Global Epoxy Molding Compounds Competitive Landscape Professional Research Report 2025

Research Summary

Epoxy molding compounds (EMCs) are thermosetting materials used in the electronics industry for encapsulating and protecting semiconductor devices and integrated circuits. These compounds are typically composed of an epoxy resin, a hardener, and various additives. EMCs offer excellent electrical insulation, thermal conductivity, and protection against environmental factors, making them ideal for preventing moisture, dust, and mechanical damage to delicate electronic components. During the manufacturing process, EMCs are heated and molded around semiconductor chips, creating a protective and electrically insulating package. The properties of epoxy molding compounds can be tailored to meet specific requirements for different semiconductor applications, ensuring the reliable and long-lasting performance of electronic devices in a wide range of industries.

According to DIResearch's in-depth investigation and research, the global Epoxy Molding Compounds market size was valued at XX Million USD in 2024 and is projected to reach XX Million USD by 2032, with a CAGR of XX% (2025-2032). Notably, the China market has changed rapidly in the past few years. By 2024, China's market size is expected to be XX Million USD, representing approximately XX% of the global market share. By 2032, it is anticipated to grow further to XX Million USD, contributing XX% to the worldwide market share.

The major global  manufacturers of Epoxy Molding Compounds include Sumitomo Bakelite, Showa Denko, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu zhongpeng new material, Shin-Etsu Chemical, Nagase ChemteX Corporation, Tianjin Kaihua Insulating Material, HHCK, Beijing Sino-tech Electronic Material, Scienchem etc. The global players competition landscape in this report is divided into three tiers. The first tier comprises global leading enterprises that command a substantial market share, hold a dominant industry position, possess strong competitiveness and influence, and generate significant revenue. The second tier includes companies with a notable market presence and reputation; these firms actively follow industry leaders in product, service, or technological innovation and maintain a moderate revenue scale. The third tier consists of smaller companies with limited market share and lower brand recognition, primarily focused on local markets and generating comparatively lower revenue.

This report studies the market size, price trends and future development prospects of Epoxy Molding Compounds. Focus on analysing the market share, product portfolio, prices, sales, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Epoxy Molding Compounds market. The report data covers historical data from 2020 to 2024, based year in 2025 and forecast data from 2026 to 2032.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Epoxy Molding Compounds market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Epoxy Molding Compounds industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.  

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Epoxy Molding Compounds Include:

Sumitomo Bakelite

Showa Denko

Chang Chun Group

Hysol Huawei Electronics

Panasonic

Kyocera

KCC

Samsung SDI

Eternal Materials

Jiangsu zhongpeng new material

Shin-Etsu Chemical

Nagase ChemteX Corporation

Tianjin Kaihua Insulating Material

HHCK

Beijing Sino-tech Electronic Material

Scienchem

Epoxy Molding Compounds Product Segment Include:

Solid EMC

Liquid EMC

Epoxy Molding Compounds Product Application Include:

Memory

Non-memory

Discrete

Power Module

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Epoxy Molding Compounds Capacity and Production Analysis

Chapter 3: Global Epoxy Molding Compounds Industry PESTEL Analysis

Chapter 4: Global Epoxy Molding Compounds Industry Porter's Five Forces Analysis

Chapter 5: Global Epoxy Molding Compounds Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 6: Global Epoxy Molding Compounds Market Size and Forecast by Type and Application Analysis

Chapter 7: North America Epoxy Molding Compounds Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: Europe Epoxy Molding Compounds Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: China Epoxy Molding Compounds Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: APAC (Excl. China) Epoxy Molding Compounds Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Latin America Epoxy Molding Compounds Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Middle East and Africa Epoxy Molding Compounds Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 13: Global Epoxy Molding Compounds Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 14: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 15: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 16: Research Findings and Conclusion

Chapter 17: Methodology and Data Sources