3.1.2. Europe
3.3.1.3. Asia Pacific
3.3.1.4. Latin America
3.3.1.5. Middle East & Africa
4. North America Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
4.1. North America Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
4.1.1. Key Highlights
4.1.1.1. FO WLP
4.1.1.2. 2.5D/3D
4.1.1.3. FI WLP
4.1.1.4. Flip Chip
4.2. North America Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
4.2.1. Key Highlights
4.2.1.1. Automotive
4.2.1.2. Aerospace and Defense
4.2.1.3. Medical Devices
4.2.1.4. Consumer Electronics
4.2.1.5. Other
4.2.2. Market Attractiveness Analysis
4.3. North America Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
4.3.1. Key Highlights
4.3.1.1. U.S. Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
4.3.1.2. U.S. Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
4.3.1.3. Canada Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
4.3.1.4. Canada Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
4.3.2. BPS Analysis/Market Attractiveness Analysis
5. Europe Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
5.1. Europe Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
5.1.1. Key Highlights
5.1.1.1. FO WLP
5.1.1.2. 2.5D/3D
5.1.1.3. FI WLP
5.1.1.4. Flip Chip
5.2. Europe Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
5.2.1. Key Highlights
5.2.1.1. Automotive
5.2.1.2. Aerospace and Defense
5.2.1.3. Medical Devices
5.2.1.4. Consumer Electronics
5.2.1.5. Other
5.2.2. BPS Analysis/Market Attractiveness Analysis
5.3. Europe Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
5.3.1. Key Highlights
5.3.1.1. Germany Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
5.3.1.2. Germany Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
5.3.1.3. U.K. Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
5.3.1.4. U.K. Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
5.3.1.5. France Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
5.3.1.6. France Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
5.3.1.7. Italy Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
5.3.1.8. Italy Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
5.3.1.9. Spain Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
5.3.1.10. Spain Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
5.3.1.11. Spain Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
5.3.1.12. Russia Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
5.3.1.13. Rest of Europe Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
5.3.1.14. Rest of Europe Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
5.3.2. BPS Analysis/Market Attractiveness Analysis
6. Asia Pacific Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
6.1. Asia Pacific Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
6.1.1. Key Highlights
6.1.1.1. FO WLP
6.1.1.2. 2.5D/3D
6.1.1.3. FI WLP
6.1.1.4. Flip Chip
6.2. Asia Pacific Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
6.2.1. Key Highlights
6.2.1.1. Automotive
6.2.1.2. Aerospace and Defense
6.2.1.3. Medical Devices
6.2.1.4. Consumer Electronics
6.2.1.5. Other
6.2.2. BPS Analysis/Market Attractiveness Analysis
6.3. Asia Pacific Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
6.3.1. Key Highlights
6.3.1.1. China Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
6.3.1.2. China Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
6.3.1.3. Japan Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
6.3.1.4. Japan Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
6.3.1.5. South Korea Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
6.3.1.6. South Korea Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
6.3.1.7. India Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
6.3.1.8. India Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
6.3.1.9. Southeast Asia Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
6.3.1.10. Southeast Asia Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
6.3.1.11. Rest of Asia Pacific Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
6.3.1.12. Rest of Asia Pacific Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
6.3.2. BPS Analysis/Market Attractiveness Analysis
7. Latin America Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
7.1. Latin America Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
7.1.1. Key Highlights
7.1.1.1. FO WLP
7.1.1.2. 2.5D/3D
7.1.1.3. FI WLP
7.1.1.4. Flip Chip
7.2. Latin America Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
7.2.1. Key Highlights
7.2.1.1. Automotive
7.2.1.2. Aerospace and Defense
7.2.1.3. Medical Devices
7.2.1.4. Consumer Electronics
7.2.1.5. Other
7.2.2. BPS Analysis/Market Attractiveness Analysis
7.3. Latin America Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
7.3.1. Key Highlights
7.3.1.1. Brazil Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
7.3.1.2. Brazil Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
7.3.1.3. Mexico Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
7.3.1.4. Mexico Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
7.3.1.5. Rest of Latin America Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
7.3.1.6. Rest of Latin America Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
7.3.2. BPS Analysis/Market Attractiveness Analysis
8. Middle East & Africa Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
8.1. Middle East & Africa Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
8.1.1. Key Highlights
8.1.1.1. FO WLP
8.1.1.2. 2.5D/3D
8.1.1.3. FI WLP
8.1.1.4. Flip Chip
8.2. Middle East & Africa Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
8.2.1. Key Highlights
8.2.1.1. Automotive
8.2.1.2. Aerospace and Defense
8.2.1.3. Medical Devices
8.2.1.4. Consumer Electronics
8.2.1.5. Other
8.2.2. BPS Analysis/Market Attractiveness Analysis
8.3. Middle East & Africa Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
8.3.1. Key Highlights
8.3.1.1. GCC Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
8.3.1.2. GCC Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
8.3.1.3. South Africa Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
8.3.1.4. South Africa Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
8.3.1.5. Rest of Middle East & Africa Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
8.3.1.6. Rest of Middle East & Africa Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
8.3.2. BPS Analysis/Market Attractiveness Analysis
9. Competitive Landscape
9.1. Manufacturer vs Packaging Type Heatmap
9.2. Company Market Share Analysis, 2022
9.3. Competitive Dashboard
9.4. Company Profiles
9.4.1. Advanced Semiconductor Engineering, Inc.
9.4.1.1. Company Overview
9.4.1.2. Product Portfolio
9.4.1.3. Financial Overview
9.4.1.4. Business Strategies and Development
9.4.2. Advanced Micro Devices, Inc. (AMD)
9.4.2.1. Company Overview
9.4.2.2. Product Portfolio
9.4.2.3. Financial Overview
9.4.2.4. Business Strategies and Development
9.4.3. Intel Corporation
9.4.3.1. Company Overview
9.4.3.2. Product Portfolio
9.4.3.3. Financial Overview
9.4.3.4. Business Strategies and Development
9.4.4. Amkor Technology
9.4.4.1. Company Overview
9.4.4.2. Product Portfolio
9.4.4.3. Financial Overview
9.4.4.4. Business Strategies and Development
9.4.5. STMicroelectronics N.V.
9.4.5.1. Company Overview
9.4.5.2. Product Portfolio
9.4.5.3. Financial Overview
9.4.5.4. Business Strategies and Development
9.4.6. Hitachi Chemical
9.4.6.1. Company Overview
9.4.6.2. Product Portfolio
9.4.6.3. Financial Overview
9.4.6.4. Business Strategies and Development
9.4.7. Infineon
9.4.7.1. Company Overview
9.4.7.2. Product Portfolio
9.4.7.3. Financial Overview
9.4.7.4. Business Strategies and Development
9.4.8. Avery Dennison
9.4.8.1. Company Overview
9.4.8.2. Product Portfolio
9.4.8.3. Financial Overview
9.4.8.4. Business Strategies and Development
9.4.9. Sumitomo Chemical
9.4.9.1. Company Overview
9.4.9.2. Product Portfolio
9.4.9.3. Business Strategies and Development
9.4.10. ASE Group
9.4.10.1. Company Overview
9.4.10.2. Product Portfolio
9.4.10.3. Financial Overview
9.4.10.4. Business Strategies and Development
9.4.11. Kyocera
9.4.11.1. Company Overview
9.4.11.2. Product Portfolio
9.4.11.3. Financial Overview
9.4.11.4. Business Strategies and Development
9.4.12. China Wafer Level CSP
9.4.12.1. Company Overview
9.4.12.2. Product Portfolio
9.4.12.3. Financial Overview
9.4.12.4. Business Strategies and Development
10. Appendix
10.1. Research Methodology
10.2. Report Assumptions
10.3. Acronyms and Abbreviations

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