Research Summary
Wafer thinning equipment refers to machinery and tools used in the process of reducing the thickness of semiconductor wafers to achieve the desired specifications for semiconductor device fabrication. This process, known as wafer thinning or backgrinding, is typically performed after semiconductor devices have been fabricated on the wafer and before the individual chips are separated and packaged. Wafer thinning equipment includes specialized machines such as wafer grinders, chemical mechanical planarization (CMP) systems, and polishing machines. These machines utilize precision grinding wheels, abrasive slurries, or chemical etchants to remove material from the backside of the wafer, gradually reducing its thickness while maintaining uniformity and flatness. Wafer thinning equipment is critical in semiconductor manufacturing, as it enables the production of thinner wafers with precise thickness control, which is essential for achieving high-performance semiconductor devices and increasing the yield of integrated circuits.
According to DIResearch's in-depth investigation and research, the global Wafer Thinning Equipment market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.
The major global manufacturers of Wafer Thinning Equipment include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Shenzhen Fangda, Hunan Yujing Machine Industrial, SpeedFam, Hauhaiqingke etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.
This report studies the market size, price trends and future development prospects of Wafer Thinning Equipment. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Wafer Thinning Equipment market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Wafer Thinning Equipment market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Wafer Thinning Equipment industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Wafer Thinning Equipment Include:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Wafer Thinning Equipment Product Segment Include:
Fully Automatic Equipment
Semi-Automatic Equipment
Wafer Thinning Equipment Product Application Include:
200mm Wafer
300mm Wafer
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global Wafer Thinning Equipment Industry PESTEL Analysis
Chapter 3: Global Wafer Thinning Equipment Industry Porter’s Five Forces Analysis
Chapter 4: Global Wafer Thinning Equipment Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis
Chapter 5: Global Wafer Thinning Equipment Market Size and Forecast by Type and Application Analysis
Chapter 6: North America Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global Wafer Thinning Equipment Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources
- 1 Wafer Thinning Equipment Market Overview
- 1.1 Product Definition and Statistical Scope
- 1.2 Wafer Thinning Equipment Product by Type
- 1.2.1 Fully Automatic Equipment
- 1.2.2 Semi-Automatic Equipment
- 1.3 Wafer Thinning Equipment Product by Application
- 1.3.1 200mm Wafer
- 1.3.2 300mm Wafer
- 1.3.3 Others
- 1.4 Global Wafer Thinning Equipment Market Revenue and Sales Analysis
- 1.4.1 Global Wafer Thinning Equipment Revenue Market Size Analysis (2020-2032)
- 1.4.2 Global Wafer Thinning Equipment Sales Market Size Analysis (2020-2032)
- 1.4.3 Global Wafer Thinning Equipment Market Sales Price Trend Analysis (2020-2032)
- 1.5 Wafer Thinning Equipment Industry Trends and Innovation
- 1.5.1 Wafer Thinning Equipment Industry Trends and Innovation
- 1.5.2 Wafer Thinning Equipment Market Drivers and Challenges
- 2 Wafer Thinning Equipment Market PESTEL Analysis
- 2.1 Political Factors Analysis
- 2.2 Economic Factors Analysis
- 2.3 Social Factors Analysis
- 2.4 Technological Factors Analysis
- 2.5 Environmental Factors Analysis
- 2.6 Legal Factors Analysis
- 3 Wafer Thinning Equipment Market Porter's Five Forces Analysis
- 3.1 Competitive Rivalry
- 3.2 Threat of New Entrants
- 3.3 Bargaining Power of Suppliers
- 3.4 Bargaining Power of Buyers
- 3.5 Threat of Substitutes
- 4 Global Wafer Thinning Equipment Market Analysis by Regions
- 4.1 Global Wafer Thinning Equipment Overall Market: 2024 VS 2025 VS 2032
- 4.2 Global Wafer Thinning Equipment Revenue and Forecast Analysis (2020-2032)
- 4.2.1 Global Wafer Thinning Equipment Revenue and Market Share by Region (2020-2025)
- 4.2.2 Global Wafer Thinning Equipment Revenue and Market Share Forecast by Region (2026-2032)
- 4.3 Global Wafer Thinning Equipment Sales and Forecast Analysis (2020-2032)
- 4.3.1 Global Wafer Thinning Equipment Sales and Market Share by Region (2020-2025)
- 4.3.2 Global Wafer Thinning Equipment Sales and Market Share Forecast by Region (2026-2032)
- 4.4 Global Wafer Thinning Equipment Sales Price Trend Analysis (2020-2032)
- 5 Global Wafer Thinning Equipment Market Size by Type and Application
- 5.1 Global Wafer Thinning Equipment Market Size by Type
- 5.1.1 Global Wafer Thinning Equipment Revenue and Forecast Analysis by Type (2020-2032)
- 5.1.2 Global Wafer Thinning Equipment Sales and Forecast Analysis by Type (2020-2032)
- 5.2 Global Wafer Thinning Equipment Market Size by Application
- 5.2.1 Global Wafer Thinning Equipment Revenue and Forecast Analysis by Application (2020-2032)
- 5.2.2 Global Wafer Thinning Equipment Sales and Forecast Analysis by Application (2020-2032)
- 6 North America
- 6.1 North America Wafer Thinning Equipment Market Size and Growth Rate Analysis (2020-2032)
- 6.2 North America Key Manufacturers Analysis
- 6.3 North America Wafer Thinning Equipment Market Size by Type
- 6.3.1 North America Wafer Thinning Equipment Sales by Type (2020-2032)
- 6.3.2 North America Wafer Thinning Equipment Revenue by Type (2020-2032)
- 6.4 North America Wafer Thinning Equipment Market Size by Application
- 6.4.1 North America Wafer Thinning Equipment Sales by Application (2020-2032)
- 6.4.2 North America Wafer Thinning Equipment Revenue by Application (2020-2032)
- 6.5 North America Wafer Thinning Equipment Market Size by Country
- 6.5.1 US
- 6.5.2 Canada
- 7 Europe
- 7.1 Europe Wafer Thinning Equipment Market Size and Growth Rate Analysis (2020-2032)
- 7.2 Europe Key Manufacturers Analysis
- 7.3 Europe Wafer Thinning Equipment Market Size by Type
- 7.3.1 Europe Wafer Thinning Equipment Sales by Type (2020-2032)
- 7.3.2 Europe Wafer Thinning Equipment Revenue by Type (2020-2032)
- 7.4 Europe Wafer Thinning Equipment Market Size by Application
- 7.4.1 Europe Wafer Thinning Equipment Sales by Application (2020-2032)
- 7.4.2 Europe Wafer Thinning Equipment Revenue by Application (2020-2032)
- 7.5 Europe Wafer Thinning Equipment Market Size by Country
- 7.5.1 Germany
- 7.5.2 France
- 7.5.3 United Kingdom
- 7.5.4 Italy
- 7.5.5 Spain
- 7.5.6 Benelux
- 8 China
- 8.1 China Wafer Thinning Equipment Market Size and Growth Rate Analysis (2020-2032)
- 8.2 China Key Manufacturers Analysis
- 8.3 China Wafer Thinning Equipment Market Size by Type
- 8.3.1 China Wafer Thinning Equipment Sales by Type (2020-2032)
- 8.3.2 China Wafer Thinning Equipment Revenue by Type (2020-2032)
- 8.4 China Wafer Thinning Equipment Market Size by Application
- 8.4.1 China Wafer Thinning Equipment Sales by Application (2020-2032)
- 8.4.2 China Wafer Thinning Equipment Revenue by Application (2020-2032)
- 9 APAC (excl. China)
- 9.1 APAC (excl. China) Wafer Thinning Equipment Market Size and Growth Rate Analysis (2020-2032)
- 9.2 APAC (excl. China) Key Manufacturers Analysis
- 9.3 APAC (excl. China) Wafer Thinning Equipment Market Size by Type
- 9.3.1 APAC (excl. China) Wafer Thinning Equipment Sales by Type (2020-2032)
- 9.3.2 APAC (excl. China) Wafer Thinning Equipment Revenue by Type (2020-2032)
- 9.4 APAC (excl. China) Wafer Thinning Equipment Market Size by Application
- 9.4.1 APAC (excl. China) Wafer Thinning Equipment Sales by Application (2020-2032)
- 9.4.2 APAC (excl. China) Wafer Thinning Equipment Revenue by Application (2020-2032)
- 9.5 APAC (excl. China) Wafer Thinning Equipment Market Size by Country
- 9.5.1 Japan
- 9.5.2 South Korea
- 9.5.3 India
- 9.5.4 Australia
- 9.5.5 Southeast Asia
- 10 Latin America
- 10.1 Latin America Wafer Thinning Equipment Market Size and Growth Rate Analysis (2020-2032)
- 10.2 Latin America Key Manufacturers Analysis
- 10.3 Latin America Wafer Thinning Equipment Market Size by Type
- 10.3.1 Latin America Wafer Thinning Equipment Sales by Type (2020-2032)
- 10.3.2 Latin America Wafer Thinning Equipment Revenue by Type (2020-2032)
- 10.4 Latin America Wafer Thinning Equipment Market Size by Application
- 10.4.1 Latin America Wafer Thinning Equipment Sales by Application (2020-2032)
- 10.4.2 Latin America Wafer Thinning Equipment Revenue by Application (2020-2032)
- 10.5 Latin America Wafer Thinning Equipment Market Size by Country
- 10.6 Latin America Wafer Thinning Equipment Market Size by Country
- 10.6.1 Mexico
- 10.6.2 Brazil
- 11 Middle East & Africa
- 11.1 Middle East & Africa Wafer Thinning Equipment Market Size and Growth Rate Analysis (2020-2032)
- 11.2 Middle East & Africa Key Manufacturers Analysis
- 11.3 Middle East & Africa Wafer Thinning Equipment Market Size by Type
- 11.3.1 Middle East & Africa Wafer Thinning Equipment Sales by Type (2020-2032)
- 11.3.2 Middle East & Africa Wafer Thinning Equipment Revenue by Type (2020-2032)
- 11.4 Middle East & Africa Wafer Thinning Equipment Market Size by Application
- 11.4.1 Middle East & Africa Wafer Thinning Equipment Sales by Application (2020-2032)
- 11.4.2 Middle East & Africa Wafer Thinning Equipment Revenue by Application (2020-2032)
- 11.5 Middle East Wafer Thinning Equipment Market Size by Country
- 11.5.1 Saudi Arabia
- 11.5.2 South Africa
- 12 Competition by Manufacturers
- 12.1 Global Wafer Thinning Equipment Market Sales, Revenue and Price by Key Manufacturers (2021-2025)
- 12.1.1 Global Wafer Thinning Equipment Market Sales by Key Manufacturers (2021-2025)
- 12.1.2 Global Wafer Thinning Equipment Market Revenue by Key Manufacturers (2021-2025)
- 12.1.3 Global Wafer Thinning Equipment Average Sales Price by Manufacturers (2021-2025)
- 12.2 Wafer Thinning Equipment Competitive Landscape Analysis and Market Dynamic
- 12.2.1 Wafer Thinning Equipment Competitive Landscape Analysis
- 12.2.2 Global Key Manufacturers Headquarter Location and Key Area Sales
- 12.2.3 Market Dynamic
- 13 Key Companies Analysis
- 13.1 Disco
- 13.1.1 Disco Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.1.2 Disco Wafer Thinning Equipment Product Portfolio
- 13.1.3 Disco Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.2 TOKYO SEIMITSU
- 13.2.1 TOKYO SEIMITSU Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.2.2 TOKYO SEIMITSU Wafer Thinning Equipment Product Portfolio
- 13.2.3 TOKYO SEIMITSU Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.3 G&N
- 13.3.1 G&N Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.3.2 G&N Wafer Thinning Equipment Product Portfolio
- 13.3.3 G&N Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.4 Okamoto Semiconductor Equipment Division
- 13.4.1 Okamoto Semiconductor Equipment Division Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.4.2 Okamoto Semiconductor Equipment Division Wafer Thinning Equipment Product Portfolio
- 13.4.3 Okamoto Semiconductor Equipment Division Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.5 CETC
- 13.5.1 CETC Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.5.2 CETC Wafer Thinning Equipment Product Portfolio
- 13.5.3 CETC Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.6 Koyo Machinery
- 13.6.1 Koyo Machinery Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.6.2 Koyo Machinery Wafer Thinning Equipment Product Portfolio
- 13.6.3 Koyo Machinery Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.7 Revasum
- 13.7.1 Revasum Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.7.2 Revasum Wafer Thinning Equipment Product Portfolio
- 13.7.3 Revasum Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.8 WAIDA MFG
- 13.8.1 WAIDA MFG Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.8.2 WAIDA MFG Wafer Thinning Equipment Product Portfolio
- 13.8.3 WAIDA MFG Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.9 Shenzhen Fangda
- 13.9.1 Shenzhen Fangda Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.9.2 Shenzhen Fangda Wafer Thinning Equipment Product Portfolio
- 13.9.3 Shenzhen Fangda Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.10 Hunan Yujing Machine Industrial
- 13.10.1 Hunan Yujing Machine Industrial Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.10.2 Hunan Yujing Machine Industrial Wafer Thinning Equipment Product Portfolio
- 13.10.3 Hunan Yujing Machine Industrial Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.11 SpeedFam
- 13.11.1 SpeedFam Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.11.2 SpeedFam Wafer Thinning Equipment Product Portfolio
- 13.11.3 SpeedFam Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 13.12 Hauhaiqingke
- 13.12.1 Hauhaiqingke Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)
- 13.12.2 Hauhaiqingke Wafer Thinning Equipment Product Portfolio
- 13.12.3 Hauhaiqingke Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2021-2025)
- 14 Industry Chain Analysis
- 14.1 Wafer Thinning Equipment Industry Chain Analysis
- 14.2 Wafer Thinning Equipment Industry Raw Material and Suppliers Analysis
- 14.2.1 Wafer Thinning Equipment Key Raw Material Supply Analysis
- 14.2.2 Raw Material Suppliers and Contact Information
- 14.3 Wafer Thinning Equipment Typical Downstream Customers
- 14.4 Wafer Thinning Equipment Sales Channel Analysis
- 15 Research Findings and Conclusion
- 16 Methodology and Data Source
- 16.1 Methodology/Research Approach
- 16.2 Research Scope
- 16.3 Benchmarks and Assumptions
- 16.4 Date Source
- 16.4.1 Primary Sources
- 16.4.2 Secondary Sources
- 16.5 Data Cross Validation
- 16.6 Disclaimer
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