Global Flexible Printed Circuit (FPC) Competitive Landscape Professional Research Report 2025

Research Summary

A flexible printed circuit (FPC), also known as flex circuit or flex PCB, is a type of electronic interconnect made of thin, flexible substrate materials such as polyimide or polyester. Unlike rigid PCBs, FPCs can be bent, folded, or twisted to fit into tight or irregular spaces within electronic devices. They consist of conductive traces, typically made of copper, patterned onto the flexible substrate using techniques such as etching or additive printing. FPCs offer several advantages including lightweight construction, high-density routing, and excellent resistance to vibration and mechanical stress. They are commonly used in applications where space constraints, weight reduction, or dynamic movement are critical, such as in smartphones, tablets, wearables, automotive electronics, medical devices, and aerospace systems. Additionally, FPCs facilitate simplified assembly processes and enable the creation of more compact and lightweight electronic products.

According to DIResearch's in-depth investigation and research, the global Flexible Printed Circuit (FPC) market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.

The major global  manufacturers of Flexible Printed Circuit (FPC) include Nippon Mektron, Suzhou Dongshan Precision, SEI, ZDT, Flexium, Fujikura, CAREER, SIFLEX, Bhflex, Interflex, Hongxin, Kinwong Electronic, ICHIA, AKM, Daeduck Electronics, JCD, Topsun, MFS, Netron Soft-Tech etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Flexible Printed Circuit (FPC). Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Flexible Printed Circuit (FPC) market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Flexible Printed Circuit (FPC) market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Flexible Printed Circuit (FPC) industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Flexible Printed Circuit (FPC) Include:

Nippon Mektron

Suzhou Dongshan Precision

SEI

ZDT

Flexium

Fujikura

CAREER

SIFLEX

Bhflex

Interflex

Hongxin

Kinwong Electronic

ICHIA

AKM

Daeduck Electronics

JCD

Topsun

MFS

Netron Soft-Tech

Flexible Printed Circuit (FPC) Product Segment Include:

Single-Layer Circuit

Double-Layer Circuit

Multi-Layer Circuit

Rigid-Flex Circuit

Flexible Printed Circuit (FPC) Product Application Include:

Consumer Electronics

Aerospace & Defense/Military

Medical

Automotive

Smart Phone

Laptop

Tablet

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Flexible Printed Circuit (FPC) Industry PESTEL Analysis

Chapter 3: Global Flexible Printed Circuit (FPC) Industry Porter’s Five Forces Analysis

Chapter 4: Global Flexible Printed Circuit (FPC) Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 5: Global Flexible Printed Circuit (FPC) Market Size and Forecast by Type and Application Analysis

Chapter 6: North America Flexible Printed Circuit (FPC) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe Flexible Printed Circuit (FPC) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China Flexible Printed Circuit (FPC) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) Flexible Printed Circuit (FPC) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America Flexible Printed Circuit (FPC) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa Flexible Printed Circuit (FPC) Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global Flexible Printed Circuit (FPC) Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources