Global Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Competitive Landscape Professional Research Report 2025

Global Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Competitive Landscape Professional Research Report 2025

Research Summary

Plasma Enhanced Chemical Vapor Deposition (PECVD) systems are advanced thin-film deposition tools used in materials science and semiconductor manufacturing. These systems employ plasma technology to enhance the chemical vapor deposition process. During PECVD, a precursor gas is introduced into a vacuum chamber, and a plasma is generated to break down the gas molecules into reactive species. These species then react on the substrate surface, forming a thin film with desired properties. PECVD is widely used for depositing materials like silicon dioxide, silicon nitride, and amorphous silicon, crucial in the production of microelectronics, solar cells, and other semiconductor devices. PECVD systems offer precise control over film thickness, composition, and uniformity, making them integral in the fabrication of complex electronic components and thin-film coatings for various industrial applications.

According to DIResearch's in-depth investigation and research, the global Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.

The major global  manufacturers of Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems include Applied Materials, ASM International, Lam Research, Wonik IPS, Meyer Burger, Centrotherm, Tempress, Plasma-Therm, S.C New Energy Technology, Jusung Engineering, KLA-Tencor (Orbotech), ULVAC, Beijing NAURA, Shenyang Piotech, Oxford Instruments, SAMCO, CVD Equipment Corporation, Trion Technology, SENTECH Instruments, NANO-MASTER etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.  

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Include:

Applied Materials

ASM International

Lam Research

Wonik IPS

Meyer Burger

Centrotherm

Tempress

Plasma-Therm

S.C New Energy Technology

Jusung Engineering

KLA-Tencor (Orbotech)

ULVAC

Beijing NAURA

Shenyang Piotech

Oxford Instruments

SAMCO

CVD Equipment Corporation

Trion Technology

SENTECH Instruments

NANO-MASTER

Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Product Segment Include:

Parallel Plate Type PECVD Systems

Tube Type PECVD Systems

Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Product Application Include:

Semiconductor Industry

Solar Industry

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Industry PESTEL Analysis

Chapter 3: Global Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Industry Porter’s Five Forces Analysis

Chapter 4: Global Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 5: Global Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Market Size and Forecast by Type and Application Analysis

Chapter 6: North America Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global Plasma Enhanced Chemical Vapor Deposition (PEVCD) Systems Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources