Global Embedded Boards and Modules Competitive Landscape Professional Research Report 2024
Research Summary
Embedded boards and modules refer to specialized computing hardware components designed for integration into various electronic systems, devices, and applications. These components typically contain a microprocessor, memory, input/output interfaces, and other necessary circuitry to perform specific tasks or functions. Embedded boards are usually larger and more versatile, while modules are compact and designed for integration into custom applications. They play a pivotal role in enabling the intelligence and control of embedded systems, such as IoT devices, industrial automation, robotics, and consumer electronics, by providing the computational power and connectivity needed to execute specific functions. Embedded boards and modules are known for their reliability, durability, and customization options, making them essential in a wide range of industries where compact, dedicated computing solutions are required.
According to DIResearch's in-depth investigation and research, the global Embedded Boards and Modules market size will reach XX US$ Million in 2024, and is expected to reach XX US$ Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be XX US$ Million, accounting for approximately XX% of the world. It is expected to reach XX US$ Million in 2030, and the global share will reach XX%.
The major global manufacturers of Embedded Boards and Modules include Advantech, Kontron, Abaco, Artesyn Embedded (Advanced Energy), Curtiss Wright Controls, ADLINK, DFI, MSC Technologies, Congatec AG, Axiomtek Co., Ltd., Portwell, Radisys (Reliance Industries), Avalue Technology, Mercury Systems, IEI, Data Modul, AAEON, Digi International, Fastwel, ASRock, NEXCOM, ARBOR Technology, Fujitsu, EVOC Intelligent Technology Co., Ltd., BittWare (Molex), Eurotech, MiTAC, One Stop Systems, General Micro Sys, Trenton Systems, Premio Inc., B-PLUS GMBH, BCM, Corvalent, Variscite, Toradex, Phytec, Seco, TQ Systems, Garz & Fricke, BAODING FORLINX, Compulab, Avnet Integrated, Solidrun etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.
This report studies the market size, price trends and future development prospects of Embedded Boards and Modules. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Embedded Boards and Modules market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Embedded Boards and Modules market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Embedded Boards and Modules industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Embedded Boards and Modules Include:
Advantech
Kontron
Abaco
Artesyn Embedded (Advanced Energy)
Curtiss Wright Controls
ADLINK
DFI
MSC Technologies
Congatec AG
Axiomtek Co., Ltd.
Portwell
Radisys (Reliance Industries)
Avalue Technology
Mercury Systems
IEI
Data Modul
AAEON
Digi International
Fastwel
ASRock
NEXCOM
ARBOR Technology
Fujitsu
EVOC Intelligent Technology Co., Ltd.
BittWare (Molex)
Eurotech
MiTAC
One Stop Systems
General Micro Sys
Trenton Systems
Premio Inc.
B-PLUS GMBH
BCM
Corvalent
Variscite
Toradex
Phytec
Seco
TQ Systems
Garz & Fricke
BAODING FORLINX
Compulab
Avnet Integrated
Solidrun
Embedded Boards and Modules Product Segment Include:
ARM
X86
PowerPC
Others
Embedded Boards and Modules Product Application Include:
Defense & Aerospace
Communications
Medical
Automotive & Transport
Automations & Control
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global Embedded Boards and Modules Industry PESTEL Analysis
Chapter 3: Global Embedded Boards and Modules Industry Porter’s Five Forces Analysis
Chapter 4: Global Embedded Boards and Modules Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis
Chapter 5: Global Embedded Boards and Modules Market Size and Forecast by Type and Application Analysis
Chapter 6: North America Embedded Boards and Modules Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe Embedded Boards and Modules Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China Embedded Boards and Modules Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) Embedded Boards and Modules Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America Embedded Boards and Modules Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa Embedded Boards and Modules Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global Embedded Boards and Modules Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources