Global High Purity Sputtering Target Material Competitive Landscape Professional Research Report 2024
Research Summary
High Purity Sputtering Target Material refers to a specialized form of material used in the process of sputter deposition, a key technique in thin film deposition for electronics and semiconductor manufacturing. These sputtering targets are meticulously manufactured and purified to achieve an exceptionally high level of material purity. The targets are typically made of metals, alloys, or compounds like oxides or nitrides, and their high purity, often exceeding 99.99%, is crucial for producing thin films with precise and reliable characteristics. The sputtering process involves bombarding the target material with ions in a vacuum, causing atoms to be ejected and deposited onto a substrate, forming a thin film. High Purity Sputtering Target Materials are essential for ensuring uniform and high-quality thin films in the production of semiconductors, solar cells, and other electronic devices where the material's purity directly influences the performance and reliability of the final products.
According to DIResearch's in-depth investigation and research, the global High Purity Sputtering Target Material market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.
The major global manufacturers of High Purity Sputtering Target Material include Linde, Mitsui Mining & Smelting, JX Nippon Mining & Metals Corporation, Materion, Honeywell, Konfoong Materials International Co., Ltd, ULVAC, TOSOH, Luvata, Hitachi Metals, LT Metal, Sumitomo Chemical, Plansee SE, Fujian Acetron New Materials Co., Ltd, FURAYA Metals Co., Ltd, Luoyang Sifon Electronic Materials, Changzhou Sujing Electronic Material, GRIKIN Advanced Material Co., Ltd., Umicore, Advantec, Angstrom Sciences etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.
This report studies the market size, price trends and future development prospects of High Purity Sputtering Target Material. Focus on analysing the market share, product portfolio, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global High Purity Sputtering Target Material market. The report data covers historical data from 2019 to 2023, base year in 2024 and forecast data from 2025 to 2030.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the High Purity Sputtering Target Material market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of High Purity Sputtering Target Material industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of High Purity Sputtering Target Material Include:
Linde
Mitsui Mining & Smelting
JX Nippon Mining & Metals Corporation
Materion
Honeywell
Konfoong Materials International Co., Ltd
ULVAC
TOSOH
Luvata
Hitachi Metals
LT Metal
Sumitomo Chemical
Plansee SE
Fujian Acetron New Materials Co., Ltd
FURAYA Metals Co., Ltd
Luoyang Sifon Electronic Materials
Changzhou Sujing Electronic Material
GRIKIN Advanced Material Co., Ltd.
Umicore
Advantec
Angstrom Sciences
High Purity Sputtering Target Material Product Segment Include:
Metal Sputtering Target Material
Alloy Sputtering Target Material
Non-metal Sputtering Target Material
High Purity Sputtering Target Material Product Application Include:
Semiconductor
Solar Energy
Flat Panel Display
HDD
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global High Purity Sputtering Target Material Industry PESTEL Analysis
Chapter 3: Global High Purity Sputtering Target Material Industry Porter’s Five Forces Analysis
Chapter 4: Global High Purity Sputtering Target Material Major Regional Market Size and Forecast Analysis
Chapter 5: Global High Purity Sputtering Target Material Market Size and Forecast by Type and Application Analysis
Chapter 6: North America High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa High Purity Sputtering Target Material Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global High Purity Sputtering Target Material Competitive Analysis of Key Manufacturers (Revenue, Market Share, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Revenue and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources