Global Solder Resist Ink Competitive Landscape Professional Research Report 2024
Research Summary
Solder resist ink, also known as solder mask, is a specialized protective coating applied to printed circuit boards (PCBs) to insulate and shield the board's conductive traces and areas from unintended solder during the soldering process. Typically green but available in various colors, this ink is precisely applied to cover all areas of the PCB except the pads where components will be soldered. By preventing solder bridges and short circuits between closely spaced conductive paths, solder resist ink enhances the reliability and performance of the finished electronic product. It also protects the PCB from environmental damage such as moisture and contaminants, contributing to the longevity and durability of the electronic assemblies.
According to DIResearch's in-depth investigation and research, the global Solder Resist Ink market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.
The major global manufacturers of Solder Resist Ink include TAIYO, Nan Ya Plastics, TAMURA, Ajinomoto Fine-Techno, Shenzhen Rongda, Jiangsu Kuangshun, Showa Denko, Coants Electronic, HUNTSMAN etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.
This report studies the market size, price trends and future development prospects of Solder Resist Ink. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Solder Resist Ink market. The report data covers historical data from 2018 to 2023, based year in 2024 and forecast data from 2025 to 2030.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Solder Resist Ink market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Solder Resist Ink industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Solder Resist Ink Include:
TAIYO
Nan Ya Plastics
TAMURA
Ajinomoto Fine-Techno
Shenzhen Rongda
Jiangsu Kuangshun
Showa Denko
Coants Electronic
HUNTSMAN
Solder Resist Ink Product Segment Include:
Photoimageable Solder Resist Ink
Thermal Curable Solder Resist Ink
UV Curable Solder Resist Ink
Solder Resist Ink Product Application Include:
Computers
Communications
Consumer Electronics
IC Packaging
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global Solder Resist Ink Capacity and Production Analysis
Chapter 3: Global Solder Resist Ink Industry PESTEL Analysis
Chapter 4: Global Solder Resist Ink Industry Porter’s Five Forces Analysis
Chapter 5: Global Solder Resist Ink Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis
Chapter 6: Global Solder Resist Ink Market Size and Forecast by Type and Application Analysis
Chapter 7: North America Solder Resist Ink Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: Europe Solder Resist Ink Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: China Solder Resist Ink Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: APAC (Excl. China) Solder Resist Ink Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Latin America Solder Resist Ink Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Middle East and Africa Solder Resist Ink Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 13: Global Solder Resist Ink Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 14: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 15: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 16: Research Findings and Conclusion
Chapter 17: Methodology and Data Sources