Global FC-BGA (ABF) Substrate Competitive Landscape Professional Research Report 2024

Global FC-BGA (ABF) Substrate Competitive Landscape Professional Research Report 2024

Research Summary

FC-BGA (Flip Chip Ball Grid Array) with ABF (Ajinomoto Build-up Film) substrate is an advanced packaging technology used in the semiconductor industry for electronic components and integrated circuits (ICs). It involves the combination of a Flip Chip interconnection technique with an ABF substrate. The FC-BGA package utilizes solder balls to directly connect the microelectronic die to the ABF substrate, eliminating the need for wire bonding. The ABF substrate, made of multiple layers of polyimide film with copper interconnects, provides electrical and mechanical support to the interconnects. This combination offers advantages such as high-density interconnections, improved electrical performance, reduced signal loss, and enhanced thermal dissipation. FC-BGA with ABF substrates is commonly used in applications that require high-speed signal transmission, compact size, and efficient thermal management, such as in advanced computing, mobile devices, networking equipment, and automotive electronics. It enables the production of smaller, faster, and more reliable electronic systems.

According to DIResearch's in-depth investigation and research, the global FC-BGA (ABF) Substrate market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.

The major global manufacturers of FC-BGA (ABF) Substrate include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, Daeduck Electronics, ASE Material, ACCESS, NCAP China, LG InnoTek, Shennan Circuit, Shenzhen Fastprint Circuit Tech etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.

This report studies the market size, price trends and future development prospects of FC-BGA (ABF) Substrate. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global FC-BGA (ABF) Substrate market. The report data covers historical data from 2018 to 2023, based year in 2024 and forecast data from 2025 to 2030.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the FC-BGA (ABF) Substrate market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of FC-BGA (ABF) Substrate industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.    

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of FC-BGA (ABF) Substrate Include:

Unimicron

Ibiden

Nan Ya PCB

Shinko Electric Industries

Kinsus Interconnect

AT&S

Semco

Kyocera

TOPPAN

Zhen Ding Technology

Daeduck Electronics

ASE Material

ACCESS

NCAP China

LG InnoTek

Shennan Circuit

Shenzhen Fastprint Circuit Tech

FC-BGA (ABF) Substrate Product Segment Include:

4-8 Layers ABF Substrate

8-16 Layers ABF Substrate

Others

FC-BGA (ABF) Substrate Product Application Include:

PCs

Server & Data Center

HPC/AI Chips

Communication

Others

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global FC-BGA (ABF) Substrate Capacity and Production Analysis

Chapter 3: Global FC-BGA (ABF) Substrate Industry PESTEL Analysis

Chapter 4: Global FC-BGA (ABF) Substrate Industry Porter’s Five Forces Analysis

Chapter 5: Global FC-BGA (ABF) Substrate Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 6: Global FC-BGA (ABF) Substrate Market Size and Forecast by Type and Application Analysis

Chapter 7: North America FC-BGA (ABF) Substrate Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: Europe FC-BGA (ABF) Substrate Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: China FC-BGA (ABF) Substrate Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: APAC (Excl. China) FC-BGA (ABF) Substrate Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Latin America FC-BGA (ABF) Substrate Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Middle East and Africa FC-BGA (ABF) Substrate Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 13: Global FC-BGA (ABF) Substrate Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 14: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 15: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 16: Research Findings and Conclusion

Chapter 17: Methodology and Data Sources