Global Solder Competitive Landscape Professional Research Report 2024

Global Solder Competitive Landscape Professional Research Report 2024

Research Summary

Solder is a fusible metal alloy used to join together metal components or electronic circuits by melting it at a relatively low temperature and allowing it to solidify to form a strong, electrically conductive bond. The composition of solder typically includes a combination of tin and lead, although lead-free solders made of tin, silver, and copper are also widely used due to environmental and health concerns. Soldering is a common technique in electronics assembly, plumbing, and metalwork, where molten solder is applied to the joint between two workpieces using a soldering iron or soldering gun. As it cools and solidifies, solder forms a metallurgical bond between the components, ensuring electrical conductivity and mechanical strength. Soldering is essential in manufacturing electronic devices, repairing electrical connections, and creating watertight joints in plumbing applications, offering a reliable method for joining metals without the need for high temperatures that could damage the materials being joined.

According to DIResearch's in-depth investigation and research, the global Solder market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.

The major global manufacturers of Solder include Alpha Assembly Solutions, Senju Metal Industry, AIM Metals & Alloys, Qualitek International, KOKI, Indium Corporation, Balver Zinn, Heraeus, Nihon Superior, Nihon Handa, Nihon Almit, DKL Metals, Harima, Koki Products, Tamura Corp, PT TIMAH (Persero) Tbk, Hybrid Metals, Persang Alloy Industries, Yunnan Tin, Shenmao Technology, Yik Shing Tat Industrial, Anson Solder, Shengdao Tin, Hangzhou Youbang, Shaoxing Tianlong Tin Materials, Zhejiang Asia-welding, QLG, Tongfang Tech etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.

This report studies the market size, price trends and future development prospects of Solder. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Solder market. The report data covers historical data from 2018 to 2023, based year in 2024 and forecast data from 2025 to 2030.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Solder market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Solder industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Solder Include:

Alpha Assembly Solutions

Senju Metal Industry

AIM Metals & Alloys

Qualitek International

KOKI

Indium Corporation

Balver Zinn

Heraeus

Nihon Superior

Nihon Handa

Nihon Almit

DKL Metals

Harima

Koki Products

Tamura Corp

PT TIMAH (Persero) Tbk

Hybrid Metals

Persang Alloy Industries

Yunnan Tin

Shenmao Technology

Yik Shing Tat Industrial

Anson Solder

Shengdao Tin

Hangzhou Youbang

Shaoxing Tianlong Tin Materials

Zhejiang Asia-welding

QLG

Tongfang Tech

Solder Product Segment Include:

Solder Wires

Solder Bars

Solder Paste

Preformed Solder

Others

Solder Product Application Include:

Consumer Electronics Application

In-car Application

Industrial Application

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Solder Capacity and Production Analysis

Chapter 3: Global Solder Industry PESTEL Analysis

Chapter 4: Global Solder Industry Porter’s Five Forces Analysis

Chapter 5: Global Solder Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 6: Global Solder Market Size and Forecast by Type and Application Analysis

Chapter 7: North America Solder Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: Europe Solder Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: China Solder Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: APAC (Excl. China) Solder Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Latin America Solder Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Middle East and Africa Solder Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 13: Global Solder Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 14: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 15: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 16: Research Findings and Conclusion

Chapter 17: Methodology and Data Sources