Global Printed Circuit Board (PCB) E-scrap Recycling Competitive Landscape Professional Research Report 2025

Research Summary

Printed Circuit Board (PCB) e-scrap recycling refers to the process of recovering valuable materials from electronic waste, specifically PCBs found in discarded electronic devices. PCBs contain various metals, including copper, gold, silver, and other precious and non-precious metals, as well as materials like fiberglass and solder. Recycling PCB e-scrap involves dismantling electronic devices, separating the PCBs, and then employing various techniques such as shredding, mechanical separation, and chemical processes to extract and refine the valuable metals. Recycling PCB e-scrap is crucial for both environmental and economic reasons, as it helps reduce electronic waste, prevents hazardous materials from ending up in landfills, and conserves valuable resources by reusing extracted metals in new manufacturing processes. The recycling of PCB e-scrap is a part of broader efforts to promote sustainable waste management practices in the electronics industry.

According to DIResearch's in-depth investigation and research, the global Printed Circuit Board (PCB) E-scrap Recycling market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.

The major global  manufacturers of Printed Circuit Board (PCB) E-scrap Recycling include Boliden, Umicore, Aurubis, Mitsubishi Materials Corporation, Asahi Holdings, Glencore, LS-Nikko Copper, Dowa Holdings, Mitsui Mining & Smelting, JX Nippon Mining & Metals, Korea Zinc etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Printed Circuit Board (PCB) E-scrap Recycling. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Printed Circuit Board (PCB) E-scrap Recycling market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Printed Circuit Board (PCB) E-scrap Recycling market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Printed Circuit Board (PCB) E-scrap Recycling industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Printed Circuit Board (PCB) E-scrap Recycling Include:

Boliden

Umicore

Aurubis

Mitsubishi Materials Corporation

Asahi Holdings

Glencore

LS-Nikko Copper

Dowa Holdings

Mitsui Mining & Smelting

JX Nippon Mining & Metals

Korea Zinc

Printed Circuit Board (PCB) E-scrap Recycling Product Segment Include:

Cadmium Recycling

Lead Recycling

Antimony Recycling

Nickel Recycling

Mercury Recycling

Other

Printed Circuit Board (PCB) E-scrap Recycling Product Application Include:

Consumer Electronics

Computer

Communications

Industrial/Medical

Automotive

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Printed Circuit Board (PCB) E-scrap Recycling Industry PESTEL Analysis

Chapter 3: Global Printed Circuit Board (PCB) E-scrap Recycling Industry Porter’s Five Forces Analysis

Chapter 4: Global Printed Circuit Board (PCB) E-scrap Recycling Major Regional Market Size and Forecast Analysis

Chapter 5: Global Printed Circuit Board (PCB) E-scrap Recycling Market Size and Forecast by Type and Application Analysis

Chapter 6: North America Passenger Printed Circuit Board (PCB) E-scrap Recycling Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe Printed Circuit Board (PCB) E-scrap Recycling Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China Printed Circuit Board (PCB) E-scrap Recycling Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) Printed Circuit Board (PCB) E-scrap Recycling Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America Printed Circuit Board (PCB) E-scrap Recycling Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa Printed Circuit Board (PCB) E-scrap Recycling Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global Printed Circuit Board (PCB) E-scrap Recycling Competitive Analysis of Key Manufacturers (Revenue, Market Share, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Revenue and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources