Global IC Advanced Packaging Equipment Competitive Landscape Professional Research Report 2024

Global IC Advanced Packaging Equipment Competitive Landscape Professional Research Report 2024

Research Summary

IC (Integrated Circuit) advanced packaging equipment refers to specialized machinery used in the semiconductor manufacturing process to encapsulate and assemble integrated circuits in a compact and efficient manner. This equipment is crucial for the final stage of IC fabrication, where the semiconductor die is mounted and connected within a protective package. Advanced packaging techniques include technologies like 3D stacking, wafer-level packaging, and system-in-package (SiP) to enhance performance, miniaturize components, and improve energy efficiency. IC advanced packaging equipment involves processes such as die bonding, wire bonding, encapsulation, and testing. These technologies play a vital role in meeting the demands of modern electronic devices for increased functionality and reduced form factor, enabling the production of more powerful and compact integrated circuits used in a wide range of applications.

According to DIResearch's in-depth investigation and research, the global IC Advanced Packaging Equipment market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.

The major global manufacturers of IC Advanced Packaging Equipment include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, Tokyo Seimitsu, BESI, Hitachi, Teradyne, Hanmi, Toray Engineering, Shinkawa, TOWA, COHU Semiconductor, SUSS Microtec etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.

This report studies the market size, price trends and future development prospects of IC Advanced Packaging Equipment. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global IC Advanced Packaging Equipment market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the IC Advanced Packaging Equipment market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of IC Advanced Packaging Equipment industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of IC Advanced Packaging Equipment Include:

ASM Pacific

Applied Material

Advantest

Kulicke&Soffa

DISCO

Tokyo Seimitsu

BESI

Hitachi

Teradyne

Hanmi

Toray Engineering

Shinkawa

TOWA

COHU Semiconductor

SUSS Microtec

IC Advanced Packaging Equipment Product Segment Include:

Cutting Equipment

Solid Crystal Devices

Welding Equipment

Testing Equipment

Other

IC Advanced Packaging Equipment Product Application Include:

Automotive Electronics

Consumer Electronics

Other

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global IC Advanced Packaging Equipment Industry PESTEL Analysis

Chapter 3: Global IC Advanced Packaging Equipment Industry Porter’s Five Forces Analysis

Chapter 4: Global IC Advanced Packaging Equipment Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 5: Global IC Advanced Packaging Equipment Market Size and Forecast by Type and Application Analysis

Chapter 6: North America IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global IC Advanced Packaging Equipment Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources