Global Flexible Printed Circuit(FPC) Competitive Landscape Professional Research Report 2024

Global Flexible Printed Circuit（FPC） Competitive Landscape Professional Research Report 2024

Research Summary

FPC can stand for various terms, but one common meaning is Flexible Printed Circuit. A Flexible Printed Circuit (FPC) is a type of electronic circuit that is manufactured on a flexible and bendable substrate, typically made of polyimide or a similar flexible material. FPCs are used in applications where flexibility, space-saving, and lightweight design are critical factors. These circuits are often found in devices like smartphones, cameras, medical devices, and other electronics that require compact and bendable components. The flexibility of FPCs allows them to conform to the shape of the device, enabling more efficient use of space and enhanced durability. FPCs consist of a thin layer of conductive copper traces and insulation layers, allowing them to replace traditional rigid printed circuit boards in applications with specific design requirements.

According to DIResearch's in-depth investigation and research, the global Flexible Printed Circuit（FPC） market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.

The major global manufacturers of Flexible Printed Circuit（FPC） include ZDT, Fujikura, Nippon Mektron, SEI, Flexium, MFLEX, CAREER, SIFLEX, Interflex, Bhflex, KINWONG, Hongxin, ICHIA, Daeduck GDS, AKM, Multek, Topsun, JCD, MFS, Netron Soft-Tech etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.

This report studies the market size, price trends and future development prospects of Flexible Printed Circuit（FPC）. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Flexible Printed Circuit（FPC） market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Flexible Printed Circuit（FPC） market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Flexible Printed Circuit（FPC） industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Flexible Printed Circuit（FPC） Include:

ZDT

Fujikura

Nippon Mektron

SEI

Flexium

MFLEX

CAREER

SIFLEX

Interflex

Bhflex

KINWONG

Hongxin

ICHIA

Daeduck GDS

AKM

Multek

Topsun

JCD

MFS

Netron Soft-Tech

Flexible Printed Circuit（FPC） Product Segment Include:

Single-sided Circuit

Double-sided Circuit

Multi-layer Circuit

Rigid-Flex Circuit

Flexible Printed Circuit（FPC） Product Application Include:

Medical

Aerospace and Defense or Military

Consumer Electronics

Automotive

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Flexible Printed Circuit（FPC） Industry PESTEL Analysis

Chapter 3: Global Flexible Printed Circuit（FPC） Industry Porter’s Five Forces Analysis

Chapter 4: Global Flexible Printed Circuit（FPC） Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 5: Global Flexible Printed Circuit（FPC） Market Size and Forecast by Type and Application Analysis

Chapter 6: North America Flexible Printed Circuit（FPC） Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe Flexible Printed Circuit（FPC） Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China Flexible Printed Circuit（FPC） Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) Flexible Printed Circuit（FPC） Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America Flexible Printed Circuit（FPC） Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa Flexible Printed Circuit（FPC） Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global Flexible Printed Circuit（FPC） Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources