Global Metal Sputtering Target Competitive Landscape Professional Research Report 2024

Global Metal Sputtering Target Competitive Landscape Professional Research Report 2024

Research Summary

Metal sputtering target is a specialized material used in the process of physical vapor deposition (PVD) or sputtering. It is a solid piece of metal, typically in the form of a disk or plate, that serves as a source for depositing a thin film onto a substrate. During sputtering, a high-energy plasma is generated and bombards the target material, causing atoms or ions to be ejected from the surface. These ejected particles then travel and condense onto a substrate, forming a thin film with the same composition as the target material. Metal sputtering targets are made from pure or alloyed metals, and the choice of material depends on the specific application and desired properties of the thin film. They are widely used in various industries, including electronics, semiconductors, optics, solar cells, and decorative coatings. The quality, purity, and uniformity of the sputtering target material are crucial factors in achieving high-quality thin films with the desired characteristics. Metal sputtering targets are available in different sizes, shapes, and compositions to meet the diverse requirements of different deposition processes and applications.

According to DIResearch's in-depth investigation and research, the global Metal Sputtering Target market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.

The major global manufacturers of Metal Sputtering Target include Materion (Heraeus), JX Nippon Mining & Metals Corporation, Praxair, Plansee SE, Hitachi Metals, Honeywell, Mitsui Mining & Smelting, Sumitomo Chemical, ULVAC, TOSOH, Ningbo Jiangfeng, Heesung, Luvata, Fujian Acetron New Materials, Changzhou Sujing Electronic Material, Luoyang Sifon Electronic Materials, GRIKIN Advanced Material, FURAYA Metals, Angstrom Sciences, Advantec, Umicore Thin Film Products etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.

This report studies the market size, price trends and future development prospects of Metal Sputtering Target. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Metal Sputtering Target market. The report data covers historical data from 2018 to 2023, based year in 2024 and forecast data from 2025 to 2030.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Metal Sputtering Target market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Metal Sputtering Target industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Metal Sputtering Target Include:

Materion (Heraeus)

JX Nippon Mining & Metals Corporation

Praxair

Plansee SE

Hitachi Metals

Honeywell

Mitsui Mining & Smelting

Sumitomo Chemical

ULVAC

TOSOH

Ningbo Jiangfeng

Heesung

Luvata

Fujian Acetron New Materials

Changzhou Sujing Electronic Material

Luoyang Sifon Electronic Materials

GRIKIN Advanced Material

FURAYA Metals

Angstrom Sciences

Advantec

Umicore Thin Film Products

Metal Sputtering Target Product Segment Include:

Metal Target

Alloy Target

Metal Sputtering Target Product Application Include:

Semiconductor

Solar Energy

Flat Panel Display

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Metal Sputtering Target Capacity and Production Analysis

Chapter 3: Global Metal Sputtering Target Industry PESTEL Analysis

Chapter 4: Global Metal Sputtering Target Industry Porter’s Five Forces Analysis

Chapter 5: Global Metal Sputtering Target Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 6: Global Metal Sputtering Target Market Size and Forecast by Type and Application Analysis

Chapter 7: North America Metal Sputtering Target Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: Europe Metal Sputtering Target Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: China Metal Sputtering Target Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: APAC (Excl. China) Metal Sputtering Target Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Latin America Metal Sputtering Target Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Middle East and Africa Metal Sputtering Target Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 13: Global Metal Sputtering Target Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 14: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 15: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 16: Research Findings and Conclusion

Chapter 17: Methodology and Data Sources