Global Semiconductor Used High Purity Sputtering Target Material Competitive Landscape Professional Research Report 2024
Research Summary
Semiconductor used high purity sputtering target materials are specialized substances employed in the thin film deposition process within semiconductor manufacturing. These targets are typically composed of ultra-high purity metals or compounds such as silicon, aluminum, or various metal oxides, meticulously refined to eliminate impurities that could negatively impact semiconductor device performance. During sputtering, these materials are bombarded with high-energy ions in a vacuum chamber, causing atoms to dislodge and form a thin film on a substrate, enabling precise layering of materials critical for semiconductor device fabrication, including integrated circuits and solar cells, ensuring optimal electrical and physical properties essential for high-performance electronic components.
According to DIResearch's in-depth investigation and research, the global Semiconductor Used High Purity Sputtering Target Material market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.
The major global manufacturers of Semiconductor Used High Purity Sputtering Target Material include JX Nippon Mining & Metals Corporation, Materion, Konfoong Materials International, Linde, Plansee SE, Honeywell, TOSOH, TANAKA, ULVAC, Luvata, Hitachi Metals, Sumitomo Chemical, Longhua Technology Group, GRIKIN Advanced Material, Umicore, Angstrom Sciences, Advantec, Changzhou Sujing Electronic Material, FURAYA Metals Co., Ltd etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.
This report studies the market size, price trends and future development prospects of Semiconductor Used High Purity Sputtering Target Material. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Semiconductor Used High Purity Sputtering Target Material market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Semiconductor Used High Purity Sputtering Target Material market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Semiconductor Used High Purity Sputtering Target Material industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Semiconductor Used High Purity Sputtering Target Material Include:
JX Nippon Mining & Metals Corporation
Materion
Konfoong Materials International
Linde
Plansee SE
Honeywell
TOSOH
TANAKA
ULVAC
Luvata
Hitachi Metals
Sumitomo Chemical
Longhua Technology Group
GRIKIN Advanced Material
Umicore
Angstrom Sciences
Advantec
Changzhou Sujing Electronic Material
FURAYA Metals Co., Ltd
Semiconductor Used High Purity Sputtering Target Material Product Segment Include:
Metal Sputtering Target Material
Alloy Sputtering Target Material
Non-metal Sputtering Target Material
Semiconductor Used High Purity Sputtering Target Material Product Application Include:
Consumer Electronics
Vehicle Electronics
Communication Electronics
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global Semiconductor Used High Purity Sputtering Target Material Industry PESTEL Analysis
Chapter 3: Global Semiconductor Used High Purity Sputtering Target Material Industry Porter’s Five Forces Analysis
Chapter 4: Global Semiconductor Used High Purity Sputtering Target Material Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis
Chapter 5: Global Semiconductor Used High Purity Sputtering Target Material Market Size and Forecast by Type and Application Analysis
Chapter 6: North America Semiconductor Used High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe Semiconductor Used High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China Semiconductor Used High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) Semiconductor Used High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America Semiconductor Used High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa Semiconductor Used High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global Semiconductor Used High Purity Sputtering Target Material Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources